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公开(公告)号：JP2005026311A
公开(公告)日：2005-01-27
申请号：JP2003187584
申请日：2003-06-30
Inventor： TANAKA TORU
IPC: H01L21/60 , H01L21/301
CPC classification number: H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To enable to mount a semiconductor chip on a circuit board with high reliability in a flip chip mounting manner. SOLUTION: A semiconductor chip 1a is provided with a chip back protective layer 4 bonded on its back side through the intermediary of an adhesive layer 5, and is mounted on a circuit board 11 through the intermediary of solder bumps 9 formed on the surface of the circuit board 11 (Fig. (a)). The solder bumps 9 are melted by heating to bond the semiconductor chip 1a and the circuit board 11 together, and the adhesive layer 5 is softened to cover the side of the semiconductor chip 1a with the adhesive layer 5 (Fig. (b)). By this setup, the side and the rear surface of the semiconductor chip 1a are not required to be coated with chip coating resin, and the semiconductor chip 1a can be mounted with high reliability in a flip chip mounting manner. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract translation: 要解决的问题：为了能够以倒装芯片安装方式以高可靠性将半导体芯片安装在电路板上。 解决方案：半导体芯片1a具有通过粘合剂层5在其背面接合的芯片背部保护层4，并且通过中间形成在焊料凸块9上的焊料凸块9安装在电路板11上 电路板11的表面（图（a））。 通过加热使焊料凸块9熔融，将半导体芯片1a和电路基板11结合在一起，粘合层5软化，用粘接层5覆盖半导体芯片1a的一侧（图（b））。 通过这种设置，半导体芯片1a的侧表面和后表面不需要涂覆有芯片涂覆树脂，并且半导体芯片1a可以以倒装芯片安装方式安装在高可靠性上。 版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JP2005004826A
公开(公告)日：2005-01-06
申请号：JP2003164941
申请日：2003-06-10
Inventor： TANAKA TORU
CPC classification number: G11B7/1369 , G11B7/0932 , G11B7/0935 , G11B7/1392 , Y10T29/49037 , Y10T29/49121 , Y10T29/49158 , Y10T29/49172 , Y10T29/49176
Abstract: PROBLEM TO BE SOLVED: To provide a light pickup device, where a focus servo coil for axially moving an objective lens and a tracking servo coil for horizontally moving the objective lens are provided at the movable section of the light pickup device, a liquid crystal element is provided further, and power feed and the support of the movable section are simultaneously achieved when a refractive index is corrected by the liquid crystal element. SOLUTION: A sheet-like member 41 having four spring members 31-34 across an opening 43 is nearly parallel to a sheet-like member 42 having four spring members 35-38 at an opening 44 for arrangement in upper/lower directions. A fixing section 11 and the movable section 12 are molded by insertion molding on the sheet-like members 41, 42. Additionally, the objective lens 16, the focus servo coil 21, the tracking servo coils 22, 23, and the liquid crystal element 24 are mounted onto the movable section 12. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract translation: 要解决的问题：为了提供一种光拾取装置，其中用于轴向移动物镜的聚焦伺服线圈和用于水平移动物镜的跟踪伺服线圈设置在光拾取装置的可动部分， 进一步提供液晶元件，并且当通过液晶元件校正折射率时，同时实现供电和可动部分的支撑。 解决方案：具有穿过开口43的四个弹簧构件31-34的片状构件41几乎平行于在开口44处具有四个弹簧构件35-38的片状构件42，用于布置在上/下方向 。 固定部分11和可移动部分12通过插入模制成型在片状部件41,42上。此外，物镜16，聚焦伺服线圈21，跟踪伺服线圈22,23和液晶元件 24被安装在可移动部分12上。版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JP2004213710A
公开(公告)日：2004-07-29
申请号：JP2002378504
申请日：2002-12-26
Inventor： TANAKA TORU , KUBO TAKESHI
CPC classification number: G11B7/22 , G11B7/08582 , G11B7/0925
Abstract: PROBLEM TO BE SOLVED: To stably fix an electric wiring arranged inside a slide base at specified positions when the slide base is set up by coating an almost all circuit core materials having the function of the electric wiring with an exteror base material.
SOLUTION: The slide base 21 moved in almost parallel with an information recording surface consists of the circuit core material consisting of a conductor forming an electrical circuit for supplying the electricity to a biaxial actuator 24, the exterior base material 27b consisting of an insulator for coating the almost all surface of the circuit core material, and an external frame connected to the outside of the circuit core material and also cut off from the circuit core material after coating the circuit core material with the exterior base material 27b by an injection molding. On the external frame, two or more positioning holes are arranged for positioning to a metallic die for injection molding at the coating operation, then two or more positioning pins arranged on the metallic die are fitted into the two or more positioning holes so as to be integrally molded to the circuit core material in the state in which the circuit core material is positioned to the metallic die.
COPYRIGHT: (C)2004,JPO&NCIPI-
公开(公告)号：JP2004063938A
公开(公告)日：2004-02-26
申请号：JP2002222512
申请日：2002-07-31
Inventor： TANAKA TORU
CPC classification number: H01L24/96 , H01L2224/05554 , H01L2224/24227 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/3011
Abstract: PROBLEM TO BE SOLVED: To improve reliability and yield by effectively restraining generation of cracks in an interface between a chip component and a protective material covering it and in an area close to it. SOLUTION: The chip-like electronic component has the structure, wherein at least an electrode 5 is provided to one surface side of chip components 3, 3a, 3b, and almost the entire surface of the chip components 3, 3a, 3b other than the electrode surface thereof is covered by a continuous protective material (resin) 4. A chip-like electrode component 96, wherein reinforcing layers 80, 85 are applied to at least an interface 34 between the chip components 3, 3a, 3b and the protective material 4 in the electrode surface side, a pseudo-wafer 79, formed with reinforced plural chip components 3, 3a, 3b by the reinforcing layers 80, 85 and the chip-like electronic component 96, are connected and fixed to a mounting substrate 87. COPYRIGHT: (C)2004,JPO
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15.发明专利
公开(公告)号：JP2003223736A
公开(公告)日：2003-08-08
申请号：JP2002223989
申请日：2002-07-31
Applicant: SONY CORP
Inventor： FUKAZAWA YOSHIO , SUZUKI JUNICHI , TOYODA KIYOSHI , TANAKA TORU , KUBO TAKESHI , SAITO MASAHIRO , ISHII SATOSHI
Abstract: PROBLEM TO BE SOLVED: To improve productivity, reduce production cost, and improve reliabil ity of a focusing error signal. SOLUTION: An optical pickup device is provided with a 1st diffraction grating 45 for dividing an output light beam emitted from the light reception/ emission integral type element 31 into a zero order light beam and ± 1st order light beams, a 2nd diffraction grating 46 for diffracting the optical path of a returned light beam from an optical disk 2, and a 3rd diffraction grating 47 for diffracting a + 1st order light beam diffracted by the 2nd diffraction grating 46 by being disposed at the location where the 1st order light beam is entered to correct variations in an optical path, wherein the light reception/ emission integral type element 31 is disposed at the location where the - 1st order light beam diffracted by the 3rd diffraction grating 47 is entered and receives the - 1st order light beam to generate a focusing error signal FE and also receives the returned light beams from the optical disk 2 of ± 1st order light beams divided by the 1st diffraction grating 45 to generate a tracking error signal. COPYRIGHT: (C)2003,JPO
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Patent Agency Ranking
公开(公告)号：JP2002093830A
公开(公告)日：2002-03-29
申请号：JP2000279342
申请日：2000-09-14
Applicant: SONY CORP
Inventor： KANEMOTO AYUMI , TANAKA TORU , NISHIYAMA KAZUO
IPC: H01L21/66 , H01L21/301 , H01L21/56 , H01L23/12
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor chip that has high yield, is less expensive, and has appropriate packaging reliability by utilizing the features of wafer batch treatment, and to provide the manufacturing method of a pseudo-wafer. SOLUTION: The manufacturing method comprises a process for adhering a viscous substance 2, having mold release or solvent dissolution properties on a flat substrate 1; a process for fixing a plurality of conforming bare chips 3 or a plurality of types of conforming bare chips 3 on the viscous substance 2, while the Al electrode pad surface faces down, a process for depositing a resin 4 as a protective substance over the entire surface, including the part among the plurality of conforming bare chips 3; a process for separating the pseudo-wafer 5, where the plurality of or plurality of types of conforming bare chips 3 are stuck by a resin 4 from the substrate 1 after that, and for obtaining the pseudo-wafer 5, where a plurality of conforming semiconductor chips or a plurality of types of conforming semiconductor chips are arranged and the Al electrode pad surface is exposed; and further a process for separating each conforming chip part 26 by cutting the pseudo-wafer 5 at the position of the resin 4 among plurality of or plurality of types of semiconductor chips.
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公开(公告)号：JPH11145173A
公开(公告)日：1999-05-28
申请号：JP30600197
申请日：1997-11-07
Applicant: SONY CORP
Inventor： TANAKA TORU
IPC: H01L21/60
Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device for manufacturing a semiconductor device, having a bump the size of which is large and whose reliability is high at low cost, without leaving one part of a barrier metal layer. SOLUTION: A barrier metal layer 31a is formed on an electrode pad 30 which is formed on a substrate 10, and a surface protecting layer 21 having an opening in the electrode pad 30 region is formed on the substrate 10, and a metal layer 32a is formed so as to be embedded in the opening. Then, thermal processing for fusing the metallic layer 32a and for forming a bump 32 to be connected with the electrode pad 30 on the barrier metal layer 31a is conducted.
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公开(公告)号：JPH0982750A
公开(公告)日：1997-03-28
申请号：JP25569395
申请日：1995-09-07
Applicant: SONY CORP
Inventor： TANAKA TORU , NISHIYAMA KAZUO
IPC: H01L21/60 , H01L21/321
Abstract: PROBLEM TO BE SOLVED: To easily and clearly recognize the position of a semiconductor device visually by permitting the number or interconnection pattern or sizes of electrodes at one specific corner to be different from that at other corners. SOLUTION: The number or interconnection pattern or sizes of electrodes 2 at one specific corner 3 is permitted to be different from that at other corners 4. For example, bumps 2 are regularly arranged at uniform intervals on the outer circumference or the inner side of the chip of a semiconductor substrate 1. On one specific corner 3 of such an air bump chip, an electrode pad 2 which is present at other three corners 4 is not present, and in this point the arrangement is permitted to be irregular. Thus, one specific corner 3 is visually recognized, and the direction of the semiconductor device can be easily and clearly recognized.
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公开(公告)号：JPH0250366A
公开(公告)日：1990-02-20
申请号：JP20110188
申请日：1988-08-12
Applicant: SONY CORP
Inventor： TANAKA TORU , OTA KEIICHI , OSATO MAMORU
IPC: G11B21/08
Abstract: PURPOSE:To contrive the thinning of a device by housing a scale to detect the position of a head arm, a light emitting element and a light receiving element in the range of the fitting height of the head arm in a sealing case. CONSTITUTION:A head arm 6 is freely-rockably attached to the outer periphery of a rocking central shaft 7 fixed on a bottom part 1a of a hermetically sealing case 1. Further, by using the outer peripheral space of the rocking central shaft 7, a scale 20 is attached to the bottom part of a head arm 6, a light emitting element 22 and a light receiving element 23 are arranged in the upper and lower spaces of the scale 20, and the scale 20, the light emitting element 22 and the light receiving element 23 are housed in the range of the fitting height of the head arm 6 in the sealing case 1. Thus, the device can be made thinner.
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公开(公告)号：JP2014191063A
公开(公告)日：2014-10-06
申请号：JP2013064461
申请日：2013-03-26
Inventor： NAKAMURA HAJIME , TAKEI TOMOYA , EDAMITSU TOSHIAKI , MAEDA MASARU , NAITO TSUTOMU , TANAKA TORU
IPC: G02B7/04
CPC classification number: G02B7/023
Abstract: PROBLEM TO BE SOLVED: To solve a problem that when a machine screw and a compression spring are used for a driver, time for assembling the driver using the machine screw and the compression spring is required.SOLUTION: The driver includes: a moving unit 10 which is provided with an engagement holder 20 and has a driven part 17 formed with an insertion portion 21 opened at least at one side and an element holder 16 for holding an optical element; a piezoelectric driver 8 having a piezoelectric element 13 that expands and contracts by a voltage applied, a drive shaft 14 which moves in an expansion/contraction direction of the piezoelectric element being driven by the expansion/contraction of the piezoelectric element to move the moving unit, and a drive shaft inserted in an insertion portion; and a leaf spring 9 inserted in the insertion portion and held by the moving unit to press the drive shaft against the driven part. In a state that the leaf spring is inserted in the insertion portion, when the drive shaft is inserted into the insertion portion, the leaf spring is elastically deformed within the insertion portion, and the drive shaft is pressed against the driven part by the leaf spring and the leaf spring is engaged with the engagement holder. Thus, the drive shaft is held by the moving unit without using any special holding member such as machine screw and compression spring.
Abstract translation: 要解决的问题为了解决将机器螺钉和压缩弹簧用于驾驶员的问题，需要使用机械螺丝和压缩弹簧组装驾驶员的时间。解决方案：驾驶员包括：移动单元10 其具有接合保持器20，并且具有形成有至少在一侧开口的插入部21和用于保持光学元件的元件保持器16的从动部17; 具有压电元件13的压电驱动器8，压电元件13通过施加的电压而膨胀和收缩;驱动轴14，其以压电元件的膨胀/收缩驱动的压电元件的伸缩方向移动，以移动移动单元 以及插入到插入部中的驱动轴; 以及插入在插入部中并被移动单元保持以将驱动轴压靠在被驱动部上的板簧9。 在板簧插入插入部的状态下，当驱动轴插入插入部时，板簧在插入部内弹性变形，驱动轴被片簧 并且板簧与接合保持器接合。 因此，驱动轴由移动单元保持，而不使用诸如机械螺丝和压缩弹簧的特殊保持构件。
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