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公开(公告)号:FR2880200A1
公开(公告)日:2006-06-30
申请号:FR0453228
申请日:2004-12-24
Applicant: ST MICROELECTRONICS SA
Inventor: ROY MATHIEU , PIERRE FABIEN
Abstract: L'invention concerne une plaquette mince comprenant des trous traversants remplis au moins partiellement de nanotubes de carbone conducteurs orientés généralement transversalement à la plaquette. L'invention s'applique à une cellule de pile à combustible comprenant, dans une plaquette mince (20), un trou traversant rempli d'un électrolyte (24 ; 25) entouré de barrières de nanotubes de carbone (22, 26 ; 23, 27) orientés généralement transversalement à la plaquette.
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公开(公告)号:FR2830127A1
公开(公告)日:2003-03-28
申请号:FR0112197
申请日:2001-09-21
Applicant: ST MICROELECTRONICS SA
Inventor: ROY MATHIEU
IPC: H01L29/747 , H01L29/147
Abstract: The isolated gates (46,49) of the isolated gate bipolar transistors are formed on upper and lower surface sides of semiconductor substrate (40). The isolated gate (49) is connected to conductive sink (55) crossing the substrate region from the lower surface to the upper surface. The sink is connected to a gate contact (G2) which is formed on the upper surface side of the substrate.
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公开(公告)号:FR2803101A1
公开(公告)日:2001-06-29
申请号:FR9916487
申请日:1999-12-24
Applicant: ST MICROELECTRONICS SA
Inventor: ROY MATHIEU
IPC: H01L21/332 , H01L21/225 , H01L21/331 , H01L21/76 , H01L21/761 , H01L29/06 , H01L29/08 , H01L29/10 , H01L29/74 , H01L29/78 , H01L21/48
Abstract: A method for manufacturing a vertical power component on a substrate formed of a lightly-doped silicon wafer, including the steps of boring on the lower surface side of the substrate a succession of holes perpendicular to this surface; diffusing a dopant from the holes, of a second conductivity type opposite to that of the substrate; and boring similar holes on the upper surface side of the substrate to define an isolating wall and diffuse from these holes a dopant of the second conductivity type with a high doping level, the holes corresponding to the isolating wall being sufficiently close for the diffused areas to join laterally and vertically.
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公开(公告)号:FR2784801A1
公开(公告)日:2000-04-21
申请号:FR9813219
申请日:1998-10-19
Applicant: ST MICROELECTRONICS SA
Inventor: ROY MATHIEU
IPC: H01L29/06 , H01L29/40 , H01L29/861 , H01L29/36 , H01L21/761
Abstract: The power component comprises an n-type silicon substrate (1) bounded by a p-type barrier (2) in connection with the first p-type region (3), the second p-type region (4), a strip conductor (L) extending over the substrate from the second region (4) to the barrier (2), the third region (22) of strongly doped n-type midway between the exterior periphery of the second region and the interior periphery of the barrier. The third region (22) is in contact with the field plate (21) which extends in the directions of the barrier and the second region. The high voltage is sustained between the first and the second regions, on the upper side by the junction between the second region and the substrate, and the junction between the barrier and the substrate. The strip conductor (L) is at a higher potential. The field plate (21) extends over the third region (22) over a distance greater than 10 microns m. The second region (4) includes a ring (6) of weakly doped p-type. The width of the field plate is at least that of the strip conductor, and the length extends over the third region in both directions of the barrier and the second region.
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公开(公告)号:FR2895573A1
公开(公告)日:2007-06-29
申请号:FR0554104
申请日:2005-12-27
Applicant: ST MICROELECTRONICS SA
Inventor: ROY MATHIEU , PIERRE FABIEN
Abstract: L'invention concerne une pile à combustible dont l'empilement actif (5, 6, 7) repose sur une couche conductrice mince (29), s'appuyant sur une plaque (21) munie de canaux transversaux d'arrivée de gaz (25), la couche conductrice mince faisant saillie dans l'empilement actif au regard de chaque canal et étant transparente audit gaz.
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公开(公告)号:FR2803101B1
公开(公告)日:2002-04-12
申请号:FR9916487
申请日:1999-12-24
Applicant: ST MICROELECTRONICS SA
Inventor: ROY MATHIEU
IPC: H01L21/332 , H01L21/225 , H01L21/331 , H01L21/76 , H01L21/761 , H01L29/06 , H01L29/08 , H01L29/10 , H01L29/74 , H01L29/78 , H01L21/48
Abstract: A method for manufacturing a vertical power component on a substrate formed of a lightly-doped silicon wafer, including the steps of boring on the lower surface side of the substrate a succession of holes perpendicular to this surface; diffusing a dopant from the holes, of a second conductivity type opposite to that of the substrate; and boring similar holes on the upper surface side of the substrate to define an isolating wall and diffuse from these holes a dopant of the second conductivity type with a high doping level, the holes corresponding to the isolating wall being sufficiently close for the diffused areas to join laterally and vertically.
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公开(公告)号:FR2784801B1
公开(公告)日:2000-12-22
申请号:FR9813219
申请日:1998-10-19
Applicant: ST MICROELECTRONICS SA
Inventor: ROY MATHIEU
IPC: H01L29/06 , H01L29/40 , H01L29/861 , H01L29/36 , H01L21/761
Abstract: The power component comprises an n-type silicon substrate (1) bounded by a p-type barrier (2) in connection with the first p-type region (3), the second p-type region (4), a strip conductor (L) extending over the substrate from the second region (4) to the barrier (2), the third region (22) of strongly doped n-type midway between the exterior periphery of the second region and the interior periphery of the barrier. The third region (22) is in contact with the field plate (21) which extends in the directions of the barrier and the second region. The high voltage is sustained between the first and the second regions, on the upper side by the junction between the second region and the substrate, and the junction between the barrier and the substrate. The strip conductor (L) is at a higher potential. The field plate (21) extends over the third region (22) over a distance greater than 10 microns m. The second region (4) includes a ring (6) of weakly doped p-type. The width of the field plate is at least that of the strip conductor, and the length extends over the third region in both directions of the barrier and the second region.
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公开(公告)号:FR2788166A1
公开(公告)日:2000-07-07
申请号:FR9816771
申请日:1998-12-31
Applicant: ST MICROELECTRONICS SA
Inventor: JALADE JEAN , SANCHEZ JEAN LOUIS , LAUR JEAN PIERRE , BREIL MARIE , AUSTIN PATRICK , BERNIER ERIC , ROY MATHIEU
IPC: H01L29/74 , H01L21/822 , H01L27/04 , H01L27/06 , H01L29/739 , H01L29/78 , H01L27/07 , H02M1/00 , H03K17/567
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公开(公告)号:FR2894075A1
公开(公告)日:2007-06-01
申请号:FR0553634
申请日:2005-11-30
Applicant: ST MICROELECTRONICS SA
Inventor: PIERRE FABIEN , ROY MATHIEU
Abstract: L'invention concerne une plaque support de cellule de pile à combustible constituée d'une plaquette de silicium (21) ayant une face avant portant la partie active de la cellule en regard de laquelle est percée une multitude de canaux transverses (23). La face arrière de la plaquette est munie d'un évidement (22) en regard de la région perforée.
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公开(公告)号:FR2830127B1
公开(公告)日:2004-12-24
申请号:FR0112197
申请日:2001-09-21
Applicant: ST MICROELECTRONICS SA
Inventor: ROY MATHIEU
IPC: H01L29/747 , H01L29/147
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