公开(公告)号：DE69518973T2

公开(公告)日：2001-02-22

申请号：DE69518973

申请日：1995-05-19

Applicant: ST MICROELECTRONICS SRL

Inventor： CHRAPPAN SOLDAVINI FRANCESCO ,  SALINA ALBERTO

IPC: H01L21/60 ,  H01L21/66 ,  H01L21/822 ,  G01R31/02 ,  H01L23/482 ,  H01L23/528 ,  H01L27/04 ,  H01L21/00

Abstract: A device presenting split contact pad portions (31a, 31b, 32a, 32b, 33a, 33b, 34a, 34b), one for each multiple bonding wire (44a, 44b), and metal connecting strips, the end portion (37a, 37b, 38a, 38b, 39a, 39b, 40a, 40b) of which is also split into parallel strip segments, each connected to a respective contact pad, so as to form a plurality of parallel current paths between an externally connected node (22-25) and the contact pin (27-30). When current is supplied (59) along the connecting strip, therefore, this produces a voltage drop along each segment connected to a sound bonding wire, but not along the segments connected to broken or nonbonded wires; and by determining (50) the existence of a voltage difference between the contact pad portions, it is possible to detect the interruption of one or more of the bonding wires.

公开(公告)号：DE69518973D1

公开(公告)日：2000-11-02

申请号：DE69518973

申请日：1995-05-19

Applicant: ST MICROELECTRONICS SRL

Inventor： CHRAPPAN SOLDAVINI FRANCESCO ,  SALINA ALBERTO

IPC: H01L21/60 ,  H01L21/66 ,  H01L21/822 ,  G01R31/02 ,  H01L23/482 ,  H01L23/528 ,  H01L27/04 ,  H01L21/00

Abstract: A device presenting split contact pad portions (31a, 31b, 32a, 32b, 33a, 33b, 34a, 34b), one for each multiple bonding wire (44a, 44b), and metal connecting strips, the end portion (37a, 37b, 38a, 38b, 39a, 39b, 40a, 40b) of which is also split into parallel strip segments, each connected to a respective contact pad, so as to form a plurality of parallel current paths between an externally connected node (22-25) and the contact pin (27-30). When current is supplied (59) along the connecting strip, therefore, this produces a voltage drop along each segment connected to a sound bonding wire, but not along the segments connected to broken or nonbonded wires; and by determining (50) the existence of a voltage difference between the contact pad portions, it is possible to detect the interruption of one or more of the bonding wires.

公开(公告)号：DE69414820T2

公开(公告)日：1999-04-15

申请号：DE69414820

申请日：1994-02-28

Applicant: ST MICROELECTRONICS SRL

Inventor： CHRAPPAN FRANCESCO ,  NESSI MAURIZIO ,  SALINA ALBERTO

IPC: H03F3/20 ,  H02P25/034 ,  H03F1/32 ,  H03F3/30 ,  H03F3/347

Abstract: The operation of externally connected output power transistors of a class AB amplifier is controlled without employing any external sensing resistance of the output current by driving an externally connected power transistor through a level shifting buffer and employing a limiting network composed of an integrated transistor driven by the output of a signal amplifying stage and a resistance connected in series with its drain. The buffer stage shifts the level of the driving signal of the external power transistor by a value equal to the threshold voltage of the integrated transistor of the limiting network thus ensuring the turn-off of the external power transistor under quiescent conditions.