公开(公告)号：WO2007136928A3

公开(公告)日：2008-05-02

申请号：PCT/US2007065009

申请日：2007-03-27

Applicant: STAKTEK GROUP LP ,  WEHRLY JAMES DOUGLAS JR ,  SZEWERENKO LELAND ,  HASKELL BERT

Inventor： WEHRLY JAMES DOUGLAS JR ,  SZEWERENKO LELAND ,  HASKELL BERT

IPC: G06F12/00 ,  H01L21/70 ,  H01L23/02 ,  H01L25/00

CPC classification number: G11C5/04 ,  H01L23/13 ,  H01L23/5387 ,  H01L23/5388 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A system and method for combining at least two semiconductor die (12, 12FC, 14, 14FC) using multi-layer flex circuitry is provided. A first semiconductor die (12, 12FC) is attached and preferably electrically connected to a first layer of the flex circuitry (20) while a second semiconductor die (14, 14FC) is set, at least in part, into a window (FW) that extends into the flex circuitry (20) to expose a layer of the flex to which the second die (14, 14FC) is attached. When the second semiconductor die (14, 14FC) is a flip-chip device, it is connected through its contacts to the layer of flex exposed in the window and when it is a die with its contact side oriented away from the flex circuitry (20), it is preferably electrically connected with wire bonds to another conductive layer of the flex circuitry (20).

Abstract translation: 提供了一种使用多层柔性电路组合至少两个半导体管芯（12,12FC，14,14FC）的系统和方法。 第一半导体管芯（12,12FC）被附接并且优选地电连接到柔性电路（20）的第一层，而第二半导体管芯（14,14FC）至少部分地被设置到窗口（FW）中， 其延伸到柔性电路（20）中以暴露第二管芯（14,14FC）附接到的柔性层。 当第二半导体管芯（14,14FC）是倒装芯片器件时，其通过其触点连接到暴露在窗口中的柔性层，并且当其是其接触侧定向远离柔性电路（20 ），其优选地与引线键合电连接到柔性电路（20）的另一导电层。

公开(公告)号：WO2006121487A3

公开(公告)日：2007-11-22

申请号：PCT/US2006007004

申请日：2006-02-28

Applicant: STAKTEK GROUP LP ,  WEHRLY JAMES DOUGLAS JR ,  WILDER JAMES ,  WOLFE MARK ,  GOODWIN PAUL

Inventor： WEHRLY JAMES DOUGLAS JR ,  WILDER JAMES ,  WOLFE MARK ,  GOODWIN PAUL

IPC: H01L23/34

CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

Abstract: Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. The populated flexible circuitry is disposed about an edge of a rigid substrate preferably devised from thermally-conductive materials and one or more thermal spreaders are disposed in thermal contact with at least some of the constituent integrated circuitry of the module. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.

Abstract translation: 灵活的电路装有沿主要侧面或两侧设置的集成电路（IC）。 触点沿柔性电路分布，以提供模块与应用环境之间的连接。 填充的柔性电路围绕刚性衬底的边缘设置，优选地由导热材料设计，并且一个或多个散热器布置成与模块的组成集成电路中的至少一些热接触。 可选地，作为附加的热管理特征，模块可以包括设置在较高热能IC器件附近的高导热性散热器或区域。 在优选实施例中，来自衬底主体或衬底芯的延伸部促进模块的IC之间的热变化减小，同时提供用于从模块中排出热能的放大表面。

公开(公告)号：WO2006121486A3

公开(公告)日：2007-07-26

申请号：PCT/US2006006921

申请日：2006-02-28

Applicant: STAKTEK GROUP LP ,  WEHRLY JAMES DOUGLAS JR ,  WILDER JAMES ,  GOODWIN PAUL ,  WOLFE MARK

Inventor： WEHRLY JAMES DOUGLAS JR ,  WILDER JAMES ,  GOODWIN PAUL ,  WOLFE MARK

IPC: H05K1/14

CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

Abstract translation: 灵活的电路装有集成电路，沿其主要一侧或两侧布置。 沿柔性电路分布的触点提供模块与应用环境之间的连接。 电路填充的柔性电路围绕刚性衬底的边缘设置，优选地由导热材料设计，并且包括当柔性电路产生时设置在较高热能装置（例如AMB）附近的高导热性芯或区域 底物。 其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。 来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

公开(公告)号：WO2006028643A3

公开(公告)日：2006-11-30

申请号：PCT/US2005028547

申请日：2005-08-10

Applicant: STAKTEK GROUP LP ,  GOODWIN PAUL ,  CADY JAMES ,  WEHRLY JAMES DOUGLAS JR

Inventor： GOODWIN PAUL ,  CADY JAMES ,  WEHRLY JAMES DOUGLAS JR

IPC: H05K7/20 ,  G11C5/00 ,  H01L25/10 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/189 ,  G11C5/04 ,  H01L25/105 ,  H01L2224/16 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2224/0401

Abstract: Flexible circuitry (12) is populated with integrated circuits (18), (ICs) disposed along one or both of its major sides. Contacts (20) distributed along the flexible circuitry provide connection to the ICs. Preferably, the flexible circuitry is disposed about an edge of a rigid, thermally-conductive substrate (14) thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. In alternative, but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may remove substrate material to reduce module profile. In preferred embodiments, the contacts distributed along the flexible circuitry are configured for insertion into an edge connector socket such as those found in general purpose and server computers. Preferred substrates are comprised of thermally conductive material. Extensions from the substrate in preferred embodiments can be expected to reduce thermal module loading and encourage reduced thermal variations amongst the integrated circuits of the module during operation.

Abstract translation: 柔性电路（12）中装有集成电路（18），（IC），沿其主要侧面或其两侧设置。 沿柔性电路分布的触点（20）提供与IC的连接。 优选地，柔性电路围绕刚性的导热基板（14）的边缘设置，从而将集成电路放置在基板的一侧或两侧上，在该基板的一侧或两侧上具有一层或两层集成电路 。 在替代方案中，也是优选实施例中，最靠近基板的柔性电路侧的IC至少部分地设置在基板中的窗口，凹穴或切口区域中。 其他实施例可以仅填充柔性电路的一侧或者可以移除衬底材料以减少模块轮廓。 在优选实施例中，沿着柔性电路分布的触点被配置为插入到诸如在通用和服务器计算机中找到的边缘连接器插座中。 优选的衬底由导热材料构成。 预期在优选实施例中，来自衬底的延伸可以减少热模块负载并且促进在操作期间模块的集成电路之间的热变化减小。