Abstract:
A low voltage isolation circuit (1) is described inserted between an input terminal (HVout) suitable for receiving a high voltage signal (IM) and an output terminal (pzt) suitable for transmitting the high voltage signal (IM) to a load (PZ) of the type comprising at least one driving block (5) inserted between a first and a second voltage reference (Vss, -Vss) and comprising a first driving transistor (Ml), inserted between the first voltage reference (Vss) and a first driving central circuit node (Xc) and a second driving transistor (M2), in turn inserted between the driving central circuit node (Xc) and the second supply voltage reference (-Vss) as well as an isolation block (8) connected to the connection terminal (pzt), to the input terminal (HVout) and, through a protection block (9) comprising a first and a second protection transistor (MD1, MD2), being in anti-series to each other and having control terminals receiving respective complementary protection driving signals (dr1, dr2), to the driving central circuit node (Xc), the isolation block (8) comprising at least one voltage limiter block (6), a diode block (7) and a control transistor (MD), in turn connected across the diode block (7) between the input (HVout) and output (pzt) terminals of the low voltage isolation switch (1) and having a control terminal (XD) connected to the driving central circuit node (Xc) through the protection block (9), said diode block (7) comprising at least one first and one second transmission diode (DN1, DN2), connected in antiparallel, i.e. by having an anode terminal of said first diode connected to a cathode terminal of said second diode and vice versa.
Abstract:
The invention relates to a High Voltage switch configuration (10) having an input terminal (IN) which receives an input signal (Vin) to drive a load and an output terminal (OUT) which issues an output signal (Vout) to the load. Advantageously according to the invention, the High Voltage switch configuration ( 10) comprises at least a first and a second diode (D1, D2), being placed in antiseries between said input and output terminals (IN, OUT) and having a pair of corresponding terminals in common, in correspondence of a first internal circuit node (Xc1).
Abstract:
In a pressure sensor (15) with double measuring scale: a monolithic body (16) of semiconductor material has a first main surface (16a), a bulk region (17) and a sensitive portion (33) upon which pressure (P) acts; a cavity (18) is formed in the monolithic body (16) and is separated from the first main surface (16a) by a membrane (19), which is flexible and deformable as a function of the pressure (P), and is arranged inside the sensitive portion (33) and is surrounded by the bulk region (17); a low-pressure detecting element (28) of the piezoresistive type, sensitive to first values of pressure (P), is integrated in the membrane (19) and has a variable resistance as a function of the deformation of the membrane (19); in addition, a high-pressure detecting element (29), also of a piezoresistive type, is formed in the bulk region (17) inside the sensitive portion (33) and has a variable resistance as a function of the pressure (P). The highpressure detecting element (29) is sensitive to second values of pressure (P).
Abstract:
An envelope detector (50) having an envelope extracting portion (51) and a temperature compensating portion (52). The envelope extracting portion (51) has a first extraction transistor (13) and a second extraction transistor (14) coupled at an intermediate node (17). The first extraction transistor (13) has a first current conduction terminal coupled to a first connection node (16); a second current conduction terminal coupled to the intermediate node (17); and a control terminal coupled to the signal input node (23) and to a biasing node (24). The second extraction transistor (14) has a first current conduction terminal coupled to the intermediate node (17); a second current conduction terminal coupled to a second connection node (19); and a control terminal coupled to the biasing node (24). The temperature compensating portion (52) has a first temperature compensating transistor (58) that is diode-connected and coupled between a compensation output node (65) and the second connection node (19). The second connection node (19) is coupled to the compensation output node (65) and the first connection node (16) is coupled to a detector output (21).
Abstract:
In an embodiment, a programmable-gain amplifier includes: two complementary cross-coupled transistor (e.g. MOS) pairs (M n-a , M n-b ; M p-a , M p-b ) mutually coupled with each transistor in one pair (M n-a resp. M n-b ) having a current flow path cascaded with a current flow path of a respective one of the transistors in the other pair (M p-a resp. M p-b ) to provide first (A) and second (B) coupling points between said complementary cross-coupled transistor pairs (M n-a , M n-b ; M p-a , M p-b ); first (C a ) and second (C b ) sampling capacitors set between the first (A) and second (B) coupling points, respectively, and ground; first (10) and second (12) input stages having input terminals for receiving input signals (V in- , V in+ ) for sampling by the first (C a ) and second (C b ) sampling capacitors. Switching means (201 to 206; 301, 302) are provided for: - i) coupling the first (10) and second (12) input stages to the first (C a ) and second (C b ) sampling capacitors, whereby the input signals (V in- , V in+ ) are sampled as sampled signals (V out+ , V out- ) on said first (C a ) and second (C b ) sampling capacitors, and - ii) energizing (V dd ) the complementary cross-coupled transistor pairs (M n-a , M n-b ; M p-a , M p-b ) whereby the signals (V out+ , V out- ) sampled on the first (C a ) and second (C b ) sampling capacitors undergo negative resistance regeneration growing exponentially over time, thereby providing an exponential amplifier gain.
Abstract:
In an embodiment, a programmable-gain amplifier includes: two complementary cross-coupled transistor (e.g. MOS) pairs (M n-a , M n-b ; M p-a , M p-b ) mutually coupled with each transistor in one pair (M n-a resp. M n-b ) having a current flow path cascaded with a current flow path of a respective one of the transistors in the other pair (M p-a resp. M p-b ) to provide first (A) and second (B) coupling points between said complementary cross-coupled transistor pairs (M n-a , M n-b ; M p-a , M p-b ); first (C a ) and second (C b ) sampling capacitors set between the first (A) and second (B) coupling points, respectively, and ground; first (10) and second (12) input stages having input terminals for receiving input signals (V in- , V in+ ) for sampling by the first (C a ) and second (C b ) sampling capacitors. Switching means (201 to 206; 301, 302) are provided for: - i) coupling the first (10) and second (12) input stages to the first (C a ) and second (C b ) sampling capacitors, whereby the input signals (V in- , V in+ ) are sampled as sampled signals (V out+ , V out- ) on said first (C a ) and second (C b ) sampling capacitors, and - ii) energizing (V dd ) the complementary cross-coupled transistor pairs (M n-a , M n-b ; M p-a , M p-b ) whereby the signals (V out+ , V out- ) sampled on the first (C a ) and second (C b ) sampling capacitors undergo negative resistance regeneration growing exponentially over time, thereby providing an exponential amplifier gain.
Abstract:
An electrostatic micromotor (10') is provided with a fixed substrate (12), a mobile substrate (13) facing the fixed substrate (12), and electrostatic-interaction elements (14, 15, 17) enabling a relative movement of the mobile substrate (3) with respect to the fixed substrate (2) in a movement direction (x); the electrostatic micromotor is also provided with a capacitive position-sensing structure (18') configured to enable sensing of a relative position of the mobile substrate (13) with respect to the fixed substrate (12) in the movement direction (x). The capacitive position-sensing structure (18') is formed by at least one sensing indentation (22), extending within the mobile substrate (13) from a first surface (13a; 13b) thereof, and by at least one first sensing electrode (24), facing, in at least one given operating condition, the sensing indentation (22).
Abstract:
A low voltage isolation switch is suitable for receiving from a connection node a high voltage signal and transmitting said high voltage signal to a load via a connection terminal. The isolation switch includes a driving block connected between first and second voltage reference terminals and including a first driving transistor coupled between the first voltage reference (Vss) and a first driving circuit node and a second driving transistor coupled between the driving circuit node and the second supply voltage reference. The switch comprises an isolation block connected to the connection terminal (pzt), the connection node, and the driving central circuit node and including a voltage limiter block, a diode block and a control transistor. The control transistor is connected across the diode block between the connection node and the connection terminal and has a control terminal connected to the driving central circuit node.
Abstract:
The invention relates to a High Voltage switch configuration (10) having an input terminal (IN) which receives an input signal (Vin) to drive a load and an output terminal (OUT) which issues an output signal (Vout) to the load. Advantageously according to the invention, the High Voltage switch configuration ( 10) comprises at least a first and a second diode (D1, D2), being placed in antiseries between said input and output terminals (IN, OUT) and having a pair of corresponding terminals in common, in correspondence of a first internal circuit node (Xc1).
Abstract:
In a pressure sensor (35), a pressure-sensor element (10) has a monolithic body (12) of semiconductor material, and a first main face (12a) and a second main face (12b) acting on which is a stress resulting from a pressure (P) the value of which is to be determined; and a package (36) encloses the pressure-sensor element (10). The package (36) has an inner chamber (37) containing liquid material (38), and the pressure-sensor element (10) is arranged within the inner chamber (37) in such a manner that the first and second main faces (12a, 12b) are both in contact with the liquid material (38). In particular, the liquid material is a silicone gel.