Abstract:
An integrated device (100) is proposed comprising at least one MOS transistor (105) having a plurality of cells (135,150). In each of one or more of the cells (135,150) a disabling structure (175,180) is provided; the disabling structure (175,180) is configured to be in a non-conductive condition when the MOS transistor (105) is switched on in response to a control voltage comprised between a threshold voltage of the MOS transistor (105) and an intervention voltage of the disabling structure (175,180), or to be in a conductive condition otherwise. A system (400) comprising at least one integrated device (100) as above is also proposed. Moreover, a corresponding process for manufacturing this integrated device (100) is proposed.
Abstract:
The vertical conduction electronic power device (51) is formed by a body (70) delimited by a first and a second surface (70A, 70B) and having an epitaxial layer (54), of semiconductor material, and a substrate (90). The epitaxial layer is delimited by the first surface (70A) of the body and the substrate is delimited by the second surface (70B) of the body; the epitaxial layer houses at least a first and a second conduction region (56, 60) having a first type of doping (N) and a plurality of insulated-gate regions (59), which extend within the epitaxial layer (54). The substrate (90) has at least one silicide region (91), which extends starting from the second surface (70B) of the body (70) towards the epitaxial layer.
Abstract:
A vertical conduction integrated electronic device including: a semiconductor body (12); a trench (22) that extends through part of the semiconductor body and delimits a portion (24) of the semiconductor body, which comprises a first conduction region (16) having a first type of conductivity and a body region (40) having a second type of conductivity, which overlies the first conduction region; a gate region (30) of conductive material, which extends within the trench; an insulation region (39a) of dielectric material, which extends within the trench and is arranged between the gate region and the body region; and a second conduction region (20), which overlies the body region. The second conduction region is formed by a conductor.