-
公开(公告)号:SE544700C2
公开(公告)日:2022-10-18
申请号:SE1950574
申请日:2019-05-15
Applicant: STORA ENSO OYJ
Inventor: ZAFAR ASHAR , NASLI BAKIR BEN , EKSTRÖM JESPER
IPC: C09J163/00 , B27N3/00 , B32B21/00 , C08L1/00 , C08L3/00 , C08L5/00 , C08L63/00 , C08L89/00 , C08L93/00 , C08L99/00 , C09J101/00 , C09J103/00 , C09J105/00 , C09J189/00 , C09J193/00 , C09J199/00
Abstract: The present invention relates to the use of a bonding resin prepared by providing an aqueous solution comprising at least one biobased product selected from tannin, starch, soy protein, glycerol, chitin, pectin, dextrose or other carbohydrates, or a mixture thereof and mixing the aqueous solution with one or more of glycerol diglycidyl ether, polyglycerol diglycidyl ether, polyglycerol polyglycidyl ether, glycerol triglycidyl ether, sorbitol polyglycidyl ether, alkoxylated glycerol polyglycidyl ether, trimethylolpropane triglycidyl ether, trimethylolpropane diglycidyl ether, polyoxypropylene glycol diglycidylether, polyoxypropylene glycol triglycidyl ether, diglycidylether of cyclohexane dimethanol, resorcinol diglycidyl ether, isosorbide diglycidyl ether, pentaerythritol tetraglycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether having 2-9 ethylene glycol units, propylene glycol diglycidyl ether having 1-5 propylene glycol units, and/or diglycidyl ether of terminal diol having a linear carbon chain of 3-6 carbon atoms; and optionally one or more additives. The bonding resin is used in the manufacture of laminates, mineral wool insulation or engineered wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF) or particle boards. Preferably, the bonding resin does not comprise lignin.
-
公开(公告)号:SE544555C2
公开(公告)日:2022-07-12
申请号:SE1850830
申请日:2018-07-02
Applicant: STORA ENSO OYJ
Inventor: ZAFAR ASHAR , NASLI BAKIR BEN , PHAM HUYNH TRAM ANH , HJELM LARS , JANSSON LI , TORSSELL STAFFAN
IPC: C09J197/00 , C08H7/00 , C08L97/00 , C09J161/12
Abstract: The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of an aqueous solution and mixed with one or more of glycerol diglycidyl ether, glycerol triglycidyl ether, sorbitol polyglycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether having 2-9 ethylene glycol units, propylene glycol diglycidyl ether having 1-3 propylene glycol units, and/or diglycidyl ether of terminal diol having a linear carbon chain of 3-6 carbon atoms; and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, laminated veneer lumber (LVL), medium density fiberboards (MDF) , high density fiberboards (HDF) and particle boards.
-
公开(公告)号:SE543345C2
公开(公告)日:2020-12-08
申请号:SE1850467
申请日:2018-04-20
Applicant: STORA ENSO OYJ
Inventor: ZAFAR ASHAR , NASLI BAKIR BEN , EKSTRÖM JESPER
IPC: C09J197/00 , B32B21/08 , C08L97/00 , C09J161/06
Abstract: The present invention relates to a process for preparing a bonding resin, wherein a resin prepared from lignin, phenol and formaldehyde is mixed with a resin prepared from phenol and formaldehyde to achieve a mixture useful as a bonding resin useful in the manufacture of laminates, mineral wool insulation and wood products such as plywood, laminated veneer lumber (LVL), medium density fiberboards (MDF) and particle boards.
-
公开(公告)号:CA3114739A1
公开(公告)日:2020-04-16
申请号:CA3114739
申请日:2019-10-07
Applicant: STORA ENSO OYJ
Inventor: NASLI BAKIR BEN , ZAFAR ASHAR , EKSTROM JESPER , ARESKOGH DIMITRI
IPC: C09J197/00 , C07G1/00 , C08H8/00 , C08L97/00
Abstract: The present invention relates to an improved process for preparing an aqueous dispersion of lignin and the use of said suspension in the preparation of a resin.
-
公开(公告)号:CA3100830A1
公开(公告)日:2020-01-09
申请号:CA3100830
申请日:2019-06-28
Applicant: STORA ENSO OYJ
Inventor: NASLI BAKIR BEN , TORSSELL STAFFAN , HJELM LARS , JANSSON LI , PHAM HUYNH TRAM ANH , ZAFAR ASHAR
IPC: C09J197/02 , B27N3/00 , C08H7/00 , C08L97/02 , C09D197/00
Abstract: The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of an aqueous solution and mixed with one or more of glycerol diglycidyl ether, polyglycerol diglycidyl ether, polyglycerol polyglycidyl ether, glycerol triglycidyl ether, sorbitol polyglycidyl ether, alkoxylated glycerol polyglycidyl ether, trimethylolpropane triglycidyl ether, trimethylolpropane diglycidyl ether, polyoxypropylene glycol diglycidylether, polyoxypropylene glycol triglycidyl ether, diglycidylether of cyclohexane dimethanol, resorcinol diglycidyl ether, isosorbide diglycidyl ether, pentaerythritol tetraglycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether having 2-9 ethylene glycol units, propylene glycol diglycidyl ether having 1-5 propylene glycol units, and/or diglycidyl ether of terminal diol having a linear carbon chain of 3-6 carbon atoms; and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards.
-
公开(公告)号:CA3096167A1
公开(公告)日:2019-10-24
申请号:CA3096167
申请日:2019-04-16
Applicant: STORA ENSO OYJ
Inventor: NASLI BAKIR BEN , ZAFAR ASHAR , EKSTROM JESPER
IPC: C09J197/00 , B27N3/14 , B32B21/08 , C08L97/00 , C09J161/06
Abstract: The present invention relates to a process for preparing a bonding resin, wherein a resin prepared from lignin, phenol and formaldehyde and comprising a formaldehyde scavenger, is mixed with a resin prepared from phenol and formaldehyde and comprising a formaldehyde scavenger to achieve a mixture useful as a bonding resin useful in the manufacture of oriented strand board (OSB).
-
公开(公告)号:CL2021003003A1
公开(公告)日:2022-08-19
申请号:CL2021003003
申请日:2021-11-15
Applicant: STORA ENSO OYJ
Inventor: NASLI BAKIR BEN , ZAFAR ASHAR , EKSTRÖM JESPER
IPC: B27N3/00 , B32B21/00 , C08L1/00 , C08L3/00 , C08L5/00 , C08L63/00 , C08L89/00 , C08L93/00 , C08L99/00 , C09J101/00 , C09J103/00 , C09J105/00 , C09J163/00 , C09J189/00 , C09J193/00 , C09J199/00
Abstract: La presente invención se refiere al uso de una resina adhesiva preparada con una solución acuosa que comprende un producto de origen biológico como taninos, proteína de soya, glicerol, quitina, pectina, dextrosa u otros carbohidratos, o una mezcla de los mismos, y mezclar dicha solución con uno o más agentes de reticulación tales como éteres, y opcionalmente uno o más aditivos. La resina adhesiva se usa en la manufactura de laminados, productos de madera o de aislamiento de madera minerales.
-
公开(公告)号:AU2020275266A1
公开(公告)日:2021-12-02
申请号:AU2020275266
申请日:2020-05-13
Applicant: STORA ENSO OYJ
Inventor: NASLI BAKIR BEN , ZAFAR ASHAR , EKSTRÖM JESPER
IPC: C09J163/00 , B27N3/00 , B32B21/00 , C08L1/00 , C08L3/00 , C08L5/00 , C08L63/00 , C08L89/00 , C08L93/00 , C08L99/00 , C09J101/00 , C09J103/00 , C09J105/00 , C09J189/00 , C09J193/00 , C09J199/00
Abstract: The present invention relates to the use of a bonding resin prepared by providing an aqueous solution comprising at least one biobased product selected from tannin, starch, soy protein, glycerol, chitin, pectin, dextrose or other carbohydrates, or a mixture thereof and mixing the aqueous solution with one or more of certain crosslinkers such as ethers, and optionally one or more additives. The bonding resin is used in the manufacture of laminates, mineral wool insulation or wood products, such as engineered wood products, such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF) or particle boards. Preferably, the bonding resin does not comprise lignin.
-
公开(公告)号:SE543465C2
公开(公告)日:2021-02-23
申请号:SE1850469
申请日:2018-04-20
Applicant: STORA ENSO OYJ
Inventor: ZAFAR ASHAR , NASLI BAKIR BEN , EKSTRÖM JESPER
IPC: C08H8/00 , C09J197/00 , C08L97/00 , C09J161/00
Abstract: The present invention relates to a process for preparing a bonding resin, wherein a first resin prepared from lignin, formaldehyde and optionally phenol is mixed with a second resin prepared from lignin, formaldehyde and optionally phenol, wherein the first resin is different from the second resin, to achieve a mixture useful as a bonding resin useful in the manufacture of laminates, mineral wool insulation and wood products such as plywood, laminated veneer lumber (LVL), medium density fiberboards (MDF) and particle boards.
-
公开(公告)号:CA3120737A1
公开(公告)日:2020-06-04
申请号:CA3120737
申请日:2019-11-26
Applicant: STORA ENSO OYJ
Inventor: NASLI BAKIR BEN , ZAFAR ASHAR , EKSTROM JESPER
IPC: C09J197/00 , B27N3/00 , C07G1/00 , C08H7/00 , C08L61/06 , C08L97/00 , C08L97/02 , C09J161/06 , C09J197/02
Abstract: The present invention relates to a process for lignin dissolution in which partial methylolation of lignin is carried out during the step of preparing a solution of lignin in an aqueous medium comprising alkali and phenol. The lignin prepared according to the process of the present invention can be used to manufacture lignin-based phenolic resins, which are particularly useful in the manufacture of laminates.
-
-
-
-
-
-
-
-
-