公开(公告)号：CL2020003134A1

公开(公告)日：2021-05-07

申请号：CL2020003134

申请日：2020-12-02

Applicant: STORA ENSO OYJ

Inventor： TORSSELL STAFFAN ,  NASLI BAKIR BEN ,  ZAFAR ASHAR ,  HJELM LARS ,  JANSSON LI ,  PHAM HUYNH TRAM ANH

IPC: B27N3/00 ,  C08H7/00 ,  C08L97/02 ,  C09D197/00 ,  C09J197/02

Abstract: La presente invención se refiere a un proceso para preparar una resina adhesiva, donde la lignina es proporcionada en la forma de una solución acuosa y se mezcla con uno o más de glicerol diglicidil éter, poliglicerol diglicidil éter, poliglicerol poliglicidil éter, glicerol triglicidil éter, sorbitol poliglicidil éter, glicerol alcoxilado poliglicidil éter, trimetilolpropano triglicidil éter, trimetilolpropano diglicidil éter, polioxipropilen glicol diglicidil éter, polioxipropilen glicol triglicidil éter, diglicidil éter de ciclohexano dimetanol, resorcinol diglicidil éter, isosorbide diglicidil éter, pentaeritritol tetraglicidil éter, etilen glicol diglicidil éter, polietien glicol diglicidil éter que tiene de 2 a 9 unidades de etilen glicol, propilen glicol diglicidil éter que tiene de 1 a 5 unidades de propilen glicol, y/o diglicidil éter de diol terminal que tiene una cadena lineal de carbono de 3 a 6 átomos de carbono; y opcionalmente uno o más aditivos. La resina adhesiva es útil por Ejemplo en la fabricación de laminados, aislantes de lana mineral y productos de madera como la madera contrachapada, los tableros de fibra orientada (OSB), la madera de chapa laminada (LVL), los tableros de fibra de densidad media (MDF), los tableros de fibra de alta densidad (HDF), los suelos de parquet, la madera contrachapada curvada, los tableros de partículas chapados, los MDF chapados o los tableros de partículas.

公开(公告)号：SE1951516A1

公开(公告)日：2021-06-21

申请号：SE1951516

申请日：2019-12-20

Applicant: STORA ENSO OYJ

Inventor： ZAFAR ASHAR ,  PHAM HUYNH TRAM ANH ,  EKSTRÖM JESPER ,  HÄGG KATARINA

IPC: C09J197/02 ,  B27N3/00 ,  B32B21/00 ,  C07G1/00 ,  C08H7/00 ,  C08L63/00 ,  C08L97/02 ,  C09D163/00 ,  C09D197/02 ,  C09J163/00

Abstract: The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of a solution in ammonia and/or an organic base and mixed with one or more crosslinkers and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards. The bonding resin is also useful for example in composites, molding compounds and foundry applications.

公开(公告)号：SE1850830A1

公开(公告)日：2020-01-03

申请号：SE1850830

申请日：2018-07-02

Applicant: STORA ENSO OYJ

Inventor： ZAFAR ASHAR ,  NASLI BAKIR BEN ,  PHAM HUYNH TRAM ANH ,  HJELM LARS ,  JANSSON LI ,  TORSSELL STAFFAN

IPC: C09J197/00 ,  C08H7/00 ,  C08L97/00 ,  C09J161/12

Abstract: The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of an aqueous solution and mixed with one or more of glycerol diglycidyl ether, glycerol triglycidyl ether, sorbitol polyglycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether having 2-9 ethylene glycol units, propylene glycol diglycidyl ether having 1-3 propylene glycol units, and/or diglycidyl ether of terminal diol having a linear carbon chain of 3-6 carbon atoms; and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, laminated veneer lumber (LVL), medium density fiberboards (MDF) , high density fiberboards (HDF) and particle boards.

公开(公告)号：SE546842C2

公开(公告)日：2025-02-25

申请号：SE2051281

申请日：2020-11-04

Applicant: STORA ENSO OYJ

Inventor： ZAFAR ASHAR ,  PHAM HUYNH TRAM ANH ,  FÄLDT SARA

IPC: C09J197/00 ,  C08L97/00 ,  C09D197/00

Abstract: The present invention relates to a bonding resin comprising lignin and plasticizer. The invention also relates to a method for producing the bonding resin as well as the use of the bonding resin. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards. The bonding resin is also useful for example in composites, molding compounds and foundry applications.

公开(公告)号：SE2051281A1

公开(公告)日：2022-05-05

申请号：SE2051281

申请日：2020-11-04

Applicant: STORA ENSO OYJ

Inventor： ZAFAR ASHAR ,  PHAM HUYNH TRAM ANH ,  FÄLDT SARA

IPC: C09J197/00 ,  C08L97/00 ,  C09D197/00

Abstract: The present invention relates to a bonding resin comprising lignin and plasticizer. The invention also relates to a method for producing the bonding resin as well as the use of the bonding resin. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards. The bonding resin is also useful for example in composites, molding compounds and foundry applications.

公开(公告)号：SE2050835A1

公开(公告)日：2022-01-04

申请号：SE2050835

申请日：2020-07-03

Applicant: STORA ENSO OYJ

Inventor： ZAFAR ASHAR ,  PHAM HUYNH TRAM ANH

IPC: C09J197/00 ,  C08K5/00 ,  C08K5/16 ,  C08L97/00

Abstract: The present invention is directed to a method for preparing a bonding resin, wherein lignin in powder form or in the form of an aqueous dispersion is mixed with at an aqueous solution of least one substantially formaldehydefree crosslinker that includes at least one amine, amide, imine, imide, or nitrogen-containing heterocyclic functional group that can react with at least one functional group of the lignin, at a pH in the range of from 3 to 9, and optionally one or more additives.

公开(公告)号：SE544555C2

公开(公告)日：2022-07-12

申请号：SE1850830

申请日：2018-07-02

Applicant: STORA ENSO OYJ

Inventor： ZAFAR ASHAR ,  NASLI BAKIR BEN ,  PHAM HUYNH TRAM ANH ,  HJELM LARS ,  JANSSON LI ,  TORSSELL STAFFAN

IPC: C09J197/00 ,  C08H7/00 ,  C08L97/00 ,  C09J161/12

Abstract: The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of an aqueous solution and mixed with one or more of glycerol diglycidyl ether, glycerol triglycidyl ether, sorbitol polyglycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether having 2-9 ethylene glycol units, propylene glycol diglycidyl ether having 1-3 propylene glycol units, and/or diglycidyl ether of terminal diol having a linear carbon chain of 3-6 carbon atoms; and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, laminated veneer lumber (LVL), medium density fiberboards (MDF) , high density fiberboards (HDF) and particle boards.

公开(公告)号：AU2020407553A1

公开(公告)日：2022-06-09

申请号：AU2020407553

申请日：2020-12-16

Applicant: STORA ENSO OYJ

Inventor： ZAFAR ASHAR ,  PHAM HUYNH TRAM ANH ,  HÄGG KATARINA ,  EKSTRÖM JESPER

IPC: C09J197/02 ,  B27N3/00 ,  B32B21/00 ,  C07G1/00 ,  C08H7/00 ,  C08L63/00 ,  C08L97/02 ,  C09D163/00 ,  C09D197/02 ,  C09J163/00

Abstract: The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of a solution in ammonia and/or an organic base and mixed with one or more crosslinkers and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards. The bonding resin is also useful for example in composites, molding compounds and foundry applications.

公开(公告)号：CA3100830A1

公开(公告)日：2020-01-09

申请号：CA3100830

申请日：2019-06-28

Applicant: STORA ENSO OYJ

Inventor： NASLI BAKIR BEN ,  TORSSELL STAFFAN ,  HJELM LARS ,  JANSSON LI ,  PHAM HUYNH TRAM ANH ,  ZAFAR ASHAR

IPC: C09J197/02 ,  B27N3/00 ,  C08H7/00 ,  C08L97/02 ,  C09D197/00

Abstract: The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of an aqueous solution and mixed with one or more of glycerol diglycidyl ether, polyglycerol diglycidyl ether, polyglycerol polyglycidyl ether, glycerol triglycidyl ether, sorbitol polyglycidyl ether, alkoxylated glycerol polyglycidyl ether, trimethylolpropane triglycidyl ether, trimethylolpropane diglycidyl ether, polyoxypropylene glycol diglycidylether, polyoxypropylene glycol triglycidyl ether, diglycidylether of cyclohexane dimethanol, resorcinol diglycidyl ether, isosorbide diglycidyl ether, pentaerythritol tetraglycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether having 2-9 ethylene glycol units, propylene glycol diglycidyl ether having 1-5 propylene glycol units, and/or diglycidyl ether of terminal diol having a linear carbon chain of 3-6 carbon atoms; and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards.