Abstract:
A Si3N4 composite substrate which manifests no generation of cracking on the substrate even by mechanical shock or thermal shock, and is excellent in heat radiation property and heat-cycle-resistance property is obtained by using a Si3N4 substrate as a ceramic substrate. A Si3N4 substrate having a thermal conductivity of 90 W/m • K or more and a three-point flexural strength of 700 MPa or more is used, and the thickness tm of a metal layer connected on one major surface of the substrate and the thickness tc of the Si3N4 substrate are controlled so as to satisfy the relation formula: 2 tm
Abstract:
Disclosed is a method for producing a coil material that forms a coil material by winding a plate-like material consisting of a metal into a cylindrical shape. The plate-like material is a cast material of magnesium alloy discharged from a continuous casting machine and has a thickness t (mm) of 7 mm or less. Also disclosed is a coil material that can contribute to improvements in producibility of high-strength magnesium alloy plate materials by being wound by a winding machine and having temperature T (°C) directly before winding a plate-like material (1) controlled to a temperature such that the surface distortion ((t/R) x 100) given by the thickness t and bending radius R (mm) for the plate-like material (1) is less than the elongation of the plate-like material (1) at room temperature.
Abstract:
A method of manufacturing a wavelength converter (10d) that has an optical waveguide (13) and that converts the wavelength of an incoming beam (101) input into the optical waveguide through one end (13a) thereof, and outputs an outgoing beam (102) from the optical waveguide through the other end (13b) thereof, the wavelength converter manufacturing method comprising: a step of growing a first crystal (11); a step of forming two or more regularly arrayed projections (11c) in a surface (11a) of the first crystal (11); and a step of growing a second crystal (16), being an amorphous crystal in which there is essentially no difference in refractive index from that of the first crystal (11), onto said surface (11a) of the first crystal (11); wherein in said step of growing the second crystal, the first and second crystals are formed in such a way that a domain inversion structure in which the polar directions of the first and second crystals periodically reverse along the optical waveguide is created, and the domain inversion structure satisfies quasi-phase-matching conditions for the incoming beam.
Abstract:
Disclosed are a thin film of AlN, which is flat and thin, and a process f or producing the thin film of AlN. An AlN thin film (2) contains not less th an 0.001% by weight and not more than 10% by weight of one or more additive elements selected from group III elements, group IV elements, and group V el ements. The AlN thin film (2) can be formed on a base material (1) using pla sma generated by setting an AlN sintered compact containing not less than 0. 001% by weight and not more than 10% by weight of one or more additive eleme nts selected from group III elements, group IV elements, and group V element s in a vacuum chamber and irradiating the AlN sintered compact with a laser beam in such a state that the base material (1) has been set in the vacuum c hamber.
Abstract:
A method for growing a Group III nitride semiconductor crystal is provided with the following steps: First, a chamber including a heat-shielding portion for shielding heat radiation from a material 13 therein is prepared. Then, material 13 is arranged on one side of heat-shielding portion in chamber. Then, by heating material to be sublimated, a material gas is deposited on the other side of heat-shielding portion in chamber so that a Group III nitride semiconductor crystal is grown.
Abstract:
Disclosed is a method for growing an AlN crystal, which enables to stably grow an AlN crystal having large aperture and thickness. Specifically discl osed is a method for growing an AlN crystal, which comprises a step for prep aring an SiC substrate (4) having a major surface (4m) wherein the density o f micropipes (4mp) having a pipe diameter of not less than 1000 .mu.m is 0 c m-2 and the density of micropipes (4mp) having a pipe diameter of not less t han 100 .mu.m but less than 1000 .mu.m is not more than 0.1 cm-2, and a step for growing an AlN crystal (5) on the major surface (4m) by a vapor-phase p rocess.
Abstract:
The invention provides porous silicon nitride ceramics that have uniform, fine closed pores and a manufacturing method thereof. Metal Si powder is mixed with a sintering additive, followed by thermal treatment, which is a pre-process for forming a specific grain boundary phase. Two-stage thermal treatment is thereafter performed by microwave heating at a temperature of 1000 DEG C or more. The metal Si powder is thereafter subjected to a nitriding reaction from its surface, the metal Si is thereafter diffused to nitride formed on the outer shell of the metal Si, and thereby porous silicon nitride ceramics that have uniform, fine closed pores can be obtained. Since the porous silicon nitride ceramics of the present invention have a high ratio of closed pores and are superior in electrical/mechanical characteristics, excellent characteristics can be displayed if they are used, for example, for an electronic circuit board that requires an anti-hygroscopicity, a low dielectric constant, a low dielectric loss, and mechanical strength.