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公开(公告)号:WO2005020337A8
公开(公告)日:2005-05-12
申请号:PCT/JP2004011158
申请日:2004-08-04
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor: NAGAI YOUICHI , KIYAMA MAKOTO , NAKAMURA TAKAO , SAKURADA TAKASHI , AKITA KATSUSHI , UEMATSU KOJI , IKEDA AYAKO , KATAYAMA KOJI , YOSHIMOTO SUSUMU
IPC: H01L29/24 , H01L33/06 , H01L33/12 , H01L33/32 , H01L33/40 , H01L33/50 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/00
CPC classification number: H01L33/32 , H01L33/20 , H01L33/382 , H01L33/505 , H01L33/507 , H01L33/58 , H01L2224/05573 , H01L2224/16245 , H01L2224/32245 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/3025 , H01L2924/00 , H01L2924/20752 , H01L2924/2076 , H01L2224/05599 , H01L2924/00011 , H01L2224/45099
Abstract: A light-emitting device is disclosed which can be produced easily because of its simple structure and is capable of stably maintaining high luminous efficiency for a long time. The light-emitting device comprises, on the side of a first major surface of a nitride semiconductor substrate (1), an n-type nitride semiconductor layer (2), a p-type nitride semiconductor layer (6) placed farther than the n-type nitride semiconductor layer (2) from the nitride semiconductor substrate (1), and a light-emitting layer (4) arranged between the n-type nitride semiconductor layer (2) and the p-type nitride semiconductor layer (6). The nitride semiconductor substrate has a resistivity of not more than 0.5 ohm.cm. The light-emitting device is mounted with the p-type nitride semiconductor layer side down, so that light is emitted through a second major surface (1a) of the nitride semiconductor substrate which is opposite to the first major surface.
Abstract translation: 公开了一种由于其结构简单而能容易地制造并且能够长时间稳定地保持高发光效率的发光器件。 发光器件在氮化物半导体衬底(1)的第一主表面上包括n型氮化物半导体层(2),比n更远的p型氮化物半导体层(6) 氮化物半导体衬底(1)的氮化物半导体层(2)和配置在n型氮化物半导体层(2)和p型氮化物半导体层(6)之间的发光层(4)。 氮化物半导体衬底的电阻率不大于0.5欧姆·厘米。 发光装置以p型氮化物半导体层一侧向下安装,使得光通过与第一主表面相对的氮化物半导体衬底的第二主表面(1a)发射。
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公开(公告)号:DE112011101177T5
公开(公告)日:2013-01-24
申请号:DE112011101177
申请日:2011-03-28
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor: KAWASE TOMOHIRO , HAGI YOSHIAKI , SAKURADA TAKASHI
Abstract: Bezieht sich auf ein Verfahren zum Fertigen eines Halbleiterkristalls, bei dem die Erzeugung eines Baufehlers in dem Halbleiter-Einkristall unterdrückt wird. Das Fertigungsverfahren beinhaltet die folgenden Schritte: Ausbilden eines Boroxidfilms (31) auf der inneren Wand eines Züchtungsbehälters (10), der einen unteren Abschnitt und einen Hauptteilabschnitt aufweist, der mit dem unteren Abschnitt zusammenhängend ist; Inkontaktbringen des Boroxidfilms (31) mit einer Siliciumoxid enthaltenden Boroxidschmelze, um einen Siliciumoxid enthaltenden Boroxidfilm (32) auf der inneren Wand des Züchtungsbehälters (10) auszubilden; Ausbilden einer Ausgangsmaterialschmelze (34) oberhalb eines Impfkristalls (20), der in und auf dem unteren Abschnitt des Züchtungsbehälters (10) platziert ist; und Verfestigen der Ausgangsmaterialschmelze (34) von der Seite des Impfkristalls (20) aus, um einen Halbleiter-Einkristall zu züchten.
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公开(公告)号:CA2564424A1
公开(公告)日:2006-09-28
申请号:CA2564424
申请日:2006-03-06
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor: TANABE TATSUYA , SAKURADA TAKASHI , MIURA KOUHEI , KIYAMA MAKOTO
IPC: H01L21/338 , H01L21/205 , H01L29/778 , H01L29/812
Abstract: Disclosed is a group III nitride semiconductor device wherein leakage curren t from a Schottky electrode is reduced. In a high-electron-mobility transistor (11), a supporting substrate (13) is specifically composed of AlN, AlGaN and GaN. An AlYGa1-YN epitaxial layer (15) has a full width at half maximum of t he (0002) plane XRD of not more than 150 sec. A GaN epitaxial layer (17) is formed between the gallium nitride supporting substrate and the AlYGa1-YN epitaxial layer (0
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公开(公告)号:CA2694496A1
公开(公告)日:2009-09-17
申请号:CA2694496
申请日:2009-03-06
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor: SATOH ISSEI , MIZUHARA NAHO , TANIZAKI KEISUKE , MIYANAGA MICHIMASA , SAKURADA TAKASHI , NAKAHATA HIDEAKI
IPC: C30B23/08 , C23C14/28 , H01L21/203
Abstract: An apparatus (1) for manufacturing a compound semiconductor single crystal is provided with a laser light source (6) which can sublimate a material by applying a laser beam to the material; a reaction container (2), which has a laser introducing window (5) that can pass through the laser beam emitted from the laser light source (6) and that can introduce the laser beam into the container, and holds a base substrate (3) which recrystallizes the sublimated material; and a heater (7) which can heat the base substrate (3). The material in the reaction container (2) is sublimated by heating the material by applying the laser beam to the material, and the sublimated material is recrystallized on the base substrate (3) to grow the compound semiconductor single crystal. Then, the compound semiconductor single crystal is separated from the base substrate (3) by using the laser beam.
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公开(公告)号:CA2572792A1
公开(公告)日:2006-11-09
申请号:CA2572792
申请日:2006-01-20
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor: MIURA KOUHEI , SAKURADA TAKASHI , KIYAMA MAKOTO
IPC: H01L29/47 , H01L29/872
Abstract: Affords a Group III nitride semiconductor device having a structure that can improve the breakdown voltage. A Schottky diode (11) consists of a Group III nitride support substrate (13), a gallium nitride region (15), and a Schottky electrode (17). The Group III nitride support substrate (13) has electrical conductivity. The Schottky electrode (17) forms a Schottky junction on the gallium nitride region (15). The gallium nitride region (15) is fabricated on a principal face (13a) of the Group III nitride support substrate (13). The gallium nitride region (15) has a (1012)-plane XRD full-width-at-half-maximum of 100 sec or less.
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公开(公告)号:CA2564423A1
公开(公告)日:2006-09-21
申请号:CA2564423
申请日:2006-03-03
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor: KIYAMA MAKOTO , TANABE TATSUYA , SAKURADA TAKASHI , MIURA KOUHEI
IPC: H01L21/338 , H01L21/205 , H01L29/778 , H01L29/812
Abstract: Disclosed is a group III nitride semiconductor device wherein leakage curren t from a Schottky electrode is reduced. In a high-electron-mobility transistor (1), a supporting substrate (3) is composed of AlN, AlGaN and GaN. An AlYGa1 - YN epitaxial layer (5) has a surface roughness (Rms) of not more than 0.25 n m, and this surface roughness is defined by a 1 .mu.m square area. A GaN epitaxial layer (7) is formed between the AlYGa1-YN supporting substrate (3) and the AlYGa1-YN epitaxial layer (5). A Schottky electrode (9) is formed on the AlYGa1-YN epitaxial layer (5). A first ohmic electrode (11) is formed on the AlYGa1-YN epitaxial layer (5), and a second ohmic electrode (13) is form ed on the AlYGa1-YN epitaxial layer (5). One of the first and second ohmic electrodes (11, 13) is a source electrode, and the other is a drain electrod e. The Schottky electrode (9) is a gate electrode of the high-electron-mobility transistor (1).
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公开(公告)号:DE112011101177B4
公开(公告)日:2020-09-03
申请号:DE112011101177
申请日:2011-03-28
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor: SAKURADA TAKASHI , KAWASE TOMOHIRO , HAGI YOSHIAKI
Abstract: Verfahren zum Fertigen eines Halbleiter-Einkristalls, das die folgenden Schritte umfasst:Ausbilden eines Boroxidfilms (31) auf einer inneren Wand eines Züchtungsbehälters (10), der einen unteren Abschnitt und einen Hauptteilabschnitt aufweist, der mit dem unteren Abschnitt zusammenhängend ist,Inkontaktbringen des Boroxidfilms (31) mit einer Siliziumoxid enthaltenden Boroxidschmelze (33), um einen Siliziumoxid enthaltenden Boroxidfilm (32) auf der inneren Wand des Züchtungsbehälters (10) auszubilden,Anordnen einer Ausgangsmaterialschmelze (34) in dem Züchtungsbehälter (10) und oberhalb eines in dem unteren Abschnitt platzierten Impfkristalls (20), undVerfestigen der Ausgangsmaterialschmelze (34) von der Seite des Impfkristalls (20) aus, um einen Halbleiter-Einkristall zu züchten,wobei es sich bei dem Siliziumoxid, das in dem festen, Siliziumoxid enthaltenden Boroxid (23) enthalten ist, um Siliziumdioxid handelt,wobei eine Konzentration des Siliziumdioxids in dem festen, Siliziumoxid enthaltenden Boroxid (23) höher als oder gleich 1 mol% und geringer als oder gleich 12 mol% ist.
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公开(公告)号:DE112010003035T5
公开(公告)日:2013-04-18
申请号:DE112010003035
申请日:2010-07-23
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor: KAWASE TOMOHIRO , SAKURADA TAKASHI
IPC: C30B11/06 , C30B29/44 , H01L21/208
Abstract: Es wird ein Verfahren zum Erzeugen eines Halbleiterkristalls angegeben. Das Verfahren umfasst Schritte: zum Vorbereiten eines länglichen Behälters (1) mit einem Impfkristall (8) und einer Schmelze (9) mit einer darin enthaltenen Verunreinigung, die in einem unteren Abschnitt (1b) platziert sind, und mit einem Aufhängungsteil (2), der in einem oberen Abschnitt (1a) angeordnet ist und an dem ein tropfender Rohmaterialblock (11) aus einem Halbleitermaterial mit einer Verunreinigungskonzentration, die geringer als diejenige der Schmelze (9) mit der darin enthaltenen Verunreinigung ist, aufgehängt wird; zum Erzeugen eines Temperaturgradienten in der Längsrichtung des länglichen Behälters (1), um den tropfenden Rohmaterialblock (11) zu schmelzen; und zum Verfestigen des Schmelze mit der darin enthaltenen Verunreinigung (9) von der Seite, die in Kontakt mit dem Impfkristall (8) ist, während eine erzeugte Schmelze (13) in die Schmelze (9) mit einer darin enthaltenen Verunreinigung tropft, um einen Halbleiterkristall (12) zu erzeugen.
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公开(公告)号:CA2688453A1
公开(公告)日:2009-09-03
申请号:CA2688453
申请日:2009-02-18
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor: SAKURADA TAKASHI , YAMAMOTO YOSHIYUKI , SATOH ISSEI , MIZUHARA NAHO , NAKAHATA HIDEAKI , TANIZAKI KEISUKE , MIYANAGA MICHIMASA
Abstract: Disclosed are a thin film of AlN, which is flat and thin, and a process f or producing the thin film of AlN. An AlN thin film (2) contains not less th an 0.001% by weight and not more than 10% by weight of one or more additive elements selected from group III elements, group IV elements, and group V el ements. The AlN thin film (2) can be formed on a base material (1) using pla sma generated by setting an AlN sintered compact containing not less than 0. 001% by weight and not more than 10% by weight of one or more additive eleme nts selected from group III elements, group IV elements, and group V element s in a vacuum chamber and irradiating the AlN sintered compact with a laser beam in such a state that the base material (1) has been set in the vacuum c hamber.
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公开(公告)号:SG145722A1
公开(公告)日:2008-09-29
申请号:SG2008058927
申请日:2004-08-04
Applicant: SUMITOMO ELECTRIC INDUSTRIES
Inventor: NAGAI YOUICHI , KIYAMA MAKOTO , NAKAMURA TAKAO , SAKURADA TAKASHI , AKITA KATSUSHI , UEMATSU KOJI , IKEDA AYAKO , KATAYAMA KOJI , YOSHIMOTO SUSUMU
IPC: H01L29/24 , H01L33/06 , H01L33/12 , H01L33/32 , H01L33/40 , H01L33/50 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62
Abstract: Light Emitting Apparatus In order to provide light emitting devices which have simple constructions and thus can be fabricated easily, and can stably provide high light emission efficiencies for a long time period, a light emitting device includes an n-type nitride semiconductor layer(2) at a first main surface side of a nitride semiconductor substrate (1), a p-type nitride semiconductor layer (6) placed more distantly from the nitride semiconductor substrate than the n-type nitride semiconductor layer at the first main surface side and a light emitting layer (4) placed between the n-type nitride semiconductor layer and the p- type nitride semiconductor layer (6) at the first main surface side. The nitride semiconductor substrate has a resistivity of 0.5 09cm or less and the p-type nitride semiconductor layer side is down-mounted so that light is emitted from the second main surface (la) of the nitride semiconductor substrate at the opposite side from the first main surface.
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