3D FERROELECTRIC MEMORY DEVICE
    11.
    发明公开

    公开(公告)号:US20240008289A1

    公开(公告)日:2024-01-04

    申请号:US18340407

    申请日:2023-06-23

    CPC classification number: H10B53/20 H10B53/30

    Abstract: Provided is a 3D ferroelectric memory device. The 3D ferroelectric memory device may include a plurality of gate electrodes stacked on a substrate in a first direction; a plurality of ferroelectric layers on the plurality of gate electrodes in a second direction; a plurality of intermediate electrodes on the plurality of ferroelectric layers in the second direction; a first insulating layer between the plurality of gate electrodes and between the plurality of intermediate electrodes; a second insulating layer on the plurality of intermediate electrodes and the first insulating layer; and a channel layer on the second insulating layer.

    METHOD DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME

    公开(公告)号:US20230397432A1

    公开(公告)日:2023-12-07

    申请号:US18329197

    申请日:2023-06-05

    CPC classification number: H10B53/20 H10B53/10 G11C16/0483 H10B51/10 H10B51/20

    Abstract: A memory device includes a plurality of gate electrodes spaced apart from each other in a first direction, a memory layer comprising a plurality of memory regions that protrude and extend in a second direction perpendicular to the first direction to face the plurality of gate electrodes, respectively, a plurality of first insulating layers extended to spaces between the plurality of memory regions between the plurality of gate electrodes, a channel layer disposed between the memory layer and the plurality of gate electrodes, the channel layer having a shape including a plurality of first regions surrounding the plurality of memory regions and a second region that connects the plurality of first regions to each other in the first direction, and a gate insulating layer arranged between the channel layer and the plurality of gate electrodes.

    ELECTRONIC DEVICE INCLUDING FERROELECTRIC THIN FILM STRUCTURE

    公开(公告)号:US20230068904A1

    公开(公告)日:2023-03-02

    申请号:US17876979

    申请日:2022-07-29

    Abstract: An electronic device includes: a substrate including a source, a drain, and a channel between the source and the drain; a gate electrode arranged above the substrate and facing the channel, the gate electrode being apart from the channel in a first direction; and a ferroelectric thin film structure between the channel and the gate electrode, the ferroelectric thin film structure including a first ferroelectric layer, a crystallization barrier layer including a dielectric material, and a second ferroelectric layer, which are sequentially arranged from the channel in the first direction. The average of sizes of crystal grains of the first ferroelectric layer may be less than or equal to the average of sizes of crystal grains of the second ferroelectric layer, and owing to small crystal grains, dispersion of performance may be improved.

    SEMICONDUCTOR DEVICE AND SEMICONDUCTOR APPARATUS INCLUDING THE SAME

    公开(公告)号:US20220140104A1

    公开(公告)日:2022-05-05

    申请号:US17515969

    申请日:2021-11-01

    Abstract: Provided is a ferroelectric semiconductor device including a ferroelectric layer and two or more electrode layers. The semiconductor device may include a first electrode layer and a second electrode layer which have thermal expansion coefficients less than the thermal expansion coefficient of the ferroelectric layer. The difference between the thermal expansion coefficients of the second electrode layer and the ferroelectric layer may be greater than the difference between the thermal expansion coefficients of the first electrode layer and the ferroelectric. The second electrode layer may have a thickness greater than the thickness of the first electrode layer.

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