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11.发明申请公开(公告)号：US20170343622A1
公开(公告)日：2017-11-30
申请号：US15169639
申请日：2016-05-31
Applicant: Texas Instruments Incorporated
Inventor： Erika Lynn Mazotti , Dok Won Lee , William David French , Byron J R Shulver , Thomas Dyer Bonifield , Ricky Alan Jackson , Neil Gibson
CPC classification number: G01R33/04 , G01R33/0052
Abstract: An integrated fluxgate device has a magnetic core on a control circuit. The magnetic core has a volume and internal structure sufficient to have low magnetic noise and low non-linearity. A stress control structure is disposed proximate to the magnetic core. An excitation winding, a sense winding and a compensation winding are disposed around the magnetic core. An excitation circuit disposed in the control circuit is coupled to the excitation winding, configured to provide current at high frequency to the excitation winding sufficient to generate a saturating magnetic field in the magnetic core during each cycle at the high frequency. An isolation structure is disposed between the magnetic core and the windings, sufficient to enable operation of the excitation winding and the sense winding at the high frequency at low power.
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公开(公告)号：US20150340338A1
公开(公告)日：2015-11-26
申请号：US14286600
申请日：2014-05-23
Applicant: Texas Instruments Incorporated
Inventor： Dok Won Lee , William D. French , Ann Gabrys
IPC: H01L25/065 , H01L23/00 , H01F27/28 , H01L23/522
Abstract: An inductor conductor design which minimizes the impact of skin effect in the conductors at high frequencies in integrated circuits and the method of manufacture thereof is described herein.
Abstract translation: 这里描述了使集成电路中高频下的导体中的皮肤效应的影响最小化的电感器导体设计及其制造方法。
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公开(公告)号：US11885834B2
公开(公告)日：2024-01-30
申请号：US17463112
申请日：2021-08-31
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Lei Ding , Srinath Mathur Ramaswamy , Dok Won Lee , Baher Haroun , Wai Lee , Steven John Loveless
CPC classification number: G01R15/202 , G01R19/10
Abstract: In a described example, a circuit includes a sensor circuit including multiple magnetic field sensors having respective sensor outputs. The magnetic field sensors are configured to provide magnetic field sensor signals at the respective sensor outputs representative of a measure of current flow through a conductive structure. A combiner interface has combiner inputs and a combiner output. The combiner inputs are coupled to the respective sensor outputs. The combiner interface is configured to provide an aggregate sensor measurement at the combiner output responsive to the magnetic field sensor signals, in which the aggregate sensor measurement is decoupled from magnetic fields generated responsive to the current flow through the conductive structure.
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公开(公告)号：US20230135922A1
公开(公告)日：2023-05-04
申请号：US17514820
申请日：2021-10-29
Applicant: Texas Instruments Incorporated
Inventor： Rafael Jose Lizares Guevara , Dok Won Lee , Kashyap Mohan
Abstract: A described example includes: a semiconductor die including a Hall sensor arranged in a first plane that is parallel to a device side surface of the semiconductor die; a passivated magnetic concentrator including a magnetic alloy layer formed over the device side surface of the semiconductor die, the upper surface of the magnetic alloy layer covered by a layer of polymer material; a backside surface of the semiconductor die opposite the device side surface mounted to a die side surface of a die pad on a package substrate, the semiconductor die having bond pads on the device side surface spaced from the magnetic concentrator; electrical connections coupling the bond pads of the semiconductor die to leads of the package substrate; and mold compound covering the magnetic concentrator, the semiconductor die, the electrical connections, a portion of the leads, and the die side surface of the die pad.
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15.发明申请公开(公告)号：US20190324097A1
公开(公告)日：2019-10-24
申请号：US16502317
申请日：2019-07-03
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Erika Lynn Mazotti , Dok Won Lee , William David French , Byron J.R. Shulver , Thomas Dyer Bonifield , Ricky Alan Jackson , Neil Gibson
Abstract: An integrated fluxgate device has a magnetic core disposed over a semiconductor substrate. A first winding is disposed in a first metallization level above and a second metallization level below the magnetic core, and is configured to generate a first magnetic field in the magnetic core. A second winding is disposed in the first and second metallization levels and is configured to generate a second magnetic field in the magnetic core. A third winding is disposed in the first and second metallization levels and is configured to sense a magnetic field in the magnetic core that is the net of the first and second magnetic fields.
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Patent Agency Ranking
公开(公告)号：US20190178915A1
公开(公告)日：2019-06-13
申请号：US15836534
申请日：2017-12-08
Applicant: Texas Instruments Incorporated
Inventor： Dok Won Lee
Abstract: A current-sensing system includes a conductor for carrying a first electrical current generating a first magnetic field. A device, spaced from the conductor by a clearance, includes a semiconductor integrated circuit die in a package. The semiconductor integrated circuit die includes at least one elongated bar of a first ferromagnetic material magnetized by the first magnetic field; a sensor comprising a first coil wrapped around the at least one elongated bar to sense the bar's magnetization; and an electronic driver creating a second electrical current flowing through a second coil wrapped around the at least one elongated bar generating a second magnetic field to compensate the at least one bar's magnetization. The package has a first outer surface free of device terminals. A discrete plate of a second ferromagnetic material is positioned in the clearance and is conformal with the first outer surface of the package.
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公开(公告)号：US20180372511A1
公开(公告)日：2018-12-27
申请号：US15633516
申请日：2017-06-26
Applicant: Texas Instruments Incorporated
Inventor： Byron Jon Roderick Shulver , Dok Won Lee
Abstract: An integrated AMR sensor includes a half bridge with two resistors, a Wheatstone bridge with four resistors, or a first Wheatstone bridge with four resistors in an orthogonal configuration, and a second Wheatstone bridge with four resistors in an orthogonal configuration, oriented at 45 degrees with respect to the first Wheatstone bridge. Each resistor includes first magnetoresistive segments with current flow directions oriented at a first tilt angle with respect to a reference direction of the resistor, and second magnetoresistive segments with current flow directions oriented at a second tilt angle with respect to the reference direction. The tilt angles are selected to advantageously cancel angular errors due to shape anisotropies of the magnetoresistive segments. In another implementation, the disclosed system/method include a method for identifying tilt angles which cancel angular errors due to shape anisotropies of the magnetoresistive segments.
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公开(公告)号：US10147537B2
公开(公告)日：2018-12-04
申请号：US15832884
申请日：2017-12-06
Applicant: Texas Instruments Incorporated
Inventor： Dok Won Lee , Sudtida Lavangkul , Erika Lynn Mazotti , William David French
IPC: H01L27/02 , H01F27/34 , H01L43/12 , H01L23/528 , H01L23/522 , G01R33/04 , G01R33/00 , H01F27/24 , H01F27/28 , H01L27/22 , H01L43/02
Abstract: An integrated fluxgate device, which includes a magnetic core, an excitation coil, and a sense coil. The magnetic core has a longitudinal edge and a terminal edge. The excitation coil coils around the longitudinal edge of the magnetic core, and the excitation coil has a first number of excitation coil members within a proximity of the terminal edge. The sense coil coils around the longitudinal edge of the magnetic core, and the sense coil has a second number of sense coil members within the proximity of the terminal edge. For reducing fluxgate noise, the second number of sense coil members may be less than the first number of excitation coil members within the proximity of the terminal edge.
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公开(公告)号：US10017851B2
公开(公告)日：2018-07-10
申请号：US14979003
申请日：2015-12-22
Applicant: Texas Instruments Incorporated
Inventor： Dok Won Lee , Mona Eissa , Neal Thomas Murphy
CPC classification number: C23C16/06 , C23C16/56 , G01R33/04 , G01R33/045 , G01R33/05
Abstract: A method of magnetic forming an integrated fluxgate sensor includes providing a patterned magnetic core on a first nonmagnetic metal or metal alloy layer on a dielectric layer over a first metal layer that is on or in an interlevel dielectric layer (ILD) which is on a substrate. A second nonmagnetic metal or metal alloy layer is deposited including over and on sidewalls of the magnetic core. The second nonmagnetic metal or metal alloy layer is patterned, where after patterning the second nonmagnetic metal or metal alloy layer together with the first nonmagnetic metal or metal alloy layer encapsulates the magnetic core to form an encapsulated magnetic core. After patterning, the encapsulated magnetic core is magnetic field annealed using an applied magnetic field having a magnetic field strength of at least 0.1 T at a temperature of at least 150° C.
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公开(公告)号：US09893119B2
公开(公告)日：2018-02-13
申请号：US15070413
申请日：2016-03-15
Applicant: Texas Instruments Incorporated
Inventor： Dok Won Lee , William David French , Keith Ryan Green
CPC classification number: H01L27/22 , H01L43/04 , H01L43/065 , H01L43/14
Abstract: Disclosed examples provide wafer-level integration of magnetoresistive sensors and Hall-effect sensors in a single integrated circuit, in which one or more vertical and/or horizontal Hall sensors are formed on or in a substrate along with transistors and other circuitry, and a magnetoresistive sensor circuit is formed in the IC metallization structure.
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