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    AROMATIC POLYESTER HAVING EXCELLENT FLUIDITY AND HEAT-RESISTANCE
    11.
    发明专利
    AROMATIC POLYESTER HAVING EXCELLENT FLUIDITY AND HEAT-RESISTANCE 失效

    公开(公告)号：JPS63280732A

    公开(公告)日：1988-11-17

    申请号：JP11747787

    申请日：1987-05-14

    Applicant: TORAY INDUSTRIES

    Inventor： OKAMOTO MASARU ,  INOUE SHUNEI ,  KATAOKA SHIRO

    IPC: C08G63/60 ,  C08G63/682 ,  C09K19/38

    Abstract: PURPOSE:To obtain the titled melt-moldable polyester having excellent fluidity, heat-resistance and mechanical properties and suitable as electronic and electrical apparatus parts, etc., by copolymerizing plural kinds of aromatic dihydroxy compounds at a specific ratio. CONSTITUTION:The objective polyester having a logarithmic viscosity of 1.0-20.0dl/g can be produced by (1) mixing (A) p-hydroxybenzoic acid forming the structural unit of formula I, (B) terephthalic acid and/or isophthalic acid forming a part of the structural unit of formula II, (C) 4,4'-dihydroxybiphenyl forming the remaining part of the structural unit of formula II, (D) t- butylhydroquinone forming a part of the structural unit of formula III and, if necessary, (E) hydroquinone, etc., forming a part of the structural unit of formula IV (X is group of formula V, etc.) and (2) subjecting the mixture e.g. to deacetylation polycondensation reaction. The amount of the unit of formula I in the mixture is 30-90mol.% and the molar ratios of II/III and IV/(II+III+ IV) are 5/95-20/80 and 0-40mol.%, respectively.

    HEAT-RESISTANT AROMATIC POLYESTER OF GOOD FLOW
    12.
    发明专利
    HEAT-RESISTANT AROMATIC POLYESTER OF GOOD FLOW 失效

    公开(公告)号：JPS63112620A

    公开(公告)日：1988-05-17

    申请号：JP25578486

    申请日：1986-10-29

    Applicant: TORAY INDUSTRIES

    Inventor： INOUE SHUNEI ,  OKAMOTO MASARU ,  KATAOKA SHIRO

    IPC: C08G63/60 ,  C08G63/682

    Abstract: PURPOSE:To obtain the title polyester which can give a molding excellent in flow, heat resistance, optical anisotropy and mechanical properties, comprising four specified kinds of structural units. CONSTITUTION:An acylation product (A) of a hydroxycarboxylic acid such as p-hydroxybenzoic acid, an acylation product (B) of an aromatic dihydroxy compound, such as t-butylhydroquinone diacetate or 2,6-diacetoxynaphthalene, and an aromatic dicarboxylic acid (C) such as terephthalic acid are subjected to polycondensation through elimination of acetic acid to obtain the title polyester comprising 40-90mol% structural units of formula I and 60-10mol% structural units of formulas II-IV (wherein X is a group of any one of formulas V-IX or the like, Y is a group of formula V, VII or IX, provided that a combination in which X is a group of formulas VI and/or VII and Y is a group of formula V is excluded) and having a molar ratio (units of formula II/units of formula III) of 8-2/2-8 and a ratio (units of formula IV/units of formulas II-IV) of 0-40mol%. This polyester is melt-molded at a temperature

    AROMATIC POLYESTER HAVING IMPROVED FLUIDITY
    13.
    发明专利
    AROMATIC POLYESTER HAVING IMPROVED FLUIDITY 失效

    公开(公告)号：JPS6333418A

    公开(公告)日：1988-02-13

    申请号：JP17574286

    申请日：1986-07-28

    Applicant: TORAY INDUSTRIES

    Inventor： OKAMOTO MASARU ,  INOUE SHUNEI ,  KATAOKA SHIRO

    IPC: C08G63/60 ,  C09K19/38

    Abstract: PURPOSE:To provide the titled novel aromatic polyester having a specific structure and composition composed of a condensation product of an aromatic oxycarboxylic acid, an aromatic dicarboxylic acid and a bisphenol compound, moldable by meltmolding and having excellent fluidity, heat-resistance and mechanical properties. CONSTITUTION:The objective polyester composed of the units of formula I-IV [X is (substituted) phenylene, biphenylene, naphthylene, etc.; Y is phenylene, biphenylene, naphthylene, etc.] and having a longarithmic viscosity of 0.5-15dl/g measured in pentafluorophenol (0.1g/dl concentration at 60 deg.C) can be produced by deacetylation polymerization of p-acetoxybenzoic acid, a substituted hydroquinone, diacetate of bisphenol compound, etc., and terephthalic acid, etc., in nitrogen gas atmosphere. The ratio of the structural unit of formula I in the above polymer is 40-90mol% and that of the structural units of formula II-IV is 60.10mol%. The molar ratio of the unit of formula II/III is 8/2-2/8 and that of IV/(II-IV) is 1-40mol%.

    PRODUCTION OF POLYAMIDE RESIN FOR BLOW MOLDING
    16.
    发明专利
    PRODUCTION OF POLYAMIDE RESIN FOR BLOW MOLDING 失效

    公开(公告)号：JPH04337323A

    公开(公告)日：1992-11-25

    申请号：JP11063991

    申请日：1991-05-15

    Applicant: TORAY INDUSTRIES

    Inventor： KATAOKA SHIRO ,  ONISHI KOJI ,  IWAMOTO MASAAKI

    IPC: C08G69/26 ,  C08G69/28

    Abstract: PURPOSE:To obtain the title resin having balanced physical properties of heat resistance, chemical resistance, low water absorption properties, resistance to road antifreezing agent and dimensional stability and improved residence stability in molten state by polymerizing a raw material monomer component of specific composition by a specific method. CONSTITUTION:First, polycondensation is carried out by using 0.1-3mol% end terminating agent (e.g. acetic acid or ethylenediamine) based on number of total mols of monomers comprising (A) 50-90wt.% hexamethylene adipamide component, (B) 5-40wt.% hexamethylene terephthalamide and (C) 5-30wt.% hexamethylene isophtalamide to give a condensate having 1.5-2.5 relative viscosity etar. Then the condensate is highly polymerized by solid-phase polymerization and/or melt extruder to give the objective resin. In highly polymerizing the polyamide condensate, phosphoric acid or pyrophosphoric acid is preferably used as a catalyst.

    POLYAMIDE BLOW MOLDING
    17.
    发明专利
    POLYAMIDE BLOW MOLDING 失效

    公开(公告)号：JPH04288339A

    公开(公告)日：1992-10-13

    申请号：JP5287691

    申请日：1991-03-18

    Applicant: TORAY INDUSTRIES

    Inventor： ONISHI KOJI ,  KATAOKA SHIRO ,  IWAMOTO MASAAKI

    IPC: B29C49/00 ,  B29K77/00 ,  C08J5/00 ,  C08L77/00

    Abstract: PURPOSE:To produce a polyamide blow molding especially a three-dimensional blow molding excellent in heat resistance, residence stability in a molten state and impact resistance by mixing a specified polyamide with a specified resin and a heat resistance improver to form an intimate mixture improved in residence characteristics in a molten state. CONSTITUTION:A polyamide blow molding made from a mixture of 100 pts.wt. intimate mixture comprising 50-95wt.% crystalline polyamide (A) comprising 50-90wt.% hexamethyleneadipamide component, 5-40wt.% hexamethyleneterephthalamide component and 5-30wt.% hexamethyleneisophthalamide component and satisfying the relationships: melting temperature (Tm)>=225 deg.C and crystallization temperature (Tc)

    FLAME-RETARDANT POLYAMIDE RESIN COMPOSITION
    19.
    发明专利
    FLAME-RETARDANT POLYAMIDE RESIN COMPOSITION 失效

    公开(公告)号：JPH04175371A

    公开(公告)日：1992-06-23

    申请号：JP33973090

    申请日：1990-11-30

    Applicant: TORAY INDUSTRIES

    Inventor： KATAOKA SHIRO ,  ONISHI KOJI ,  IWAMOTO MASAAKI

    IPC: C08K3/22 ,  C08K3/34 ,  C08K7/14 ,  C08L77/00

    Abstract: PURPOSE:To improve flame retardancy, mechanical properties, and thermal stability of the melt dwelling in a molding machine by compounding a thermoplastic polyamide resin and a poly(brominated styrene). CONSTITUTION:100 pts.wt. thermoplastic polyamide resin, 2-60 pts.wt. poly(brominated styrene) which is obtd. by radical polymerizing a monomer component contg. at least 60 wt. % dibrominated styrene, mainly comprises structural units of the formula, and has a number average mol.wt. of 1X10 -30X10 , and 200 pts.wt. or lower filler (e.g. glass fiber) are compounded.

    POLYAMIDE RESIN COMPOSITION
    20.
    发明专利
    POLYAMIDE RESIN COMPOSITION 失效

    公开(公告)号：JPH0376755A

    公开(公告)日：1991-04-02

    申请号：JP21215989

    申请日：1989-08-17

    Applicant: TORAY INDUSTRIES

    Inventor： KATAOKA SHIRO ,  ONISHI KOJI ,  CHIBA KAZUMASA

    IPC: C08L77/00 ,  C08K3/16 ,  C08K5/353

    Abstract: PURPOSE:To obtain the title composition which does not corrode coexistent metals, such as copper (alloy), in a high temperature environment and has excellent heat resistance by incorporating a copper halide, an alkali metal halide, and a specified oxazole compound each in a specified amount into a polyamide resin. CONSTITUTION:The title composition is prepared by mixing 100 pts.wt. polyamide resin (e.g. polyhexamethyleneadipamide) with 0.001-1 pt.wt. copper halide (e.g. CuI), 0.01-5 pts.wt. alkali metal halide (e.g. KI), and 0.005-5 pts.wt. oxazole compound selected from compounds of formulas I to X [wherein R1 to R7 are each H, phenyl, benzyl, alkyl, nitro, (alkyl)amino, carboxyl (except for N- substituted carboxyl), hydroxyl, alkoxy, aryl, phenoxy, halogen, anilino, tolyl or benzyloxy].

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