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公开(公告)号：JP2011116886A
公开(公告)日：2011-06-16
申请号：JP2009276660
申请日：2009-12-04
Applicant: Ube Industries Ltd , 宇部興産株式会社
Inventor： MAEDA SHUICHI , NAKAGAWA TOMOYUKI , KURACHI KOICHIRO , OKUSHITA YOJI
Abstract: PROBLEM TO BE SOLVED: To provide an industrial tube having a polyamide resin layer which is excellent in impermeability to various liquids, vapors and/or gases, has a wide moldable temperature range and superior melt-moldability, and is excellent in low water absorption property, chemical resistance, hydrolysis resistance, or the like. SOLUTION: The industrial tube includes a polyamide resin layer in which a dicarboxylic acid component is composed of oxalic acid, and a diamine component is composed of a mixture (hereinafter referred to as "C9-diamine mixture") comprising 1,9-nonanediamine and 2-methyl-1,8-octanediamine, and 1,6-hexanediamine (hereinafter referred to as "C6-diamine"), wherein the molar ratio of the C9-diamine mixture to the C6-diamine is 1:99 to 99:1. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation: 要解决的问题：为了提供具有对各种液体，蒸汽和/或气体的不渗透性优异的聚酰胺树脂层的工业管具有宽的成型温度范围和优异的熔融成型性，并且具有优异的低 吸水性，耐化学性，耐水解性等。 解决方案：工业管包括其中二羧酸组分由草酸组成的聚酰胺树脂层，二胺组分由以下组成的混合物（以下称为“C9-二胺混合物”）组成，其包含1,9 - 壬二胺和2-甲基-1,8-辛二胺和1,6-己二胺（以下称为“C6-二胺”），其中C9-二胺混合物与C6-二胺的摩尔比为1:99 至99：1。 版权所有（C）2011，JPO＆INPIT
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公开(公告)号：JP2001131203A
公开(公告)日：2001-05-15
申请号：JP31757199
申请日：1999-11-09
Applicant: UBE INDUSTRIES
Inventor： YOSHIKAWA MASAKAZU , MURAKAMI AKIRA , OKUSHITA YOJI
Abstract: PROBLEM TO BE SOLVED: To provide a film containing agar and/or agarose which has an almost uniform film thickness and good surface smoothness, and a method for preparation thereof. SOLUTION: A mixture of a compound containing agar and/or agarose and, as necessary, water is processed into a sheet-like gel, and the sheet-like gel is dried at 0-40 deg.C while a load of 0.01-2 kgf/cm2 is applied to the sheet-like gel to obtain a film containing agar and/or agarose. A porous material and/or a water-absorbing material are laminated to one or both surfaces of the sheet- like gel containing agar and/or agarose, and the sheet-like gel is dried at 0-40 deg.C while a load is applied to the sheet-like gel to obtain a film containing agar and/or agarose more efficiently.
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公开(公告)号：JP2001031761A
公开(公告)日：2001-02-06
申请号：JP21017499
申请日：1999-07-26
Applicant: UBE INDUSTRIES
Inventor： OKUSHITA YOJI , TANAKA SHOICHI
Abstract: PROBLEM TO BE SOLVED: To provide a polyamide excellent in stretchability, especially suitable for a successive biaxial orientation method. SOLUTION: The polyamide contains a unit comprising a lactone and/or an aminocarboxylic acid, a unit comprising a dicarboxylic acid and a unit comprising a diamine containing a 6-16C branched alicyclic diamine. Specifically, the polyamide contains 50-99.8 mol% of the lactone and/or the aminocarboxylic acid, 0.1-25 mol% of the dicarboxylic acid and 0.1-25 mol% of the diamine, wherein 10-100 mol% of the diamine is a 6-16C branched alicyclic diamine.
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公开(公告)号：JPH03281533A
公开(公告)日：1991-12-12
申请号：JP8230790
申请日：1990-03-29
Applicant: UBE INDUSTRIES
Inventor： OKAMOTO HIDEMASA , OKUSHITA YOJI
IPC: C08G69/48
Abstract: PURPOSE:To obtain the title polyamide improved in acid resistance, heat resistance and moisture permeability and useful as a gas separation material, etc., by modifying an alkylene oxide-grafted polyamide with polyacrylic acid. CONSTITUTION:An alkylene oxide-grafted polyamide is modified by dispersing the polyamide in water and adding an aqueous solution containing polyacrylic acid of 0.1-1.5mol based on 1mol graft polymer chain of the grafted polyamide to provide the objective modified polyamide. Furthermore, for example, a graft polyamide obtained by reacting a polyamide with ethylene oxide, etc., is preferably used as the objective grafted polyamide.
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公开(公告)号：JPH0351656B2
公开(公告)日：1991-08-07
申请号：JP15800985
申请日：1985-07-19
Applicant: UBE INDUSTRIES
Inventor： SHIMIZU TAKEO , OKUSHITA YOJI
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Patent Agency Ranking
公开(公告)号：JPH0248021B2
公开(公告)日：1990-10-23
申请号：JP664983
申请日：1983-01-20
Applicant: UBE INDUSTRIES
Inventor： OKAMOTO HIDEMASA , OKUSHITA YOJI
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公开(公告)号：JPS6412380B2
公开(公告)日：1989-02-28
申请号：JP19865181
申请日：1981-12-11
Applicant: UBE INDUSTRIES
Inventor： OKAMOTO HIDEMASA , OKUSHITA YOJI , ADACHI FUMIO , TAKAHASHI MAKOTO
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公开(公告)号：JPS6330320A
公开(公告)日：1988-02-09
申请号：JP17377186
申请日：1986-07-25
Applicant: UBE INDUSTRIES
Inventor： SHIMIZU TAKEO , OKUSHITA YOJI
Abstract: PURPOSE:To selectively separate and recover the titled gallium with a simple operation and a high separating and recovering ratio, even in a strong basic solution by using a specific water soluble oligomer or polymer having chelate forming ability, and by contacting said oligomer or polymer with a Ga contg. solution through a film. CONSTITUTION:Said water soluble oligomer or polymer comprises those having a substd. hydroxyquinoline contg. the substituent shown by the formula wherein R is 1-50C alkyl group obtd. by reacting 2-propyl-5-chloromethyl-8- hydroxyquinoline with polyethylene glycol. The Ga contg. solution (such as Bayer solution etc.) is contacted with said oligomer or polymer through the film which penetrates especially a metal ion or a hydrogen ion etc., and does not penetrate said water soluble oligomer or polymer (such as a thin film of a cellulose etc.). Thus, said method separates and recovers selectively the metal Ga with high selectivity and simple operation, even in the strong basic aqueous solution such as the Bayer solution.
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19.发明专利Polyamide resin for automobile component or for electric/electronic component, having small density change by heat treatment 审中-公开用于汽车部件或电/电子部件的聚酰胺树脂，通过热处理具有小密度变化
公开(公告)号：JP2011231167A
公开(公告)日：2011-11-17
申请号：JP2010100752
申请日：2010-04-26
Applicant: Ube Industries Ltd , 宇部興産株式会社
Inventor： NAKAGAWA TOMOYUKI , KURACHI KOICHIRO , MAEDA SHUICHI , OKUSHITA YOJI
IPC: C08G69/26
Abstract: PROBLEM TO BE SOLVED: To provide a polyamide resin having a small density change after heat treatment as compared with those of conventional aliphatic polyamide resins, without damaging a low water absorptivity, chemical resistance and hydrolysis resistance observed in the aliphatic linear polyoxamide resin.SOLUTION: The polyamide resin for an automobile component or an electric/electronic component having the small change in density by the heat treatment, consisting of oxalic acid as a dicarboxylic acid component and an aliphatic diamine as a diamine component is characterized by having 0.0 to +0.3% density change after the 48 hr treatment at a temperature higher than a glass transition temperature, obtained by a solid viscoelasticity measurement.
Abstract translation: 要解决的问题：为了提供与常规脂肪族聚酰胺树脂相比热处理后的密度变化小的聚酰胺树脂，不损害在脂族线性聚酰胺树脂中观察到的低吸水性，耐化学性和耐水解性 。 解决方案：作为二羧酸成分的草酸和作为二胺成分的脂肪族二胺，通过热处理具有小密度变化的汽车部件或电气/电子部件用聚酰胺树脂的特征在于，具有 在通过固体粘弹性测量获得的高于玻璃化转变温度的温度下处理48小时后，密度变化为0.0〜+ 0.3％。 版权所有（C）2012，JPO＆INPIT
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公开(公告)号：JP2011116889A
公开(公告)日：2011-06-16
申请号：JP2009276665
申请日：2009-12-04
Applicant: Ube Industries Ltd , 宇部興産株式会社
Inventor： MAEDA SHUICHI , NAKAGAWA TOMOYUKI , KURACHI KOICHIRO , OKUSHITA YOJI
IPC: C08G69/26
Abstract: PROBLEM TO BE SOLVED: To provide a polyamide resin composition for SMT connectors, which has a sufficiently high molecular weight although it has low water-absorbing property, and a wide moldable temperature range estimated from the difference between the melting point and the thermal decomposition temperature, is excellent in melt-moldability and mechanical strength, and further which is superior in chemical resistance, hydrolysis resistance, or the like in comparison with a conventional aliphatic polyamide resin. SOLUTION: The polyamide resin composition for SMT connectors includes an inorganic filler in a polyamide resin in which a carboxylic acid component is composed of oxalic acid, and a diamine component is composed of a mixture (hereinafter referred to as "C9-diamine mixture") comprising 1,9-nonanediamine and 2-methyl-1,8-octanediamine, and 1,6-hexanediamine (hereinafter referred to as "C6-diamine"), wherein the molar ratio of the C9-diamine mixture to the C6-diamine is 1:99 to 40:60. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation: 要解决的问题：为了提供一种具有足够高的分子量的SMT连接器的聚酰胺树脂组合物，尽管它具有低的吸水性，并且由熔点和 热分解温度，熔融成型性和机械强度优异，与以往的脂肪族聚酰胺树脂相比，耐化学性，耐水解性等优异。 解决方案：用于SMT连接器的聚酰胺树脂组合物包括其中羧酸组分由草酸组成的聚酰胺树脂中的无机填料，二胺组分由混合物（以下称为“C9-二胺” 混合物“），其包含1,9-壬二胺和2-甲基-1,8-辛二胺和1,6-己二胺（以下称为”C6-二胺“），其中C9-二胺混合物与 C6-二胺为1:99〜40:60。 版权所有（C）2011，JPO＆INPIT
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