公开(公告)号：US20240128626A1

公开(公告)日：2024-04-18

申请号：US18058799

申请日：2022-11-25

Applicant: Unimicron Technology Corp. ,  National Taiwan University

Inventor： Yu-Kuang WANG ,  Ruey-Beei Wu ,  Ching-Sheng Chen ,  Chun-Jui Huang ,  Wei-Yu Liao ,  Chi-Min Chang

IPC: H01P3/08 ,  H05K1/02

CPC classification number: H01P3/081 ,  H05K1/0237

Abstract: A transmission device includes a daisy chain structure composed of at least three daisy chain units arranged periodically and continuously. Each of the daisy chain units includes first, second and third conductive lines, and first and second conductive pillars. The first and second conductive lines at a first layer extend along a first direction and are discontinuously arranged. The third conductive line at a second layer extends along the first direction and is substantially parallel to the first and second conductive lines. The first conductive pillar extends in a second direction. The second direction is different from the first direction. A first part of the first conductive pillar is connected to the first and third conductive lines. The second conductive pillar extends in the second direction. A first part of the second conductive pillar is connected to the second and third conductive lines.

公开(公告)号：US20220232695A1

公开(公告)日：2022-07-21

申请号：US17711027

申请日：2022-04-01

Applicant: Unimicron Technology Corp.

Inventor： Jun-Rui Huang ,  Chih-Chiang Lu ,  Yi-Pin Lin ,  Ching-Sheng Chen

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/42 ,  H05K3/00

Abstract: A circuit board includes a first substrate, a second substrate, a third substrate, a plurality of conductive structures and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate has an opening and includes a first dielectric layer, a second dielectric layer, and a third dielectric layer. The opening penetrates the first dielectric layer and the second dielectric layer, and the third dielectric layer fully fills the opening. The conductive via structure penetrates the first substrate, the second substrate, the third dielectric layer of the third substrate, and is electrically connected to the first substrate and the third substrate to define a signal path. The first substrate, the second substrate, and the third substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.