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    MANUFACTURING METHOD OF CIRCUIT BOARD
    5.
    发明申请
    MANUFACTURING METHOD OF CIRCUIT BOARD 有权

    公开(公告)号：US20250056712A1

    公开(公告)日：2025-02-13

    申请号：US18930988

    申请日：2024-10-29

    Applicant: Unimicron Technology Corp.

    Inventor： Jun-Rui Huang ,  Chih-Chiang Lu ,  Yi-Pin Lin ,  Ching-Sheng Chen

    IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42

    Abstract: A manufacturing method of the circuit board includes the following. The third substrate has an opening and includes a first, a second and a third dielectric layers. The opening penetrates the first and the second dielectric layers, and the opening is fully filled with the third dielectric layer. The first, the second and the third substrates are press-fitted so that the second substrate is located between the first and the third substrates. Multiple conductive structures are formed so that the first, the second and the third substrates are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, and the third dielectric layer of the third substrate. The conductive via structure is electrically connected to the first and the third substrates to define a signal path. The ground path surrounds the signal path.

    Circuit board and manufacturing method thereof and electronic device
    6.
    发明授权
    Circuit board and manufacturing method thereof and electronic device 有权

    公开(公告)号：US12177964B2

    公开(公告)日：2024-12-24

    申请号：US17711027

    申请日：2022-04-01

    Applicant: Unimicron Technology Corp.

    Inventor： Jun-Rui Huang ,  Chih-Chiang Lu ,  Yi-Pin Lin ,  Ching-Sheng Chen

    IPC: H05K1/02 ,  H01L23/498 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42

    Abstract: A circuit board includes a first substrate, a second substrate, a third substrate, a plurality of conductive structures and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate has an opening and includes a first dielectric layer, a second dielectric layer, and a third dielectric layer. The opening penetrates the first dielectric layer and the second dielectric layer, and the third dielectric layer fully fills the opening. The conductive via structure penetrates the first substrate, the second substrate, the third dielectric layer of the third substrate, and is electrically connected to the first substrate and the third substrate to define a signal path. The first substrate, the second substrate, and the third substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE
    7.
    发明申请
    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE 有权

    公开(公告)号：US20220232694A1

    公开(公告)日：2022-07-21

    申请号：US17496791

    申请日：2021-10-08

    Applicant: Unimicron Technology Corp.

    Inventor： Chih-Chiang Lu ,  Heng-Ming Nien ,  Ching-Sheng Chen ,  Ching Chang ,  Ming-Ting Chang ,  Chi-Min Chang ,  Shao-Chien Lee ,  Jun-Rui Huang ,  Shih-Lian Cheng

    IPC: H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/42

    Abstract: Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.

    Co-axial via structure
    8.
    发明授权
    Co-axial via structure 有权

    公开(公告)号：US11792918B2

    公开(公告)日：2023-10-17

    申请号：US17455918

    申请日：2021-11-21

    Applicant: Unimicron Technology Corp.

    Inventor： Pei-Wei Wang ,  Heng-Ming Nien ,  Ching-Sheng Chen ,  Yi-Pin Lin ,  Shih-Liang Cheng

    IPC: H05K1/02 ,  H05K1/11

    CPC classification number: H05K1/024 ,  H05K1/0222 ,  H05K1/112

    Abstract: A co-axial structure includes a substrate, a first conductive structure, a second conductive structure, and an insulating layer. The substrate includes a first surface. The first conductive structure includes a first circuit deposited on the first surface and a first via penetrating the substrate. The second conductive structure includes a second circuit deposited on the first surface and a second via penetrating the substrate. The first via and the second via extend along a first direction. The first circuit and the second circuit extend along a second direction, and the second direction is perpendicular to the first direction. The insulating layer is located between the first via and the second via. The insulating layer includes a filler. The first conductive structure and the second conductive structure are electrically insulated. The first circuit and the second circuit are coplanar.

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