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公开(公告)号：US11737209B2
公开(公告)日：2023-08-22
申请号：US17574551
申请日：2022-01-13
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Chi-Min Chang , Shao-Chien Lee , Jun-Rui Huang , Ming-Ting Chang
CPC classification number: H05K1/024 , H05K1/115 , H05K3/0011 , H05K3/10 , H05K3/42 , H05K3/4602 , H05K2201/0183 , H05K2201/09209 , H05K2203/0502
Abstract: A circuit board includes a first dielectric material, a second dielectric material, a third dielectric material, a first external circuit layer, a second external circuit layer, multiple conductive structures, and a conductive via structure. Dielectric constants of the first, the second and the third dielectric materials are different. The first and the second external circuit layers are respectively disposed on the first and the third dielectric materials. The conductive via structure at least penetrates the first and the second dielectric materials and is electrically connected to the first and the second external circuit layers to define a signal path. The conductive structures are electrically connected to each other and surround the first, the second and the third dielectric materials. The conductive structures are electrically connected to the first and the second external circuit layers to define a ground path surrounding the signal path.
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公开(公告)号：US20230124913A1
公开(公告)日：2023-04-20
申请号：US17705405
申请日：2022-03-28
Applicant: Unimicron Technology Corp.
Inventor： Heng-Ming Nien , Chih-Chiang Lu , Chih-Kai Chan , Shih-Lian Cheng
Abstract: An electroplating apparatus includes an anode and a cathode, a power supply, a regulating plate, and a controller. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes an insulation grid plate and a plurality of wires. The controller is electrically connected to the plurality of wires to control a state of an electromagnetic field around the plurality of wires. An electroplating method is also provided.
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公开(公告)号：US20230124732A1
公开(公告)日：2023-04-20
申请号：US17745809
申请日：2022-05-16
Applicant: Unimicron Technology Corp.
Inventor： Heng-Ming Nien , Chih-Chiang Lu , Cho-Ying Wu , Shih-Lian Cheng
IPC: C25D5/00
Abstract: An electroplating apparatus including an anode and a cathode, a power supply, and a regulating plate is provided. The power supply is electrically connected to the anode and the cathode. The regulating plate is arranged between the anode and the cathode. The regulating plate includes an insulating grid plate and a plurality of magnetic components. The plurality of magnetic components are uniformly and randomly arranged on the insulating grid plate. An electroplating method is also provided.
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公开(公告)号：US20230262880A1
公开(公告)日：2023-08-17
申请号：US18162713
申请日：2023-02-01
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Jun-Rui Huang , Ming-Hao Wu , Tung-Chang Lin
CPC classification number: H05K1/025 , H05K1/112 , H05K1/0216 , H05K2201/095
Abstract: Provided is a circuit board structure including a substrate, a loop-wrapping ground layer, an insulating structure, a first build-up layer, a top wiring layer, a bottom wiring layer, a first conductive via, and a plurality of second conductive vias. The aforementioned structure defines a signal transmitting structure. An equivalent circuit of the signal transmitting structure at least includes a first equivalent circuit, a second equivalent circuit, a third equivalent circuit and a fourth equivalent circuit, which correspond to different uniform transmitting sections respectively. The first equivalent circuit, the second equivalent circuit, the third equivalent circuit and the fourth equivalent circuit are connected in series with each other according to an ABCD transmission matrix series connection principle.
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公开(公告)号：US12256488B2
公开(公告)日：2025-03-18
申请号：US18162713
申请日：2023-02-01
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Jun-Rui Huang , Ming-Hao Wu , Tung-Chang Lin
Abstract: Provided is a circuit board structure including a substrate, a loop-wrapping ground layer, an insulating structure, a first build-up layer, a top wiring layer, a bottom wiring layer, a first conductive via, and a plurality of second conductive vias. The aforementioned structure defines a signal transmitting structure. An equivalent circuit of the signal transmitting structure at least includes a first equivalent circuit, a second equivalent circuit, a third equivalent circuit and a fourth equivalent circuit, which correspond to different uniform transmitting sections respectively. The first equivalent circuit, the second equivalent circuit, the third equivalent circuit and the fourth equivalent circuit are connected in series with each other according to an ABCD transmission matrix series connection principle.
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Patent Agency Ranking
公开(公告)号：US20240282687A1
公开(公告)日：2024-08-22
申请号：US18650005
申请日：2024-04-29
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Hsin-Ning Liu , Jun-Rui Huang , Pei-Wei Wang , Ching Sheng Chen , Shih-Lian Cheng
CPC classification number: H01L23/49827 , H01L21/4857 , H01L21/486 , H01L23/49822 , H05K1/0222 , H05K3/0094 , H05K3/429 , H05K3/4614 , H05K3/4623 , H01L24/16 , H01L2224/16227 , H05K2201/09509 , H05K2201/0959
Abstract: A manufacturing method of the circuit board includes the following steps. A metal layer, a first substrate, a second substrate, and a third substrate are laminated. Multiple blind holes and a through hole are formed. A conductive material layer is formed, which covers the metal layer, the conductive layer of the third substrate, and an inner wall of the through hole, and fills the blind holes to define multiple conductive holes. The conductive material layer, the metal layer, and the conductive layer are patterned to form a first external circuit layer located on the first substrate and electrically connected to the conductive pillars, and a second external circuit layer located on the insulating layer and electrically connected to the conductive holes, and define a conductive through hole structure connecting the first external circuit layer and the second external circuit layer and located in the through hole.
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公开(公告)号：US12052815B2
公开(公告)日：2024-07-30
申请号：US18447265
申请日：2023-08-09
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Heng-Ming Nien , Ching-Sheng Chen , Ching Chang , Ming-Ting Chang , Chi-Min Chang , Shao-Chien Lee , Jun-Rui Huang , Shih-Lian Cheng
CPC classification number: H05K1/0222 , H05K1/113 , H05K1/119 , H05K3/429 , H05K3/462 , H05K1/181 , H05K3/0094 , H05K3/24 , H05K2201/10734
Abstract: Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.
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公开(公告)号：US20230389172A1
公开(公告)日：2023-11-30
申请号：US18447265
申请日：2023-08-09
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Heng-Ming Nien , Ching-Sheng Chen , Ching Chang , Ming-Ting Chang , Chi-Min Chang , Shao-Chien Lee , Jun-Rui Huang , Shih-Lian Cheng
Abstract: Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.
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公开(公告)号：US11785707B2
公开(公告)日：2023-10-10
申请号：US17496791
申请日：2021-10-08
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Heng-Ming Nien , Ching-Sheng Chen , Ching Chang , Ming-Ting Chang , Chi-Min Chang , Shao-Chien Lee , Jun-Rui Huang , Shih-Lian Cheng
CPC classification number: H05K1/0222 , H05K1/113 , H05K1/119 , H05K3/429 , H05K3/462 , H05K1/181 , H05K3/0094 , H05K3/24 , H05K2201/10734
Abstract: Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.
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公开(公告)号：US20230262893A1
公开(公告)日：2023-08-17
申请号：US17894128
申请日：2022-08-23
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Jun-Rui Huang , Ming-Hao Wu , Yi-Pin Lin , Tung-Chang Lin
CPC classification number: H05K1/116 , H05K3/4644 , H05K3/0094 , H05K1/024 , H05K3/4038 , H05K2201/0187
Abstract: A circuit board, including a first dielectric material, a second dielectric material, a third dielectric material, a fourth dielectric material, a first external circuit layer, a second external circuit layer, a conductive structure, a first conductive via, and multiple second conductive vias, is provided. The first conductive via at least passes through the first dielectric material and the fourth dielectric material, and is electrically connected to the first external circuit layer and the second external circuit layer to define a signal path. The second conductive vias pass through the first dielectric material, the second dielectric material, the third dielectric material, and a part of the conductive structure, and surround the first conductive via. The second conductive vias are electrically connected to the first external circuit layer, the conductive structure, and the second external circuit layer to define a ground path, and the ground path surrounds the signal path.
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