公开(公告)号：US6128818A

公开(公告)日：2000-10-10

申请号：US312198

申请日：1999-05-14

Applicant: Donald D. Baldwin

Inventor： Donald D. Baldwin

IPC: B23K1/00 ,  B23K3/08 ,  B23K31/12 ,  B23Q3/154 ,  G01R1/04 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34

CPC classification number: B23K31/12 ,  B23K1/0016 ,  B23K3/087 ,  B23Q3/1546 ,  G01R1/04 ,  H05K3/303 ,  H05K3/325 ,  B23K2201/40 ,  B23K2201/42 ,  H05K2201/10689 ,  H05K2203/104 ,  H05K2203/1394 ,  H05K2203/162 ,  H05K3/3421 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/53083 ,  Y10T29/53183 ,  Y10T29/53196

Abstract: An integrated circuit (IC) device is mounted onto a printed circuit board (PCB) by inducing a magnetic field of a selected strength at the surface of the PCB to temporarily hold the IC device onto the PCB. The IC device is provided with magnetic material which is attracted by the magnetic field. The magnetic field is maintained while the IC device and PCB are tested, and then subsequently during soldering when the IC device is permanently bonded to the PCB.

Abstract translation: 通过在PCB的表面处引入选定强度的磁场将IC器件临时保持在PCB上，将集成电路（IC）器件安装到印刷电路板（PCB）上。 IC器件具有被磁场吸引的磁性材料。 当IC器件和PCB被测试时，然后在IC器件永久地接合到PCB时在焊接期间保持磁场。

公开(公告)号：US6116497A

公开(公告)日：2000-09-12

申请号：US952912

申请日：1997-12-12

Applicant: Wolfgang Scheel ,  Karl Ring ,  Willi Hafner ,  Helmut Leicht

Inventor： Wolfgang Scheel ,  Karl Ring ,  Willi Hafner ,  Helmut Leicht

IPC: B23K1/015 ,  H05K3/34 ,  B23K1/08

CPC classification number: B23K1/015 ,  H05K3/3494 ,  B23K2201/40 ,  H05K2203/088 ,  H05K3/3415 ,  H05K3/3468

Abstract: A method of and an apparatus for vapor phase/solder wave soldering contacts of electronic components including temperature sensitive portions in wh the components while moving through a soldering chamber are only partially immersed in a saturated vapor whereas the contacts are wholly immersed in the vapor. A solder wave having a crest substantially coinciding with the components to be soldered is provided within the saturated vapor and a layer of an inert gas is provided above the vapor ceiling.

Abstract translation: PCT No.PCT / DE96 / 00968 Sec。 371日期1997年12月12日 102（e）日期1997年12月12日PCT提交1996年5月24日PCT公布。 出版物WO96 / 37330 PCT 日期1996年11月28日一种包括温度敏感部分的电子部件的气相/焊波波峰焊接触点的方法和装置，其中通过焊接室移动的部件仅部分浸没在饱和蒸气中，而触点完全浸没 在蒸汽中。 在饱和蒸汽内设置具有基本上与要焊接的部件重合的波峰的焊波，并且在蒸汽天花板上方设置惰性气体层。

公开(公告)号：US6068175A

公开(公告)日：2000-05-30

申请号：US162739

申请日：1998-09-29

Applicant: Craig G. Heim ,  Russell H. Lewis ,  Mark V. Pierson ,  Karl J. Puttlitz

Inventor： Craig G. Heim ,  Russell H. Lewis ,  Mark V. Pierson ,  Karl J. Puttlitz

IPC: B23K1/012 ,  B23K3/08 ,  C08G61/00 ,  C08G63/91 ,  C08L63/00 ,  C08L67/02 ,  C08L71/12 ,  H05K3/34 ,  B23K37/02 ,  B23K1/00 ,  B23K5/00 ,  B23K31/00 ,  B23K31/02

CPC classification number: H05K3/3494 ,  B23K1/012 ,  B23K3/08 ,  C08G61/00 ,  C08G63/914 ,  C08L63/00 ,  C08L67/02 ,  C08L71/126 ,  H01L24/75 ,  H05K3/3415 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2224/16225 ,  H05K2201/10734 ,  H05K2203/0173 ,  H05K2203/081 ,  H05K2203/1105 ,  H05K2203/1572 ,  H05K2203/176 ,  H05K3/3436 ,  Y02P70/613 ,  Y10S29/024 ,  Y10S29/044 ,  Y10T29/49144 ,  Y10T29/53191 ,  Y10T29/53265

Abstract: Apparatus for connecting a first area array component to a substrate with a joining material. The apparatus has a nozzle directing heat toward both the first area array component and the portion of the substrate beneath the first area array component to melt the joining material. An elastic seal contacts the substrate and prevents the heat from affecting other components adjacent the first area array component. The nozzle is pressed against the substrate to restrain warping of the substrate, which might be caused by the heating of the first area array component, and to prevent damage to the substrate. The nozzle can tilt so that it conforms to the surface of the substrate. The first area array component is allowed to move freely in the direction of a plane of the substrate under the surface tension of the molten joining material during heating to center the first area array component.

Abstract translation: 用于使用接合材料将第一区域阵列部件连接到基板的装置。 该装置具有将第一区域阵列部件和第一区域阵列部件下方的基板部分朝着第二区域阵列部件的两个热导向的喷嘴，以熔化接合材料。 弹性密封件接触基板并防止热量影响与第一区域阵列部件相邻的其他部件。 喷嘴被压靠在基板上以抑制基板的翘曲，这可能是由第一区域阵列部件的加热引起的，并且防止损坏基板。 喷嘴可以倾斜使其符合基板的表面。 允许第一区域阵列部件在加热期间在熔融接合材料的表面张力下在基板的平面方向上自由移动以使第一区域阵列部件居中。

公开(公告)号：US6047468A

公开(公告)日：2000-04-11

申请号：US15285

申请日：1998-01-29

Applicant: Rich Fogal ,  Michael B. Ball

Inventor： Rich Fogal ,  Michael B. Ball

IPC: B23K20/00 ,  H01L21/48 ,  H01L21/603 ,  H01R43/00

CPC classification number: H01L24/85 ,  B23K20/004 ,  H01L21/4825 ,  H01L24/05 ,  H01L24/06 ,  H01L24/78 ,  B23K2201/40 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/48091 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/78 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

Abstract: An apparatus for stabilizing a semiconductor die and lead fingers of a lead frame during the process of wire bonding comprising a rigid clamp having at least one bond site window extending therethrough and at least one resilient secondary clamp which extends from an edge of the bond site window to a position over and in contact with lead fingers extending over the semiconductor die. The arrangement of the secondary clamp is such that the contact force with the semiconductor die is sufficient to minimize, dampen, or prevent movement of the semiconductor die and/or lead finger bounce during the wire bonding process. Methods of clamping are also disclosed.

Abstract translation: 一种用于在引线接合过程中稳定引线框架的半导体管芯和引线指的装置，包括刚性夹具，所述刚性夹具具有延伸穿过其中的至少一个结合部位窗口，以及至少一个弹性副夹持件，其从所述粘结部位窗口的边缘延伸 到位于半导体管芯上方延伸并与铅指接触的位置。 次级夹具的布置使得与半导体管芯的接触力足以在引线接合过程期间最小化，抑制或防止半导体管芯和/或引线指的反弹移动。 还公开了夹紧方法。

公开(公告)号：US6023039A

公开(公告)日：2000-02-08

申请号：US960043

申请日：1997-10-29

Applicant: Hiroshi Sawada

Inventor： Hiroshi Sawada

IPC: B23K26/40 ,  C03B33/09 ,  H01L21/301 ,  B23K26/00

CPC classification number: C03B33/091 ,  B23K26/40 ,  B23K2201/40 ,  B23K2203/50 ,  Y10T225/10 ,  Y10T225/304

Abstract: A method of cleaving a strip by tensile stress applied by a pulse laser point heat source by shifting a pulse-heating position of the pulse laser point heat source on the basis of both an optimum distance "D" of a center position of a pulse beam spot of the pulse laser point heat source irradiated on the strip from a tip of a crack of the strip and an optimum pulse time "t" of the pulse laser point heat source, wherein the optimum distance "D" is determined by the steps of: selecting "t" to find a value of 4.kappa.t/W.sup.2 where ".kappa." is a thermal diffusivity of the strip, "W" is a width defined as a distance between a cleaving-intended line and a side edge of the strip; and finding an optimum value of D/W from the value of 4.kappa.t/W.sup.2 with reference to a previously obtained relationship between the optimum value of D/W and the value of 4.kappa.t/W.sup.2 thereby to find the optimum distance "D". The optimum distance "D" is found so that if the value of 4.kappa.t/W.sup.2 is in the range of 0.0001-0.05, then the optimum value of D/W is 0.1, if the value of 4.kappa.t/W.sup.2 is in the range of 0.05-1.0, then the optimum value of D/W is 0.2, and if the value of 4.kappa.t/W.sup.2 is not less than 1.0, then the optimum value of D/W is 0.4.

Abstract translation: 根据脉冲激光点热源的中心位置的最佳距离“D”移动脉冲激光点热源的脉冲加热位置，通过由脉冲激光点热源施加的拉伸应力来切断条带的方法 脉冲激光点热源的点从条带的裂纹尖端照射到条带上，并且脉冲激光点热源的最佳脉冲时间“t”，其中最佳距离“D”由以下步骤确定： ：选择“t”以找到4kappa t / W2的值，其中“kappa”是条带的热扩散系数，“W”是被定义为条带的切割预期线和侧边之间的距离的宽度 ; 并参照先前获得的D / W的最佳值与4kappa / w的值之间的关系，从4kappa / W2的值求出D / W的最佳值，从而找到最佳距离“D “。 找到最佳距离“D”，如果4kappa / W2的值在0.0001-0.05的范围内，则D / W的最佳值为0.1，如果4kappa / W2的值在 范围为0.05-1.0，则D / W的最佳值为0.2，如果4 kappa / W2的值不小于1.0，则D / W的最佳值为0.4。

公开(公告)号：US6018144A

公开(公告)日：2000-01-25

申请号：US197176

申请日：1998-11-20

Applicant: Lester H. Vogt ,  Douglas A. Bolton

Inventor： Lester H. Vogt ,  Douglas A. Bolton

IPC: B23K1/008 ,  F27B9/06 ,  H01L21/00 ,  F27B9/24 ,  F27B9/36

CPC classification number: H01L21/67248 ,  B23K1/008 ,  F27B9/066 ,  H01L21/67115 ,  B23K2201/40

Abstract: A method of conveying moieties through an infrared conveyor furnace with controllable point source radiation elements incorporating a clean room internal environment. The method comprises the steps of transporting moieties in an indexed manner through multiple heating zones heated by arrays of lamps; and dividing the lamps of each array into a plurality of groups which are separately controlled to maintain a constant temperature across the surface of the moiety. The method further comprises controlling the lamp groups through the use of a controller utilizing data from FTIR sensors mounted in a fused quartz barrier which is permeable by infrared radiation but which seals the lamp arrays from the heating zones.

Abstract translation: 通过包含洁净室内环境的可控点源辐射元件通过红外输送炉输送部分的方法。 该方法包括以指数方式将部分输送通过由灯阵列加热的多个加热区的步骤; 并且将每个阵列的灯分成多个组，这些组被单独控制以保持跨部分表面的恒定温度。 该方法还包括通过使用控制器来控制灯组，该控制器利用安装在通过红外辐射但可将灯阵列与加热区密封的熔融石英屏障中的FTIR传感器的数据。

公开(公告)号：US5998759A

公开(公告)日：1999-12-07

申请号：US774107

申请日：1996-12-24

Applicant: Donald V. Smart

Inventor： Donald V. Smart

IPC: H01L21/768 ,  B23K26/00

CPC classification number: H01L21/76894 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/362 ,  B23K26/40 ,  B23K26/402 ,  B23K2201/40 ,  B23K2203/42 ,  B23K2203/50

Abstract: A controlled, switched laser system for vaporizing a target structure on a substrate includes a diode-pumped, solid-state laser for producing a laser output, a controllable switch for controlling the on/off state and power level of the laser, and a wavelength shifter. The wavelength shifter shifts the wavelength of the laser output from a conventional wavelength to a wavelength beyond the absorption edge of the substrate but shorter than 1.2 .mu.m in order to obtain a decrease in absorption of the laser output by the substrate due to the shift in the wavelength of the laser output. The wavelength shifter is removably insertable into the switched laser system so as to enable the switched laser system to operate at the conventional wavelength and at the wavelength beyond the absorption edge of the substrate. Heating of the substrate and hence damage to the substrate is limited due to the wavelength being beyond the absorption edge of the substrate. Good depth of focus of the laser beam output is maintained relative to spot size of the laser beam output due to the wavelength being less than about 1.2 .mu.m.

Abstract translation: 用于蒸发衬底上的目标结构的受控切换激光系统包括用于产生激光输出的二极管泵浦固体激光器，用于控制激光器的开/关状态和功率电平的可控开关，以及波长 移位器 波长移位器将激光输出的波长从常规波长移动到超过基板的吸收边缘的波长但短于1.2μm，以便由于基板的偏移而使基板的激光输出的吸收降低 激光输出的波长。 波长移位器可移除地插入到切换的激光系统中，以便使切换的激光系统能够以常规波长和超过基板的吸收边缘的波长进行操作。 由于波长超过衬底的吸收边缘，衬底的加热和衬底的损坏受到限制。 由于波长小于约1.2μm，激光束输出的良好的聚焦深度保持相对于激光束输出的光斑尺寸。

公开(公告)号：US5988480A

公开(公告)日：1999-11-23

申请号：US989578

申请日：1997-12-12

Applicant: Warren M. Farnworth

Inventor： Warren M. Farnworth

IPC: B23K3/06 ,  B23K20/00 ,  B23K35/14 ,  B41J2/09 ,  H01L21/00 ,  H01L21/607 ,  H05K3/34 ,  B23K1/00 ,  B23K31/02 ,  B41J2/105

CPC classification number: H01L21/6715 ,  B23K20/004 ,  B23K3/0623 ,  B41J2/085 ,  B41J2/09 ,  G01N33/6842 ,  H01L21/67144 ,  H05K3/3457 ,  B22F2009/0836 ,  B23K2201/40 ,  H05K2203/013 ,  H05K2203/105

Abstract: A solder jet apparatus is disclosed The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface in any desired X-Y plane. This allows for greater accuracy as well as greater product throughput. Additionally, with the raster scan system, repairs to existing soldered surfaces can be quickly and easily performed using a map of the defects for directing the solder to the defects.

公开(公告)号：US5971058A

公开(公告)日：1999-10-26

申请号：US876140

申请日：1997-06-13

Applicant: Lannie R. Bolde ,  James H. Covell, II

Inventor： Lannie R. Bolde ,  James H. Covell, II

IPC: B23K3/06 ,  H05K3/34 ,  B22D33/04

CPC classification number: B23K3/0607 ,  H05K3/3457 ,  B23K2201/40 ,  H05K2203/0113 ,  H05K2203/1545

Abstract: An apparatus and method are provided for continuously injecting molten solder into a plurality of molds for transfer of the formed solder mounds to electronic devices such as multilayer ceramic packages. A conventional injection molding apparatus is employed with a specially designed apparatus for forming the molds and preferably with a specially designed mold to provide a continuous molding process. The apparatus is preferably of a U-shaped configuration whereby molds are advanced under the molten solder reservoir and injection head by a preceding mold in the apparatus. The urging action of the preceding mold on the succeeding mold and, preferably in conjunction with the preferred mold design, enables a continuous method and apparatus for injecting molten solder into a plurality of molds. The preferred mold design utilizes an upper plate having mold opening, and a lower substrate or backing plate, with the length and width of the upper plate being slightly longer than the length and width of the lower substrate or late.

Abstract translation: 提供了一种装置和方法，用于将熔融焊料连续地注入多个模具中，以将形成的焊料块转移到电子器件如多层陶瓷封装。 常规的注射成型装置采用专门设计的用于形成模具的装置，优选地具有专门设计的模具以提供连续的模制工艺。 该装置优选为U形构造，由此模具在熔融的焊料储存器和注射头的前方通过前述的模具在装置中前进。 前一模具在后续模具上的推动作用，优选结合优选的模具设计，能够实现将熔融焊料注入多个模具中的连续方法和设备。 优选的模具设计利用具有模具开口的上板和下基板或背板，上板的长度和宽度比下基板的长度和宽度稍长，或较晚。

公开(公告)号：US5968389A

公开(公告)日：1999-10-19

申请号：US811046

申请日：1997-03-04

Applicant: Francois Marion ,  Jean-Marc DeBono ,  Jean-Louis Pornin ,  Bernard Tucek

Inventor： Francois Marion ,  Jean-Marc DeBono ,  Jean-Louis Pornin ,  Bernard Tucek

IPC: H01L23/12 ,  B23K1/00 ,  H01L21/60 ,  H01L23/34 ,  H05K3/34 ,  H01L21/58

CPC classification number: H01L24/81 ,  B23K1/0016 ,  H01L23/345 ,  B23K2201/40 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3431 ,  H05K3/3494

Abstract: A method and device for hybridization of components by solder beads on a substrate using an oven, comprising: raising the temperature of a heating element of the oven, with no contact either with substrate or with component, bringing substrate into thermal contact with heating element for time .DELTA.t, and uncoupling substrate and heating element at the end of time .DELTA.t.

Abstract translation: 一种用于使用烘箱在焊盘上通过焊料珠杂质组分的方法和装置，包括：提高烘箱加热元件的温度，不与衬底或组件接触，使衬底与加热元件热接触， 时间DELTA t，并在时间结束DELTA t解耦衬底和加热元件。