公开(公告)号：EP1474710A2

公开(公告)日：2004-11-10

申请号：EP03700802.6

申请日：2003-02-12

Applicant: Unaxis Balzers Limited

Inventor： EDLINGER, Johannes ,  HEINE-KEMPKENS, Claus ,  ZÜGER, Othmar

IPC: G02B5/18 ,  G02B5/30 ,  C03B37/012

CPC classification number: G02B1/118 ,  B01D21/0012 ,  B01D39/2051 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502753 ,  B01L3/502761 ,  B01L3/502792 ,  B01L2200/0647 ,  B01L2200/0668 ,  B01L2200/141 ,  B01L2300/0681 ,  B01L2300/0816 ,  B01L2300/0825 ,  B01L2300/16 ,  B01L2400/0406 ,  B01L2400/0409 ,  B01L2400/086 ,  B81B1/002 ,  B81B2201/047 ,  B81B2201/10 ,  B81B2203/0338 ,  B81C1/00119 ,  C23C14/04 ,  C23C14/046 ,  G02B5/1809 ,  G02B5/1847 ,  G02B5/3058 ,  G02B5/3083 ,  G02B2006/12097 ,  Y10S428/913 ,  Y10T428/24612 ,  Y10T428/24942 ,  Y10T428/249953 ,  Y10T428/249961 ,  Y10T428/249975 ,  Y10T428/249977 ,  Y10T428/249979 ,  Y10T428/24998 ,  Y10T428/31678 ,  Y10T436/111666 ,  Y10T436/112499 ,  Y10T436/25375 ,  Y10T436/255

Abstract: An optical component forming a wire grid polarizer comprising: a substrate and microchannels formed by side walls of adjacent microstructures on the substrate, the microchannels being filled with air, the microstructures being covered by a coating and the coating nearly or completely closing the microchannels to substantially separate the microchannels from the environment of the component. A method for producing such an optical component comprises the steps of: providing a substrate, providing microstructures on the substrate, wherein side walls of the microstructures form microchannels; and coating the microstructures thereby nearly or completely closing the microchannels to substantially separate the microchannels from the environment of the component.

公开(公告)号：EP0831963A1

公开(公告)日：1998-04-01

申请号：EP96920377.0

申请日：1996-05-21

Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA

Inventor： CHU, Wen-Hua ,  FERRARI, Mauro

IPC: A61F2 ,  A61K9 ,  B01D39 ,  B01D67 ,  B01D69 ,  B01D71 ,  B01J13 ,  B81B1 ,  B81C1 ,  C04B41 ,  C23C16 ,  G03F7 ,  H01L21

CPC classification number: A61K9/0097 ,  A61K9/0024 ,  B01D39/1692 ,  B01D39/20 ,  B01D67/003 ,  B01D67/0034 ,  B01D67/0058 ,  B01D67/0062 ,  B01D67/0072 ,  B01D69/02 ,  B01D69/12 ,  B01D71/02 ,  B01D2325/04 ,  B01J13/02 ,  B81B3/007 ,  B81B2201/10 ,  B81C1/00087 ,  B81C2201/014 ,  C04B41/4582 ,  C23C16/01 ,  G03F7/00 ,  G03F7/0015

Abstract: Surface micromachining and bulk micromachining are employed for realizing a porous membrane (102A) with a bulk substrate (106) to form a particle filter (100). The filter (100) is sufficiently sturdy to allow for easy handling. It may be used as a diffusion barrier and under high pressures. A disclosed etching fabrication method is simple, reliable, and integrated-circuit compatible, and thus amenable to mass production. Electronic circuitry may be integrated on the surface of filter (100), as may be desired for several purposes, such as fluid characterization, capsule formation, or self-cleaning or charging of the surface of filter (100).

公开(公告)号：US20150217997A1

公开(公告)日：2015-08-06

申请号：US14170187

申请日：2014-01-31

Applicant: Infineon Technologies AG

Inventor： Thomas Grille ,  Ursula Hedenig ,  Michael Roesner ,  Gudrun Stranzl ,  Martin Zgaga

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81B7/0061 ,  B01D67/0034 ,  B81B2201/0257 ,  B81B2201/10 ,  B81C1/00904 ,  B81C2201/0132 ,  Y10T428/24273

Abstract: A method for structuring a substrate and a structured substrate are disclosed. In an embodiment a method includes providing a substrate with a first main surface and a second main surface, wherein the substrate is fixed to a carrier arrangement at the second main surface, performing a photolithography step at the first main surface of the substrate to mark a plurality of sites at the first main surface, the plurality of sites corresponding to future perforation structures and future kerf regions for a plurality of future individual semiconductor chips to be obtained from the substrate, and plasma etching the substrate at the plurality of sites until the carrier arrangement is reached, thus creating the perforation structures within the plurality of individual semiconductor chips and simultaneously separating the individual semiconductor chips along the kerf regions.

Abstract translation: 公开了一种用于构造衬底和结构化衬底的方法。 在一个实施方案中，一种方法包括提供具有第一主表面和第二主表面的基底，其中所述基底固定到第二主表面处的载体布置，在所述基底的第一主表面处执行光刻步骤以标记 在第一主表面处的多个位置，对应于未来穿孔结构的多个部位以及从基板获得的多个未来单个半导体芯片的未来切割区域，以及在多个位置等离子体蚀刻基板，直到载体 从而在多个单独的半导体芯片内形成穿孔结构，同时沿着切口区分离各个半导体芯片。

公开(公告)号：US08529781B2

公开(公告)日：2013-09-10

申请号：US12308522

申请日：2007-05-04

Applicant: Tino Fuchs ,  Christina Leinenbach

Inventor： Tino Fuchs ,  Christina Leinenbach

IPC: H01L21/311 ,  H01L21/302 ,  C03C17/09 ,  C03C3/32 ,  H05H1/24 ,  B01D71/00

CPC classification number: B81C1/0069 ,  B01D61/243 ,  B01D67/003 ,  B01D67/0058 ,  B01D71/02 ,  B01D2323/35 ,  B01D2325/028 ,  B01D2325/08 ,  B01D2325/26 ,  B81B2201/10 ,  B81C2201/0115 ,  Y10T428/24893

Abstract: A method for producing a component, and a component, in particular a micromechanical and/or microfluidic and/or microelectronic component, is provided, the component including at least one patterned material region, and in a first step the patterned material region is produced in that microparticles of a first material are embedded in a matrix of a second material, and in a second step the patterned material region is rendered porous by etching using a dry etching method or a gas-phase etching method.

Abstract translation: 提供了一种用于制造组件和组件，特别是微机械和/或微流体和/或微电子部件的方法，所述部件包括至少一个图案化材料区域，并且在第一步骤中，图案化材料区域 将第一材料的微粒嵌入第二材料的基体中，在第二步骤中，通过使用干蚀刻法或气相蚀刻法蚀刻图案化材料区域而使多孔化。

公开(公告)号：US07252764B2

公开(公告)日：2007-08-07

申请号：US09855404

申请日：2001-05-15

Applicant: Axel Scherer

Inventor： Axel Scherer

IPC: B01D29/46

CPC classification number: F16K99/0001 ,  B01D61/18 ,  B01D67/0062 ,  B01D69/02 ,  B01D69/12 ,  B01D71/02 ,  B01D71/027 ,  B01D2325/04 ,  B01D2325/26 ,  B01L2400/082 ,  B81B1/004 ,  B81B2201/10 ,  B81C1/00087 ,  B81C2201/019 ,  B82Y30/00 ,  F15C5/00 ,  F16K99/0015 ,  F16K99/0042 ,  F16K99/0051 ,  F16K2099/0074 ,  F16K2099/008 ,  Y10S264/48

Abstract: The invention is a method for fabricating molecular filters which can separate objects approximately 1-5 nm in range, where the filtration size is controlled by using thin films of materials and technologies to form a filtration channel or pore in a middle thin film layer in a multilayered structure. Lithography is used to define two offset arrays of blind holes into the opposing sides of a multi-layer membrane. The blind holes extend across a thin central filtration layer. A selective etch is used to attack the filtration layer to form a communicating channel between the two holes. The only connection between one side of the filter and the other is through the channel in the filter layer, whose thickness, d, determines the largest size object which can traverse the filter.

Abstract translation: 本发明是一种制造分子过滤器的方法，其可以分离大约1-5nm范围内的物体，其中过滤尺寸通过使用材料和技术的薄膜来控制，以在中间薄膜层中形成过滤通道或孔 多层结构。 使用平版印刷术将盲孔的两个偏移阵列定义在多层膜的相对侧中。 盲孔延伸穿过薄的中央过滤层。 使用选择性蚀刻来攻击过滤层以在两个孔之间形成连通通道。 过滤器一侧之间的唯一连接是通过过滤层中的通道，其厚度d决定可以穿过过滤器的最大尺寸的物体。

公开(公告)号：US20040212028A1

公开(公告)日：2004-10-28

申请号：US10852833

申请日：2004-05-24

Inventor： George M. Dougherty

IPC: H01L021/00 ,  H01L029/82

CPC classification number: B81C1/00158 ,  B01D67/0072 ,  B01D71/02 ,  B01D2323/10 ,  B01D2325/02 ,  B01D2325/04 ,  B81B2201/10 ,  B81C2201/0115 ,  B81C2201/017 ,  H01L21/28525 ,  H01L29/16

Abstract: A membrane structure comprising a silicon film having a grain structure including grains defining pores therebetween.

Abstract translation: 一种膜结构，其包括具有晶粒结构的硅膜，所述晶粒结构包括在其间限定孔的颗粒。

公开(公告)号：US6044981A

公开(公告)日：2000-04-04

申请号：US139883

申请日：1998-08-25

Applicant: Wen-Hwa Chu ,  Mauro Ferrari

Inventor： Wen-Hwa Chu ,  Mauro Ferrari

IPC: A61K9/00 ,  A61K9/22 ,  A61K9/50 ,  A61K9/52 ,  B01D39/16 ,  B01D39/20 ,  B01D67/00 ,  B01D69/02 ,  B01D69/12 ,  B01D71/02 ,  B01J13/02 ,  B81B1/00 ,  B81C1/00 ,  C04B41/45 ,  C23C16/01 ,  G03F7/00 ,  B01D69/10 ,  B01D69/06 ,  C23F1/00

CPC classification number: G03F7/0015 ,  A61K9/0024 ,  A61K9/0097 ,  B01D39/1692 ,  B01D39/20 ,  B01D67/0058 ,  B01D67/0062 ,  B01D67/0072 ,  B01D67/0083 ,  B01D69/02 ,  B01D69/12 ,  B01D71/02 ,  B01J13/02 ,  B81B3/007 ,  B81C1/00087 ,  B81C1/00246 ,  C04B41/4582 ,  C23C16/01 ,  G03F7/00 ,  B01D2323/08 ,  B01D2323/10 ,  B01D2325/02 ,  B01D2325/04 ,  B81B2201/10 ,  B81C2201/014 ,  B81C2201/032 ,  B81C2203/0728 ,  B81C2203/075

Abstract: Microfabricated filters utilizing a bulk substrate structure and a thin film structure and a method for constructing such filters. The pores of the filters are defined by spaces between the bulk substrate structure and the thin film structure and are of substantially uniform width, length and distribution. The width of the pores is defined by the thickness of a sacrificial layer and therefore may be smaller than the limit of resolution obtainable with photolithography. The filters provide enhanced mechanical strength, chemical inertness, biological compatibility, and throughput. The filters are constructed using relatively simple fabrication techniques. Also, microfabricated containment wells and capsules constructed with such filters for the immunological isolation of cell transplants and a method for constructing such containment wells and capsules. The pores of the wells and capsules are large enough to let a desired biologically-active molecular product through, while blocking the passage of all larger immunological molecules. The containment wells and capsules provide enhanced biological compatibility and useful life.

Abstract translation: 利用大块基板结构和薄膜结构的微型滤波器及其构造方法。 过滤器的孔由体基板结构和薄膜结构之间的空间限定，并且具有基本均匀的宽度，长度和分布。 孔的宽度由牺牲层的厚度限定，因此可以小于通过光刻可获得的分辨率的极限。 过滤器提供增强的机械强度，化学惰性，生物相容性和生产能力。 使用相对简单的制造技术构造滤波器。 而且，用这种用于免疫分离细胞移植的过滤器构造的微制造安全壳和胶囊以及用于构建这种安全壳和胶囊的方法。 孔和胶囊的孔隙足够大以使期望的生物活性分子产物通过阻止所有较大免疫分子的通过。 安全壳和胶囊提供增强的生物相容性和使用寿命。

公开(公告)号：JP2009541080A

公开(公告)日：2009-11-26

申请号：JP2009517058

申请日：2007-05-04

Applicant: ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングRobert Bosch Gmbh

Inventor： ライネンバッハ クリスティーナ ,  フクス ティノ

IPC: B81C1/00 ,  B01D39/20

CPC classification number: B81C1/0069 ,  B01D61/243 ,  B01D67/003 ,  B01D67/0058 ,  B01D71/02 ,  B01D2323/35 ,  B01D2325/028 ,  B01D2325/08 ,  B01D2325/26 ,  B81B2201/10 ,  B81C2201/0115 ,  Y10T428/24893

Abstract: A method for producing a component, and a component, in particular a micromechanical and/or microfluidic and/or microelectronic component, is provided, the component including at least one patterned material region, and in a first step the patterned material region is produced in that microparticles of a first material are embedded in a matrix of a second material, and in a second step the patterned material region is rendered porous by etching using a dry etching method or a gas-phase etching method.

公开(公告)号：JP5355392B2

公开(公告)日：2013-11-27

申请号：JP2009517058

申请日：2007-05-04

Applicant: ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングRobert Bosch Gmbh

Inventor： フクス ティノ ,  ライネンバッハ クリスティーナ

IPC: B81C1/00 ,  B01D39/20

CPC classification number: B81C1/0069 ,  B01D61/243 ,  B01D67/003 ,  B01D67/0058 ,  B01D71/02 ,  B01D2323/35 ,  B01D2325/028 ,  B01D2325/08 ,  B01D2325/26 ,  B81B2201/10 ,  B81C2201/0115 ,  Y10T428/24893

Abstract: A method for producing a component, and a component, in particular a micromechanical and/or microfluidic and/or microelectronic component, is provided, the component including at least one patterned material region, and in a first step the patterned material region is produced in that microparticles of a first material are embedded in a matrix of a second material, and in a second step the patterned material region is rendered porous by etching using a dry etching method or a gas-phase etching method.

公开(公告)号：JP4373793B2

公开(公告)日：2009-11-25

申请号：JP2003568449

申请日：2003-02-12

Applicant: オー・ツェー・エリコン・バルザース・アクチェンゲゼルシャフトOC Oerlikon Balzers AG

Inventor： エードリンガー，ヨハネス ,  ツェーガー，オトマール ,  ハイネ−ケンプケンス，クラウス

IPC: G02B5/18 ,  B01D21/00 ,  B01D39/20 ,  B01L3/00 ,  B81B1/00 ,  C23C14/04 ,  G02B5/30 ,  G02B6/12

CPC classification number: G02B5/3058 ,  B01D21/0012 ,  B01D39/2051 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502753 ,  B01L3/502761 ,  B01L3/502792 ,  B01L2200/0647 ,  B01L2200/0668 ,  B01L2200/141 ,  B01L2300/0681 ,  B01L2300/0816 ,  B01L2300/0825 ,  B01L2300/16 ,  B01L2400/0406 ,  B01L2400/0409 ,  B01L2400/086 ,  B81B1/002 ,  B81B2201/047 ,  B81B2201/10 ,  B81B2203/0338 ,  B81C1/00119 ,  C23C14/04 ,  C23C14/046 ,  G02B1/118 ,  G02B5/1809 ,  G02B5/1847 ,  G02B5/3083 ,  G02B2006/12097 ,  Y10S428/913 ,  Y10T428/24612 ,  Y10T428/24942 ,  Y10T428/249953 ,  Y10T428/249961 ,  Y10T428/249975 ,  Y10T428/249977 ,  Y10T428/249979 ,  Y10T428/24998 ,  Y10T428/31678 ,  Y10T436/111666 ,  Y10T436/112499 ,  Y10T436/25375 ,  Y10T436/255

Abstract: An optical component forming a wire grid polarizer comprising: a substrate and microchannels formed by side walls of adjacent microstructures on the substrate, the microchannels being filled with air, the microstructures being covered by a coating and the coating nearly or completely closing the microchannels to substantially separate the microchannels from the environment of the component. A method for producing such an optical component comprises the steps of: providing a substrate, providing microstructures on the substrate, wherein side walls of the microstructures form microchannels; and coating the microstructures thereby nearly or completely closing the microchannels to substantially separate the microchannels from the environment of the component.