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公开(公告)号：US20160237278A1
公开(公告)日：2016-08-18
申请号：US15022154
申请日：2014-03-21
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Hu YANG , Yueshan HE
CPC classification number: C08L79/02 , B32B15/08 , B32B15/20 , B32B27/20 , B32B27/285 , B32B2264/102 , B32B2307/306 , B32B2307/3065 , C08G14/06 , C08J5/24 , C08J2371/12 , C08J2379/02 , C08J2425/10 , C08J2471/12 , C08K5/14 , C08K7/18 , C08L25/10 , C08L61/34 , C08L71/126 , C08L2201/02 , C08L2201/22 , C08L2205/03 , H05K1/0373 , H05K3/022 , H05K2201/012
Abstract: Disclosed are a halogen-free resin composition, and a prepreg and a laminate prepared by using the same. The halogen-free resin composition comprises the following components according to organic solid matters by weight parts: (A) 40-80 parts by weight of allyl modified benzoxazine resin; (B) 10-20 parts by weight of hydrocarbon resin; (C) 10-40 parts by weight of allyl modified polyphenylene oxide resin; (D) 0.01-3 parts by weight of initiating agent; (E) 10-100 parts by weight of filler; and (F) 0-80 parts by weight of phosphoric flame retardant. The prepreg and the laminate prepared by using the halogen-free resin composition have lower dielectric constant and lower dielectric loss tangent value, higher peeling strength, higher glass transition temperature, excellent heat resistance and good flame retardant effect.
Abstract translation: 公开了一种无卤树脂组合物，以及通过使用它们制备的预浸料和层压材料。 无卤树脂组合物按重量份含有以下成分：（A）40-80重量份烯丙基改性苯并恶嗪树脂; （B）10-20重量份烃树脂; （C）10-40重量份烯丙基改性聚苯醚树脂; （D）0.01-3重量份引发剂; （E）10-100重量份填料; 和（F）0-80重量份的磷酸阻燃剂。 通过使用无卤素树脂组合物制备的预浸料和层压体具有较低的介电常数和较低的介电损耗角正切值，较高的剥离强度，较高的玻璃化转变温度，优异的耐热性和良好的阻燃效果。
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公开(公告)号：US20160152808A1
公开(公告)日：2016-06-02
申请号：US14990849
申请日：2016-01-08
Applicant: ACTEGA DS GMBH
Inventor： Waldemar EICHLER , Rüdiger WITTENBERG
CPC classification number: C08L23/06 , B65D53/06 , C08K3/30 , C08L23/0815 , C08L23/0853 , C08L23/22 , C08L53/00 , C08L2201/08 , C08L2201/14 , C08L2201/22 , C08L2203/10 , C08L2205/025 , C08L2205/03 , C08L2205/035 , C08L2207/062 , C08L2207/066
Abstract: The invention relates to a polymer compound for a PVC-free sealing system for container closures, which is equipped with at least one oxygen-consuming compound, in which the Shore D hardness of the polymer compound is at least 20 and the polymer compound has a melt flow index (190° C., 5 kg) of at least 5.
Abstract translation: 本发明涉及一种用于容器封闭件的无PVC密封系统的高分子化合物，其具有至少一种耗氧化合物，其中高分子化合物的肖氏D硬度至少为20，高分子化合物具有 熔体流动指数（190℃，5kg）至少为5。
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公开(公告)号：US20160108230A1
公开(公告)日：2016-04-21
申请号：US14894868
申请日：2013-05-30
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Junqi TANG , Yongjing XU
CPC classification number: C08L63/04 , B32B15/14 , B32B15/20 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2307/204 , B32B2307/3065 , B32B2307/7246 , B32B2457/08 , C08J5/24 , C08J2361/14 , C08J2363/00 , C08J2363/04 , C08J2365/00 , C08J2461/14 , C08J2463/04 , C08L61/14 , C08L65/00 , C08L2201/02 , C08L2201/08 , C08L2201/22 , C08L2203/20 , C08L2205/025 , C08L2205/03 , H05K1/0353 , H05K1/0366 , H05K2201/0209
Abstract: The present invention relates to a cyanate resin composition, and a prepreg, a laminate, a metal foil clad laminate and a printed circuit board prepared by using same. The cyanate resin composition comprises a cyanate resin (A), an epoxy resin (B) with a structure of formula (I) and a maleimide compound (C). The cyanate resin composition of the present invention, and the prepreg, the laminate and the metal foil clad laminate prepared by using the cyanate resin composition have good moisture resistance, heat resistance, flame retardancy and reliability, and are suitable for being used as a substrate material for manufacturing a high-density printed circuit board.
Abstract translation: 本发明涉及氰酸酯树脂组合物，预浸料，层压体，覆盖金属箔的层压板和使用它们制成的印刷电路板。 氰酸酯树脂组合物包含氰酸酯树脂（A），具有式（I）结构的环氧树脂（B）和马来酰亚胺化合物（C）。 本发明的氰酸酯树脂组合物和通过使用氰酸酯树脂组合物制备的预浸料，层压体和金属箔覆层压板具有良好的耐湿性，耐热性，阻燃性和可靠性，并且适合用作基材 用于制造高密度印刷电路板的材料。
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公开(公告)号：WO2019100747A1
公开(公告)日：2019-05-31
申请号：PCT/CN2018/098270
申请日：2018-08-02
Applicant: 南通市东方塑胶有限公司
CPC classification number: C08K2201/011 , C08K2201/014 , C08L67/02 , C08L2201/02 , C08L2201/08 , C08L2201/22 , C08L2203/18 , C08L2205/025 , C08L2205/03
Abstract: 本发明公开了一种热收缩套管用无卤阻燃PET复合材料及制备方法，该无卤阻燃PET复合材料包含如下重量百分比的配方组成：PET树脂75-85％；有机阻燃剂10-20％；纳米蒙脱土1-3％；玻璃纤维1-4％；纳米二氧化硅1.7-3.5％；热稳定剂0.1-0.4％；抗氧剂0.1-0.4％；相容剂1-3％；分散剂0.1-0.5％；抗滴落剂0-0.5％。本发明制备的无卤阻燃PET复合材料具有优异的阻燃性和韧性，沸水收缩率达到45％。
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公开(公告)号：WO2014190529A1
公开(公告)日：2014-12-04
申请号：PCT/CN2013/076512
申请日：2013-05-30
Applicant: 广东生益科技股份有限公司
CPC classification number: C08L63/04 , B32B15/14 , B32B15/20 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2307/204 , B32B2307/3065 , B32B2307/7246 , B32B2457/08 , C08J5/24 , C08J2361/14 , C08J2363/00 , C08J2363/04 , C08J2365/00 , C08J2461/14 , C08J2463/04 , C08L61/14 , C08L65/00 , C08L2201/02 , C08L2201/08 , C08L2201/22 , C08L2203/20 , C08L2205/025 , C08L2205/03 , H05K1/0353 , H05K1/0366 , H05K2201/0209
Abstract: 一种氰酸酯树脂组合物及使用其制作的预浸料、层压板、覆金属箔层压板以及印刷线路板，所述氰酸酯树脂组合物包括氰酸酯树脂（A）、具有式（I）结构的环氧树脂（B）和马来酰亚胺化合物（C）。本发明的氰酸酯树脂组合物及使用其制得的预浸料、层压板、覆金属箔层压板具有良好的耐湿性、耐热性、阻燃性和可靠性，适合用于制作高密度印刷线路板的基板材料。
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Patent Agency Ranking
公开(公告)号：WO2016101540A1
公开(公告)日：2016-06-30
申请号：PCT/CN2015/080537
申请日：2015-06-01
Applicant: 广东生益科技股份有限公司
CPC classification number: C08L63/04 , C08G59/4071 , C08G59/4215 , C08G59/4238 , C08G59/4284 , C08G59/621 , C08G59/685 , C08G59/686 , C08J5/043 , C08J5/10 , C08J5/24 , C08J2363/04 , C08J2425/08 , C08J2461/14 , C08L63/00 , C08L2201/02 , C08L2201/22 , C08L2203/20 , C08L2205/05 , H05K1/0373 , C08L61/14 , C08L61/12 , C08L61/32
Abstract: 本发明提供了一种无卤环氧树脂组合物以及使用它的预浸料和层压板。该无卤环氧树脂组合物包括：(A)无卤环氧树脂；(B)交联剂；(C)含磷酚醛树脂，该含磷酚醛树脂为9，10-二氢-9-氧杂-10-磷菲-10-氧化物或其衍生物所取代的双环戊二烯酚与苯酚及甲醛合成的酚醛树脂。使用这种无卤环氧树脂组合物制成的预浸料和层压板，具有高耐热性、低介电常数、低介电损耗因素和低吸水率的优点，且能实现无卤阻燃。
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17.发明申请HALOGEN FREE FLAME RETARDANT POLYCARBONATE/THERMOPLASTIC POLYESTER MOLDING COMPOSITIONS WITH POLYMERIC PHOSPHORUS FLAME RETARDANT 审中-公开无卤阻燃聚碳酸酯/热塑性聚酯模塑组合物与聚合物磷阻燃剂
公开(公告)号：WO2015116509A1
公开(公告)日：2015-08-06
申请号：PCT/US2015/012813
申请日：2015-01-26
Applicant: SABIC GLOBAL TECHNOLOGIES B.V. , DING, Tianhua
Inventor： DING, Tianhua , SHEN, Dake , SHI, Hongtao , CHEN, Lin
CPC classification number: C08L69/00 , C08L67/02 , C08L2201/02 , C08L2201/22 , C08L2205/025 , C08L2205/03 , C08L2205/035 , C08L27/18 , C08L83/10 , C08L85/02
Abstract: This disclosure relates to halogen-free flame retardant polycarbonate/thermoplastic polyester molding compositions with improved mechanical properties and increased polyester loading level. More particularly, the disclosure relates to halogen-free polycarbonate/ thermoplastic polyester resin alloys with polymeric phosphorus flame retardant additive and siloxane impact modifier. Also included are methods for preparing such compositions and articles there from.
Abstract translation: 本公开涉及具有改进的机械性能和增加的聚酯负载水平的无卤阻燃聚碳酸酯/热塑性聚酯模塑组合物。 更具体地，本公开涉及具有聚合磷阻燃添加剂和硅氧烷抗冲改性剂的无卤聚碳酸酯/热塑性聚酯树脂合金。 还包括从其制备这样的组合物和制品的方法。
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18.发明公开PHENOXY CYCLOTRIPHOSPHAZENE ACTIVE ESTER, HALOGEN-FREE RESIN COMPOSITION AND USE THEREOF 审中-公开AKTIVER PHENOXYCLOTRIPHOSPHAZENESTER，HALOGENFREIE HARZZUSAMMENSETZUNG UND VERWENDUNG DAVON
公开(公告)号：EP3037475A4
公开(公告)日：2017-06-07
申请号：EP14894791
申请日：2014-06-13
Applicant: SHENGYI TECHNOLOGY CO LTD
Inventor： HE YUESHAN
IPC: C08L63/00 , C07F9/6581 , C07F9/6593 , C08G59/30 , C08G63/692 , C08J5/24 , C08K5/5399 , C08L79/02 , C09K21/14 , H01B3/40 , H05K1/03
CPC classification number: C07F9/65812 , C07F9/65815 , C08G59/304 , C08J5/043 , C08J5/24 , C08J2363/00 , C08J2363/08 , C08J2371/00 , C08J2375/00 , C08J2379/00 , C08J2379/02 , C08J2435/06 , C08J2463/08 , C08K5/5399 , C08L63/08 , C08L71/00 , C08L75/00 , C08L79/02 , C08L2201/02 , C08L2201/22 , C08L2203/20 , C08L2205/03 , C09K21/12 , C09K21/14 , H05K1/0373 , H05K2201/012 , H05K2201/0145 , H05K2201/0209
Abstract: The present invention discloses a phenoxycyclotriphosphazene active ester, a halogen-free resin composition and uses thereof. The phenoxycyclotriphosphazene active ester comprises at least 65 mol.% of a substance having the following structural formula. The halogen-free resin composition comprises 5-50 parts by weight of a phenoxycyclotriphosphazene active ester, 15-85 parts by weight of a thermosetting resin, 1-35 parts by weight of a curing agent, 0-5 parts by weight of a curing accelerator and 0-100 parts by weight of an inorganic filler. The present invention discloses introducing phenoxycyclotriphosphazene active ester into a thermosetting resin, reacting active esters with thermosetting resins, such as epoxy resin, without producing hydroxy groups, which not only satisfies the requirements on being halogen-free and flame retardancy, but also improves the electrical properties (decreasing and stabilizing Dk and Df) of the system, so as to make non-halogenation of high frequency and high speed substrate materials possible.
Abstract translation: 本发明公开了一种苯氧基环三磷腈活性酯，一种无卤树脂组合物及其用途。 苯氧基环三磷腈活性酯包含至少65摩尔％的具有以下结构式的物质。 该无卤树脂组合物包含5-50重量份苯氧基环三磷腈活性酯，15-85重量份热固性树脂，1-35重量份固化剂，0-5重量份固化 促进剂和0-100重量份的无机填料。 本发明公开了将苯氧基环三磷腈活性酯引入到热固性树脂中，使活性酯与环氧树脂等热固性树脂反应而不产生羟基，这不仅满足了无卤素和阻燃性的要求，而且还改善了电气 使系统的性能（降低和稳定Dk和Df），从而使高频和高速衬底材料成为可能的非卤化。
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19.发明公开HALOGEN-FREE RESIN COMPOSITION, AND PREPREG AND LAMINATED BOARD FOR PRINTED CIRCUIT USING SAME 审中-公开HALOGENFREIE HARZZUSAMMENSETZUNG SOWIE PREPREG UND LAMINATPLATTEFÜRGEDRUCKTE SCHALTUNG DAMIT
公开(公告)号：EP3156451A1
公开(公告)日：2017-04-19
申请号：EP14894564.5
申请日：2014-06-10
Applicant: Shengyi Technology Co. Ltd.
Inventor： YOU, Jiang
IPC: C08L63/00
CPC classification number: C08L63/00 , B32B27/38 , B32B27/42 , B32B2260/021 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2264/102 , B32B2264/104 , B32B2307/204 , B32B2307/306 , B32B2307/3065 , B32B2307/714 , B32B2307/726 , B32B2307/7265 , B32B2307/734 , B32B2457/08 , C08G14/06 , C08G59/3218 , C08G59/5073 , C08G59/621 , C08G59/686 , C08J5/24 , C08J2363/00 , C08J2379/02 , C08J2379/04 , C08J2461/06 , C08J2463/00 , C08J2479/02 , C08J2479/04 , C08K3/22 , C08K3/34 , C08K3/40 , C08K5/0066 , C08K5/49 , C08L61/04 , C08L61/06 , C08L61/34 , C08L63/04 , C08L79/02 , C08L79/04 , C08L79/06 , C08L2201/02 , C08L2201/22 , C08L2203/20 , C08L2205/03 , H05K1/0373 , H05K2201/012 , H05K2201/015
Abstract: The present invention discloses a halogen-free resin composition, and a prepreg and a laminate used for printed circuit. The halogen-free resin composition comprises: alkyl phenol epoxy resin; benzoxazine resin; alkyl phenol novolac curing agent; phosphorus-containing flame retardant. The alkyl phenol epoxy resin used in the present invention has many alkyl branched chains in its molecular structure, making the composition have excellent dielectric properties while it has higher glass transition temperature, low water absorption and good heat resistance. Mixing benzoxazine resin into the composition can further reduce dielectric constant, dielectric loss value and water absorption of the cured product. With alkyl phenol novolac being used as curing agent, the advantages that the molecular structure thereof has many alkyls and thus the dielectric properties are excellent and the water absorption is low are fully played. A prepreg and a laminate used for printed circuit prepared using the resin composition have low dielectric constant, low dielectric loss factor, low water absorption, high dimensional stability, high thermal resistance and good flame retardancy, processability and chemical resistance.
Abstract translation: 本发明公开了一种无卤树脂组合物，以及用于印刷电路的预浸料和层压材料。 无卤树脂组合物包括：烷基酚环氧树脂; 苯并恶嗪树脂; 烷基苯酚酚醛清漆固化剂; 含磷阻燃剂。 本发明中使用的烷基酚环氧树脂在其分子结构中具有许多烷基支链，使组合物具有优异的介电性能，同时具有较高的玻璃化转变温度，低吸水性和良好的耐热性。 将苯并恶嗪树脂混合到组合物中可以进一步降低固化产物的介电常数，介电损耗值和吸水率。 使用烷基苯酚酚醛清漆作为固化剂，其分子结构具有许多烷基，因此介电性能优异且吸水率低的优点得到充分发挥。 用于使用该树脂组合物制备的印刷电路板的预浸料和层压材料具有低介电常数，低介电损耗因子，低吸水率，高尺寸稳定性，高耐热性，良好的阻燃性，加工性和耐化学性。
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公开(公告)号：EP3024888A1
公开(公告)日：2016-06-01
申请号：EP13739996.0
申请日：2013-07-22
Applicant: Actega DS GmbH
Inventor： EICHLER, Waldemar , WITTENBERG, Rüdiger
CPC classification number: C08L23/06 , B65D53/06 , C08K3/30 , C08L23/0815 , C08L23/0853 , C08L23/22 , C08L53/00 , C08L2201/08 , C08L2201/14 , C08L2201/22 , C08L2203/10 , C08L2205/025 , C08L2205/03 , C08L2205/035 , C08L2207/062 , C08L2207/066
Abstract: The invention relates to polymer compound for a PVC-free sealing system for container closures, which is equipped with at least one oxygen-consuming compound, in which the Shore D hardness of the polymer compound is at least 20 and the polymer compound has a melt flow index (190°C, 5 kg) of at least 5.
Abstract translation: 本发明涉及一种用于容器封闭件的无PVC密封系统的高分子化合物，其具有至少一种耗氧化合物，其中高分子化合物的肖氏D硬度至少为20，高分子化合物具有 熔体流动指数（190℃，5kg）至少为5。
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