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    Systems and methods for a three-layer chip-scale MEMS device
    192.
    发明公开
    Systems and methods for a three-layer chip-scale MEMS device 有权
    Chipgröße的System-und Verfahrenfürdreilagige MEMS-Vorrichtung

    公开(公告)号：EP2455331A2

    公开(公告)日：2012-05-23

    申请号：EP11190203.7

    申请日：2011-11-22

    Applicant: Honeywell International, Inc.

    Inventor： Horning, Robert D. ,  Supino, Ryan

    IPC: B81B7/02 ,  B81B7/00

    CPC classification number: H01L29/84 ,  B81B7/0032 ,  B81B7/0038 ,  B81B7/0074 ,  B81B7/0077 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81C2201/019 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: Systems and methods for a micro-electromechanical system (MEMS) device are provided. In one embodiment, a system comprises a first outer layer and a first device layer comprising a first set of MEMS devices, wherein the first device layer is bonded to the first outer layer. The system also comprises a second outer layer and a second device layer comprising a second set of MEMS devices, wherein the second device layer is bonded to the second outer layer. Further, the system comprises a central layer having a first side and a second side opposite that of the first side, wherein the first side is bonded to the first device layer and the second side is bonded to the second device layer.

    Abstract translation: 提供了用于微机电系统（MEMS）装置的系统和方法。 在一个实施例中，系统包括第一外层和包括第一组MEMS器件的第一器件层，其中第一器件层结合到第一外层。 该系统还包括第二外层和包括第二组MEMS器件的第二器件层，其中第二器件层结合到第二外层。 此外，该系统包括具有第一侧和与第一侧相反的第二侧的中心层，其中第一侧接合到第一器件层，第二侧接合到第二器件层。

    MEMS SENSOR USING MULTI-LAYER MOVABLE COMBS
    193.
    发明公开
    MEMS SENSOR USING MULTI-LAYER MOVABLE COMBS 审中-公开
    MEMS传感器

    公开(公告)号：EP2455328A2

    公开(公告)日：2012-05-23

    申请号：EP11190201.1

    申请日：2011-11-22

    Applicant: Honeywell International, Inc.

    Inventor： Horning, Robert D. ,  Supino, Ryan

    IPC: B81B3/00

    CPC classification number: B81B3/0086 ,  B81B2201/025 ,  B81B2203/0136

    Abstract: A MEMS sensor comprises a substrate and at least one proof mass having a first plurality of combs, wherein the proof mass is coupled to the substrate via one or more suspension beams such that the proof mass and the first plurality of combs are movable. The MEMS sensor also comprises at least one fixed anchor having a second plurality of combs. The first plurality of combs is interleaved with the second plurality of combs. Each of the combs in the first plurality of combs and the second plurality of combs comprises a plurality of conductive layers electrically isolated from each other by one or more non-conductive layers. Each conductive layer is individually coupled to a respective electric potential such that fringing electric fields are screened to reduce motion of the first plurality of combs along a sense axis due to the fringing electric fields.

    Abstract translation: MEMS传感器包括基板和至少一个具有第一多个梳子的检测质量块，其中所述检测质量块经由一个或多个悬架梁耦合到所述基板，使得所述检验质量块和所述第一多个梳子是可移动的。 MEMS传感器还包括具有第二多个梳子的至少一个固定锚固件。 第一组多个梳子与第二组梳子交错。 第一组多个梳子和第二组梳子中的每个梳子包括通过一个或多个非导电层彼此电隔离的多个导电层。 每个导电层单独地耦合到相应的电位，使得边缘电场被屏蔽以由于边缘电场而沿着感测轴减小第一多个梳的运动。

    Electronic device, electronic module, and methods for manufacturing the same
    197.
    发明公开
    Electronic device, electronic module, and methods for manufacturing the same 审中-公开
    Elektronische Vorrichtung，elektronisches Modul und Verfahren zu deren Herstellung

    公开(公告)号：EP2048109A2

    公开(公告)日：2009-04-15

    申请号：EP08017806.4

    申请日：2008-10-10

    Applicant: Epson Toyocom Corporation

    Inventor： Ono, Atsushi ,  Kobayashi, Yoshihiro ,  Kitamura, Shojiro ,  Matsunaga, Masayuki ,  Hara, Akitoshi

    IPC: B81B7/00

    CPC classification number: B81B7/007 ,  B81B7/0074 ,  B81B2201/025 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15156 ,  H01L2924/15313 ,  H01L2924/16195 ,  Y10T29/49155 ,  H01L2924/00014

    Abstract: An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin. The mounting surface includes: an exposed surface of the resin between the first and second substrates, and side surfaces of the first and second substrates adjacent to the exposed surface. The first electrode is disposed at an end of the first surface adjacent to the mounting surface and electrically coupled to the electric element. The second electrode is disposed at an end of the second surface adjacent to the mounting surface and electrically coupled to the electric element.

    Abstract translation: 电子设备包括：轮廓配置，其包括第一表面，与第一表面相对的第二表面和联接到第一表面和第二表面的安装表面; 第一基板，包括第一电极; 第二基板，包括第二电极; 设置在第一和第二基板之间的树脂; 以及用所述树脂密封并具有多面体轮廓构造的电气元件，所述电气元件设置成使得所述多面体的最宽表面面向所述第一基板和所述第二基板之一。 所述第一表面是所述第一基板的一个表面，所述一个表面在与所述树脂相邻的一侧与所述第一基板的另一表面相对。 所述第二表面是所述第二基板的一个表面，所述一个表面在与所述树脂相邻的一侧与所述第二基板的另一个表面相对。 安装表面包括：在第一和第二基板之间的树脂的暴露表面以及与暴露表面相邻的第一和第二基板的侧表面。 第一电极设置在与安装表面相邻的第一表面的端部处并且电耦合到电气元件。 第二电极设置在与安装表面相邻的第二表面的端部处并且电耦合到电气元件。

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