公开(公告)号：US20060280961A1

公开(公告)日：2006-12-14

申请号：US11314359

申请日：2005-12-22

Applicant: Takayuki Yamada ,  Kazuaki Tabata

Inventor： Takayuki Yamada ,  Kazuaki Tabata

IPC: C25D5/10 ,  B32B9/00 ,  B32B3/00

CPC classification number: C25D5/12 ,  B32B3/085 ,  B32B15/00 ,  B32B15/04 ,  B32B15/043 ,  B32B15/20 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2307/202 ,  B32B2457/00 ,  B81C99/008 ,  B81C99/009 ,  B81C2201/0191 ,  B81C2201/0197 ,  C23C26/00 ,  C23C28/021 ,  C23C28/023 ,  C25D5/022 ,  C25D5/16 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T428/12493 ,  Y10T428/12882 ,  Y10T428/24917 ,  Y10T428/24983

Abstract: A laminated structure includes: a plurality of first electroconductive films each having a prescribed hardness; and a plurality of second electroconductive films each having a hardness that is lower than the prescribed hardness. The first and second electroconductive films are laminated alternately.

Abstract translation: 叠层结构包括：具有规定硬度的多个第一导电膜; 以及多个第二导电膜，其各自具有低于规定硬度的硬度。 第一和第二导电膜交替层叠。

公开(公告)号：US20040084319A1

公开(公告)日：2004-05-06

申请号：US10677548

申请日：2003-10-01

Applicant: University of Southern California

Inventor： Adam L. Cohen

IPC: C25D005/02 ,  C25D005/10

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

公开(公告)号：US06475369B1

公开(公告)日：2002-11-05

申请号：US09487408

申请日：2000-01-18

Applicant: Adam L. Cohen

Inventor： Adam L. Cohen

IPC: C25D502

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method includes forming a layer, the forming of the layer includes: a) contacting a substrate with a first article, the first article includes a support and a conformable mask disposed in a pattern on the support; b) electroplating a first metal from a source of metal ions onto the substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the substrate. The method may further involve one or more of (1) selectively depositing or non-selectively depositing one or more additional materials to complete formation of the layer, (2) planarizing deposited material after each deposition or after all depositions for a layer, and/or (3) forming layers adjacent previously formed layers to build up a structure from a plurality of adhered layers. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法包括形成层，所述层的形成包括：a）使基底与第一制品接触，所述第一制品包括以支持物的形式设置的支撑体和适形掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述衬底上，所述第一图案对应于所述适形掩模图案的所述补体; 以及c）从所述基底中去除所述第一制品。 该方法还可以包括以下一个或多个：（1）选择性地沉积或非选择性地沉积一种或多种附加材料以完成层的形成，（2）在每次沉积之后或在所有沉积之后平坦化沉积的材料，以及/ 或（3）形成与先前形成的层相邻的层，以从多个附着层建立结构。 还公开了电镀制品和电镀装置。

公开(公告)号：US20010042598A1

公开(公告)日：2001-11-22

申请号：US09791571

申请日：2001-02-26

Applicant: Fuji Xerox Co., Ltd.

Inventor： Takayuki Yamada ,  Mutsuya Takahashi ,  Masaki Nagata

IPC: B32B031/00

CPC classification number: B81C99/008 ,  B29C64/00 ,  B33Y10/00 ,  B33Y30/00 ,  B81B2201/035 ,  B81C2201/0197 ,  Y10T156/12 ,  Y10T156/13 ,  Y10T156/14 ,  Y10T428/24355

Abstract: A substrate on which a plurality of thin films having a plurality of cross-sections corresponding to the cross-section of a micro-structure are formed is placed on a substrate holder. The substrate holder is elevated to bond a thin film formed on the substrate to the surface of a stage, and by lowering the substrate holder, the thin film is separated from the substrate and transferred to the stage side. The transfer process is repeated to laminate a plurality of thin films on the stage and to form the micro-structure. Accordingly, there are provided a micro-structure having high dimensional precision, especially high resolution in the lamination direction, which can be manufactured from a metal or an insulator such as ceramics and can be manufactured in the combined form of structural elements together, and a manufacturing method and an apparatus thereof.

Abstract translation: 其上形成有多个与微结构的横截面相对应的多个横截面的薄膜的基板被放置在基板支架上。 衬底保持器被升高以将形成在衬底上的薄膜粘合到台的表面上，并且通过降低衬底保持器，将薄膜与衬底分离并转移到平台侧。 重复转印过程以在台上层压多个薄膜并形成微结构。 因此，提供了可以由诸如陶瓷的金属或绝缘体制造的具有高尺寸精度，特别是层压方向上的高分辨率的微结构，并且可以以结构元件的组合形式一起制造，并且 制造方法及其装置。

公开(公告)号：US06245249B1

公开(公告)日：2001-06-12

申请号：US09064056

申请日：1998-04-22

Applicant: Takayuki Yamada ,  Mutsuya Takahashi ,  Masaki Nagata

Inventor： Takayuki Yamada ,  Mutsuya Takahashi ,  Masaki Nagata

IPC: B32B3100

CPC classification number: B81C99/008 ,  B29C64/00 ,  B33Y10/00 ,  B33Y30/00 ,  B81B2201/035 ,  B81C2201/0197 ,  Y10T156/12 ,  Y10T156/13 ,  Y10T156/14 ,  Y10T428/24355

Abstract: A substrate on which a plurality of thin films having a plurality of cross-sections corresponding to the cross-section of a micro-structure are formed is placed on a substrate holder. The substrate holder is elevated to bond a thin film formed on the substrate to the surface of a stage, and by lowering the substrate holder, the thin film is separated from the substrate and transferred to the stage side. The transfer process is repeated to laminate a plurality of thin films on the stage and to form the micro-structure. Accordingly, there are provided a micro-structure having high dimensional precision, especially high resolution in the lamination direction, which can be manufactured from a metal or an insulator such as ceramics and can be manufactured in the combined form of structural elements together, and a manufacturing method and an apparatus thereof.

Abstract translation: 其上形成有多个与微结构的横截面相对应的多个横截面的薄膜的基板被放置在基板支架上。 衬底保持器被升高以将形成在衬底上的薄膜粘合到台的表面上，并且通过降低衬底保持器，将薄膜与衬底分离并转移到平台侧。 重复转印过程以在台上层压多个薄膜并形成微结构。 因此，提供了可以由诸如陶瓷的金属或绝缘体制造的具有高尺寸精度，特别是层压方向上的高分辨率的微结构，并且可以以结构元件的组合形式一起制造，并且 制造方法及其装置。

公开(公告)号：US10012670B2

公开(公告)日：2018-07-03

申请号：US14518688

申请日：2014-10-20

Applicant: InSighTech, LLC

Inventor： Biao Zhang ,  Tao Ju

IPC: H04R31/00 ,  G01P15/105 ,  G01C19/56 ,  B81B5/00 ,  G01C19/5776 ,  G01C19/5712 ,  B81C1/00 ,  B81C3/00 ,  G01R33/09 ,  G01P15/125

CPC classification number: G01P15/105 ,  B81B5/00 ,  B81C1/00357 ,  B81C3/001 ,  B81C2201/0197 ,  B81C2203/038 ,  G01C19/56 ,  G01C19/5712 ,  G01C19/5776 ,  G01P15/125 ,  G01R33/091 ,  G01R33/093 ,  G01R33/098

Abstract: A method of making a MEMS gyroscope is disclosed herein, wherein the MEMS gyroscope comprised a magnetic sensing mechanism on a magnetic sensor wafer and a magnetic source on a MEMS wafer that further comprises a proof-mass.

公开(公告)号：US20170362079A1

公开(公告)日：2017-12-21

申请号：US15540149

申请日：2015-10-30

Applicant: Mitsubishi Electric Corporation

Inventor： Nobuaki KONNO ,  Yoshiaki HIRATA

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0041 ,  B81B7/0077 ,  B81B7/02 ,  B81B2203/0315 ,  B81B2207/012 ,  B81B2207/092 ,  B81B2207/095 ,  B81B2207/096 ,  B81C1/00158 ,  B81C1/00293 ,  B81C2201/0197 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/031 ,  B81C2203/0785 ,  H01L23/02 ,  H01L23/04 ,  H01L23/08 ,  H01L23/12 ,  H01L23/15 ,  H01L25/00 ,  H05K3/46

Abstract: A ceramic substrate is mainly constituted of ceramic, and has a first main surface and a second main surface located opposite to the first main surface. A recessed portion recessed toward a first main surface side is formed in the second main surface. A wire portion extending from an outer peripheral surface of the ceramic substrate to inside of the recessed portion is formed, and a bottom portion located on the first main surface side in the recessed portion has a portion thinner than another portion of the ceramic substrate other than the bottom portion.

公开(公告)号：US09809444B2

公开(公告)日：2017-11-07

申请号：US15443922

申请日：2017-02-27

Applicant: Infineon Technologies AG

Inventor： Wolfgang Klein

IPC: H04R19/04 ,  B81B3/00 ,  B81C1/00 ,  H02N2/02 ,  H04R19/00

CPC classification number: B81B3/0021 ,  B81B3/0059 ,  B81B2203/0127 ,  B81B2203/0136 ,  B81B2203/0307 ,  B81C1/00158 ,  B81C2201/0197 ,  H01L29/84 ,  H02N1/008 ,  H02N2/02 ,  H04R1/04 ,  H04R1/06 ,  H04R19/005 ,  H04R19/04 ,  H04R31/003 ,  H04R2201/003 ,  H04R2207/021 ,  H04R2231/003 ,  H04R2410/03

Abstract: According to an embodiment, a MEMS device includes a deflectable membrane including a first plurality of electrostatic comb fingers, a first anchor structure including a second plurality of electrostatic comb fingers interdigitated with a first subset of the first plurality of electrostatic comb fingers, and a second anchor structure including a third plurality of electrostatic comb fingers interdigitated with a second subset of the first plurality of electrostatic comb fingers. The second plurality of electrostatic comb fingers are offset from the first plurality of electrostatic comb fingers in a first direction and the third plurality of electrostatic comb fingers are offset from the first plurality of electrostatic comb fingers in a second direction, where the first direction is different from the second direction.

公开(公告)号：US09771665B2

公开(公告)日：2017-09-26

申请号：US15022532

申请日：2014-09-08

Applicant: Griffith University

Inventor： Francesca Iacopi ,  Mohsin Ahmed ,  Benjamin Vaughan Cunning

IPC: H01L21/00 ,  C30B1/02 ,  C30B1/10 ,  C30B29/02 ,  C01B31/04 ,  B81C1/00 ,  H01L21/02

CPC classification number: C30B1/026 ,  B81C1/0038 ,  B81C2201/0197 ,  C01B32/184 ,  C01B32/188 ,  C30B1/10 ,  C30B29/02 ,  H01L21/00 ,  H01L21/02381 ,  H01L21/02447 ,  H01L21/02491 ,  H01L21/02527 ,  H01L21/02614

Abstract: A process for forming graphene, includes: depositing at least a first and a second metal onto a surface of silicon carbide (SiC), and heating the SiC and the first and second metals under conditions that cause the first metal to react with silicon of the silicon carbide to form carbon and at least one stable silicide. The corresponding solubilities of the carbon in the stable silicide and in the second metal are sufficiently low that the carbon produced by the silicide reaction forms a graphene layer on the SiC.

公开(公告)号：US09714473B2

公开(公告)日：2017-07-25

申请号：US14191061

申请日：2014-02-26

Applicant: Microfabrica Inc.

Inventor： Uri Frodis ,  Adam L. Cohen ,  Michael S. Lockard

IPC: C25D5/02 ,  C25D5/10 ,  C25D5/48 ,  B33Y10/00 ,  B81C1/00 ,  B81C99/00 ,  C25D1/00 ,  C25D21/12 ,  H01L21/288 ,  H01L21/768

CPC classification number: C25D5/48 ,  B33Y10/00 ,  B81C1/00492 ,  B81C99/0065 ,  B81C2201/0104 ,  B81C2201/0197 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76885 ,  Y10T156/1052

Abstract: Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.