公开(公告)号：US20070075299A1

公开(公告)日：2007-04-05

申请号：US11500307

申请日：2006-08-08

Applicant: Yasunori Ninomiya ,  Masashi Totokawa ,  Hirokazu Imai ,  Yukinori Migitaka

Inventor： Yasunori Ninomiya ,  Masashi Totokawa ,  Hirokazu Imai ,  Yukinori Migitaka

IPC: H01B1/12

CPC classification number: H01B1/22 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/0272 ,  Y10T428/12882 ,  Y10T428/12903 ,  Y10T428/29 ,  Y10T428/2933

Abstract: A conductive adhesive is formed by mixing a plurality of conductive fillers into a thermosetting resin. The conductive filler includes a core material made of copper-based metal, a coating film made of silver and a plurality of particles made of silver. The coating film is provided on the core material to cover the core material, and the particles are provided on a surface of the coating film. Accordingly, a surface of the core material is prevented from being exposed. The conductive adhesive can be suitably used for bonding two members.

Abstract translation: 通过将多种导电填料混合到热固性树脂中形成导电粘合剂。 导电填料包括由铜基金属制成的芯材，由银制成的涂膜和多个由银制成的颗粒。 涂覆膜设置在芯材上以覆盖芯材，并且将颗粒设置在涂膜的表面上。 因此，防止芯材的表面露出。 导电粘合剂可以适合用于粘接两个部件。

公开(公告)号：US20060145352A1

公开(公告)日：2006-07-06

申请号：US11338529

申请日：2006-01-23

Applicant: Tasao Soga ,  Hanae Hata ,  Tetsuya Nakatsuka ,  Mikio Negishi ,  Hirokazu Nakajima ,  Tsuneo Endoh

Inventor： Tasao Soga ,  Hanae Hata ,  Tetsuya Nakatsuka ,  Mikio Negishi ,  Hirokazu Nakajima ,  Tsuneo Endoh

IPC: H01L23/48

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/262 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/01012 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/141 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/045 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05669

Abstract: In an electronic device which realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a bonding portion between a semiconductor device and a substrate is formed of metal balls made of Cu, or the like, and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.

Abstract translation: 在实现温度分级接合中的高温侧焊接的电子设备中，半导体器件与衬底之间的接合部分由Cu等金属球形成，并且由金属球和Sn形成的化合物 ，金属球通过化合物结合在一起。

公开(公告)号：US07025906B2

公开(公告)日：2006-04-11

申请号：US10087913

申请日：2002-03-05

Applicant: Kozo Shimizu ,  Yasuo Yamagishi

Inventor： Kozo Shimizu ,  Yasuo Yamagishi

IPC: H01B1/22

CPC classification number: H01B1/22 ,  H01B1/02 ,  H01C7/005 ,  H01C7/008 ,  H01C17/06526 ,  H01C17/06586 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01322 ,  H05K3/321 ,  H05K3/3484 ,  H05K2201/0218 ,  H05K2203/0425 ,  Y10T428/2982 ,  Y10T428/2991

Abstract: A conductive composition layer, conductive particles as a raw material, a conductive composition therefor, a manufacturing method of the conductive composition layer, etc. are provided wherewith heat conductance can be accelerated between electronic devices or electronic devices can be electrically connected. The conductive composition layer is formed by subjecting to heat treatment at a temperature lower than 230° C. a conductive composition comprising conductive particles having a metal base material and a metal coating material thereon as well as a thermosetting resin having a curing temperature that is lower than 230° C. and/or a thermoplastic resin having a melting point that is lower than 230° C.

公开(公告)号：US06838022B2

公开(公告)日：2005-01-04

申请号：US10205251

申请日：2002-07-25

Applicant: S. Kumar Khanna

Inventor： S. Kumar Khanna

IPC: H01B1/22 ,  H01C17/065 ,  H01L21/60 ,  H05K3/32

CPC classification number: H01L24/29 ,  H01B1/22 ,  H01C17/06526 ,  H01C17/06586 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83951 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/10727 ,  H01L2924/00

Abstract: An anisotropic conductive compound includes an electrically conducting material suspended in a binder. The electrically conducting material includes nickel coated particles having a coating of silver or gold over the nickel coat and/or gold or silver coated nickel particles. In one embodiment, the binder is formed from the reaction product of a catalyst and a compound comprising an aromatic epoxy resin, a dimer fatty acid diglycidyl ester and oxirane. In another embodiment, the binder is formed from the reaction product of a novalac resin, a catalyst and either a heat polymerized aromatic epoxy resin or a phenoxy modified epoxy novalac resin.

Abstract translation: 各向异性导电化合物包括悬挂在粘合剂中的导电材料。 导电材料包括在镍涂层和/或金或银涂覆的镍颗粒上具有银或金的涂层的镍涂覆的颗粒。 在一个实施方案中，粘合剂由催化剂和包含芳族环氧树脂，二聚脂肪酸二缩水甘油酯和环氧乙烷的化合物的反应产物形成。 在另一个实施方案中，粘合剂由诺瓦克树脂，催化剂和热聚合的芳族环氧树脂或苯氧基改性的环氧树脂酚醛树脂的反应产物形成。

公开(公告)号：US20040016911A1

公开(公告)日：2004-01-29

申请号：US10205251

申请日：2002-07-25

Applicant: Shiva Consulting, Inc.

Inventor： S. Kumar Khanna

IPC: H01B001/00 ,  H01C001/00

CPC classification number: H01L24/29 ,  H01B1/22 ,  H01C17/06526 ,  H01C17/06586 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83951 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/10727 ,  H01L2924/00

Abstract: An anisotropic conductive compound includes an electrically conducting material suspended in a binder. The electrically conducting material includes nickel coated particles having a coating of silver or gold over the nickel coat and/or gold or silver coated nickel particles. In one embodiment, the binder is formed from the reaction product of a catalyst and a compound comprising an aromatic epoxy resin, a dimer fatty acid diglycidyl ester and oxirane. In another embodiment, the binder is formed from the reaction product of a novalac resin, a catalyst and either a heat polymerized aromatic epoxy resin or a phenoxy modified epoxy novalac resin.

Abstract translation: 各向异性导电化合物包括悬浮在粘合剂中的导电材料。 导电材料包括在镍涂层和/或金或银涂覆的镍颗粒上具有银或金的涂层的镍涂覆的颗粒。 在一个实施方案中，粘合剂由催化剂和包含芳族环氧树脂，二聚脂肪酸二缩水甘油酯和环氧乙烷的化合物的反应产物形成。 在另一个实施方案中，粘合剂由诺瓦克树脂，催化剂和热聚合的芳族环氧树脂或苯氧基改性的环氧树脂酚醛树脂的反应产物形成。

公开(公告)号：US20030146266A1

公开(公告)日：2003-08-07

申请号：US10060812

申请日：2002-02-01

Inventor： Arun K. Chaudhuri ,  Frank Stepniak ,  Matthew R. Walsh

IPC: B23K001/00

CPC classification number: H05K3/321 ,  C08L63/00 ,  C09J9/02 ,  C09J163/00 ,  H01B1/22 ,  H05K3/3489 ,  H05K2201/0218 ,  H05K2203/0425

Abstract: A conductive adhesive material characterized by metallurgical bonds between electrically-conductive particles dispersed in a polymer matrix of the material. The polymer matrix has a fluxing capability when heated to reduce metal oxides on the surfaces of the particles. At least the outer surfaces of the particles are formed of a fusible material, so that sufficiently heating the conductive adhesive material will reduce metal oxides on the particles, and at least partially melt the fusible metal, enabling the particles to metallurgically bond to each other and to metal surfaces contacted by the adhesive material.

Abstract translation: 导电粘合剂材料，其特征在于分散在材料的聚合物基质中的导电颗粒之间的冶金结合。 聚合物基质在加热时具有助熔能力，以减少颗粒表面上的金属氧化物。 至少颗粒的外表面由可熔材料形成，使得充分加热导电粘合剂材料将减少颗粒上的金属氧化物，并且至少部分地熔化可熔金属，使得颗粒彼此冶金结合， 与由粘合剂材料接触的金属表面。

公开(公告)号：US20020175316A1

公开(公告)日：2002-11-28

申请号：US10087913

申请日：2002-03-05

Applicant: Fujitsu Limited

Inventor： Kozo Shimizu ,  Yasuo Yamagishi

IPC: H01B001/00 ,  H01C001/00

CPC classification number: H01B1/22 ,  H01B1/02 ,  H01C7/005 ,  H01C7/008 ,  H01C17/06526 ,  H01C17/06586 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01322 ,  H05K3/321 ,  H05K3/3484 ,  H05K2201/0218 ,  H05K2203/0425 ,  Y10T428/2982 ,  Y10T428/2991

Abstract: A conductive composition layer, conductive particles as a raw material, a conductive composition therefor, a manufacturing method of the conductive composition layer, etc. are provided wherewith heat conductance can be accelerated between electronic devices or electronic devices can be electrically connected. The conductive composition layer is formed by subjecting to heat treatment at a temperature lower than 230null C. a conductive composition comprising conductive particles having a metal base material and a metal coating material thereon as well as a thermosetting resin having a curing temperature that is lower than 230null C. and/or a thermoplastic resin having a melting point that is lower than 230null C.

Abstract translation: 中，提供了用那个热导的导电颗粒作为原料，其的导电性组合物，所述导电性组合物层的制造方法等的导电组合物层可以电子设备或电子设备之间的加速可以电连接。 导电性组合物层是通过对在低于230℃的导电性组合物，其包括具有金属基体材料和其上的金属涂层材料以及具有固化温度是低的热固性树脂的导电性粒子的温度下进行热处理形成的 大于230℃和/或具有熔点的热塑性树脂，其低于230℃

公开(公告)号：US20020102432A1

公开(公告)日：2002-08-01

申请号：US09993615

申请日：2001-11-27

Applicant: Fujitsu Limited

Inventor： Masayuki Ochiai ,  Yasuo Yamagishi ,  Hiroki Uchida ,  Masayuki Kitajima ,  Masakazu Takesue ,  Tadaaki Shono

IPC: B32B015/20

CPC classification number: B23K35/025 ,  B23K35/0244 ,  B23K35/262 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/10689 ,  H05K2203/0545 ,  Y10T428/12063 ,  Y10T428/12882

Abstract: A solder paste, includes a flux, a solder alloy particle scattered or mixed in the flux and including Sn and Zn as composition elements, and a metal particle scattered or mixed in the flux and including an element in the IB group in the periodic table as a composition element.

Abstract translation: 焊膏包括焊剂，焊剂中散布或混合的焊料合金颗粒，并且包括作为组成元素的Sn和Zn，以及在焊剂中散布或混合的金属颗粒，并且包括周期表中的IB组中的元素作为 组成元素。

公开(公告)号：US06199751B1

公开(公告)日：2001-03-13

申请号：US09533196

申请日：2000-03-23

Applicant: Michael A. Gaynes ,  Kostas I. Papathomas ,  Giana M. Phelan ,  Charles G. Woychik

Inventor： Michael A. Gaynes ,  Kostas I. Papathomas ,  Giana M. Phelan ,  Charles G. Woychik

IPC: B23K2000

CPC classification number: H01L24/31 ,  B23K35/0244 ,  B23K35/26 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29409 ,  H01L2224/29411 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2203/0425 ,  Y10T428/12014 ,  Y10T428/12181 ,  Y10T428/12569 ,  Y10T428/12646 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point constituent. A first ratio of the two metals forms a liquid phase with a second ratio of the two metals forming a solid phase. The volume of the base layer metal exceeds the volume necessary to form the solid phase between the base metal and the surface metal. Conductive metal particles are provided having a core metal and a coating metal dispersed in an uncured polymer material, at a volume fraction above the percolation threshold. The core metal and the coating metal together include a low melting point constituent. At a first ratio the components form a liquid phase and at a second ratio the two components form a solid phase. The polymer containing particles is placed between the two metal surfaces with the particles interfacing with each other and the surface layer of metal. The structure is heated to a temperature higher than the low melting liquid constituent to form a liquid phase which extends to include the surface of the pads and the surface of the particles, and thereafter form a solid phase by diffusion of the core material into the surface material and the base metal into the coating material.

Abstract translation: 提供了在两个表面上的焊盘之间形成冶金结合的技术。 放置在每个表面上的金属涂层包括第一金属基底层和第二金属表面层。 第一和第二种金属包括低熔点成分。 两种金属的第一比率形成液相，其中第二比例的两种金属形成固相。 基底层金属的体积超过在母材和表面金属之间形成固相所需的体积。 提供导电金属颗粒，其具有分散在未固化的聚合物材料中的芯金属和涂覆金属，其体积分数高于渗滤阈值。 核心金属和涂覆金属一起包括低熔点成分。 以第一比例，组分形成液相，并且以第二比例，两种组分形成固相。 含有聚合物的颗粒被放置在两个金属表面之间，其中颗粒彼此接合并且金属的表面层。 将该结构加热到比低熔点液体成分高的温度，形成液相，其延伸以包括焊盘的表面和颗粒的表面，然后通过将芯材扩散到表面中而形成固相 材料和贱金属进入涂料。

公开(公告)号：US5962133A

公开(公告)日：1999-10-05

申请号：US981565

申请日：1997-12-19

Applicant: Atsushi Yamaguchi ,  Kenichiro Suetsugu ,  Tetsuo Fukushima ,  Akio Furusawa

Inventor： Atsushi Yamaguchi ,  Kenichiro Suetsugu ,  Tetsuo Fukushima ,  Akio Furusawa

IPC: B23K35/02 ,  B23K35/14 ,  B23K35/26 ,  H01L23/495 ,  H05K3/24 ,  H05K3/34 ,  B32B5/16 ,  B32B15/00

CPC classification number: H05K3/244 ,  B23K35/0227 ,  B23K35/0244 ,  B23K35/26 ,  H01L23/49582 ,  H05K3/3463 ,  H05K3/3484 ,  B23K35/025 ,  H01L2924/0002 ,  H05K2201/0218 ,  H05K2201/10636 ,  H05K2203/0425 ,  H05K3/3421 ,  Y02P70/611 ,  Y10T428/24917 ,  Y10T428/2938 ,  Y10T428/294 ,  Y10T428/2951 ,  Y10T428/2991

Abstract: The occurrence of partial chip detachment is reduced by improving wettability for increasing the bonding strength, and by enabling gradual melting of the solder. Solder material, electronic components, and electronic circuit boards with higher performance and higher reliability are offered. The surface of a solder core, lead-frame surface and electrode surface of electronic components, and copper (Cu) land surface of electronic circuit boards are coated with metal element, which is either indium (In) or bismuth (Bi).

Abstract translation: PCT No.PCT / JP96 / 01680 Sec。 371 1997年12月19日第 102（e）1997年12月19日PCT PCT 1996年6月19日PCT公布。 出版物WO97 / 00753 日期1997年1月9日通过提高粘合强度的润湿性，并且能够使焊料逐渐熔化，从而降低部分切屑剥离的发生。 提供了具有更高性能和更高可靠性的焊料，电子元件和电子电路板。 焊料芯，引线框架表面和电子部件的电极表面以及电子电路板的铜（Cu）表面的表面涂覆有铟（In）或铋（Bi）的金属元素。