公开(公告)号：EP1820285A1

公开(公告)日：2007-08-22

申请号：EP05824517.6

申请日：2005-11-08

Applicant: Commscope Solutions Properties, LLC

Inventor： HASHIM, Amid

IPC: H04B3/32

CPC classification number: H05K1/0228 ,  H01R13/6466 ,  H01R13/6467 ,  H01R13/6658 ,  H01R24/64 ,  H04B3/32 ,  H05K2201/09245 ,  H05K2201/10189

Abstract: A communications connector (200) includes: a dielectric mounting substrate (220); a plurality of conductors (222a-228b) mounted in the mounting substrate; and a wiring board (259). Each of the conductors includes a fixed end portion mounted in the mounting substrate and a free end portion, each of the free end portions being positioned in side-by-side and generally parallel relationship, and each of the fixed end portions being positioned in side-by-side and generally parallel relationship. The wiring board is positioned between the fixed and free end portions of the conductors, the wiring board being generally perpendicular to the conductors, the wiring board including first (276a) and second (276b) conductive traces that are electrically insulate from each other. First and second conductors are electrically connected with the first and second traces, the first and second conductive traces are arranged on the wiring board to create a crossover between the first and second conductors.

公开(公告)号：EP1215948A2

公开(公告)日：2002-06-19

申请号：EP01129757.9

申请日：2001-12-13

Applicant: Denso Corporation

Inventor： Kondo, Koji ,  Kamiya, Tetsuaki ,  Harada, Toshikazu ,  Onoda, Ryuichi ,  Kamiya, Yasataka ,  Masuda, Gentaro ,  Yazaki, Yoshitaro ,  Yokochi, Tomohiro

IPC: H05K3/46

CPC classification number: H05K3/4638 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09245 ,  H05K2201/096 ,  H05K2201/09854 ,  H05K2203/063 ,  H05K2203/065 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T156/1064

Abstract: Single-sided conductor patterned films 21 are prepared, each of which has a conductor pattern 22 formed only one side of a resin film 23 and via hole 24 filled with conductive paste 50. A single-sided conductor patterned film 31 which has a conductor pattern 22 formed only one side of a resin film 23 and an opening formed in the resin film 23 so as to expose an electrode 32 is laminated on the single-sided conductor patterned films 21. Moreover, a cover layer with an opening to expose an electrode 37 is laminated on a bottom surface of the single-sided conductor patterned films 21 to form a laminate. Then, by pressing the laminate while heating, a multilayer substrate 100 having the electrodes at both sides thereof can be produced.

Abstract translation: 制备单面导体图案化膜21，每个导体图案膜具有仅形成在树脂膜23的一侧上的导体图案22和填充有导电膏50的通孔24.具有导体图案的单面导体图案化膜31 22，仅形成树脂膜23的一侧，并且形成在树脂膜23中以露出电极32的开口层压在单面导体图案化膜21上。而且，具有露出电极的开口的覆盖层 37层压在单面导体图案化膜21的底表面上以形成层压体。 然后，通过在加热的同时按压层压体，可以制造在其两侧具有电极的多层基板100。

公开(公告)号：EP3375081A1

公开(公告)日：2018-09-19

申请号：EP16790331.9

申请日：2016-10-31

Applicant: Physik Instrumente (PI) GmbH & Co. KG

Inventor： GLÖSS, Rainer

IPC: H02K41/03 ,  H02K3/26 ,  H01F27/28 ,  H05K1/16

CPC classification number: H02K15/03 ,  H01F27/2804 ,  H02K3/26 ,  H02K7/14 ,  H02K41/031 ,  H02K2201/18 ,  H05K1/165 ,  H05K3/46 ,  H05K2201/09245

Abstract: The invention relates to a planar positioning apparatus, comprising a stator, which comprises a coil arrangement comprising flat coils, a rotor which is arranged opposite the stator in the operating position of the positioning apparatus and has a planar magnet arrangement comprising a plurality of rows of magnets, wherein the plane which is spanned by the planar magnet arrangement is arranged parallel to the plane of the coil arrangement, a position detecting device for detecting the position of the rotor relative to the stator, and an evaluation and control device for evaluating position signals of the position detecting device and for controlling a current supply to the coil arrangement for controlling the position of the rotor with respect to the stator, wherein the coil arrangement comprises in each case n x 3 ( n ≥ 1) elongate flat coils which are interleaved with one another, in a first and second orientation of the coil arrangement which, over the majority of their extent, are designed as conductor runs of a first plane of a multiple-plane printed circuit board, and the conductor runs of the three associated flat coils enclose crossover regions which run in a second plane of the multiple-plane printed circuit board.

公开(公告)号：EP3153953A4

公开(公告)日：2018-01-17

申请号：EP14863068

申请日：2014-09-22

Applicant: BOE TECHNOLOGY GROUP CO LTD ,  BEIJING BOE OPTOELECTRONICS TECH CO LTD

Inventor： WANG LEI ,  XUE HAILIN ,  XUE YANNA ,  YUAN HONGLIANG ,  LIU YINGMING ,  WANG CHUNLEI ,  WANG HAISHENG ,  CHEN XIAOCHUAN ,  WANG SHIJUN ,  XU RUI ,  XIE XIAOBO

IPC: G06F3/044 ,  G02F1/1333 ,  G06F3/041 ,  G09G3/36

CPC classification number: G06F3/044 ,  G06F3/0412 ,  G06F3/0416 ,  G06F3/04883 ,  G06F2203/04103 ,  G06F2203/04112 ,  G06F2203/04808 ,  G09G3/3648 ,  G09G3/3659 ,  G09G2300/0809 ,  G09G2320/0252 ,  H05K1/0296 ,  H05K2201/09227 ,  H05K2201/09245 ,  H05K2201/10128 ,  H05K2201/10151

Abstract: An in-cell touch panel and a display device are disclosed. In the in-cell touch panel, a plurality of mutually independent self-capacitance electrodes (03) arranged in the same layer are disposed on an array substrate in accordance the self-capacitance principle; a touch detection chip (04) can determine the touch position by the detection of the capacitance variation of the self-capacitance electrodes (03); leads (05) arranged in the same layer as pixel electrodes are disposed at gaps between the pixel electrodes and configured to connect the self-capacitance electrodes to the touch detection chip. The touch panel can reduce the manufacturing cost and improve the productivity.

公开(公告)号：EP2027818B1

公开(公告)日：2016-11-09

申请号：EP07745048.4

申请日：2007-06-11

Applicant: Olympus Corporation

Inventor： SATO, Sunao ,  WAKABAYASHI, Katsuhiro ,  MIZUNUMA, Akiko ,  FUJIMURA, Takanao ,  SAWADA, Yukihiko ,  IMAHASHI, Takuya ,  ADACHI, Hideo

IPC: A61B8/12 ,  A61B8/00

CPC classification number: A61B8/12 ,  A61B1/0051 ,  A61B1/015 ,  A61B1/042 ,  A61B8/4416 ,  A61B8/445 ,  A61B8/4455 ,  A61B2562/028 ,  A61B2562/222 ,  G01S7/52079 ,  G01S15/892 ,  H05K1/147 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/10083

公开(公告)号：EP2224605B1

公开(公告)日：2016-08-10

申请号：EP10163909.4

申请日：2005-10-18

Applicant: Commscope Inc. of North Carolina

Inventor： Hashim, Amid

IPC: H04B3/32

CPC classification number: H05K1/0228 ,  H01R13/6469 ,  H01R13/6658 ,  H01R24/64 ,  H05K2201/09245 ,  H05K2201/10189

公开(公告)号：EP2982041A1

公开(公告)日：2016-02-10

申请号：EP14723233.4

申请日：2014-04-01

Applicant: Qualcomm Incorporated

Inventor： YOUSSEF, Ahmed Abdel Monem ,  CHANG, Li-Chung ,  LEUNG, Wingching Vincent ,  HE, Allen ,  XU, Rui ,  ABDEL GHANY, Ehab Ahmed Sobhy

IPC: H04B1/00 ,  H05K1/02

CPC classification number: H05K1/0228 ,  H04B1/005 ,  H04B1/44 ,  H04B3/02 ,  H04B7/04 ,  H05K1/0219 ,  H05K2201/09245 ,  Y10T307/74

Abstract: Techniques for routing and shielding signal lines to improve isolation between the signal lines are disclosed. In an exemplary design, an apparatus includes first, second, and third signal lines and a switch. The first, second, and third signal lines are configurable to carry first, second, and third signals, respectively. The switch is coupled between the second signal line and AC ground and is closed when the second signal line is not carrying the second signal. The second signal line isolates the first and third signal lines when the switch is closed. Adjacent signal lines are not active at the same time. A signal line may include positive and negative signal lines, which may have at least one cross over in order to cancel coupling between the positive and negative signal lines.

公开(公告)号：EP2453725A1

公开(公告)日：2012-05-16

申请号：EP10796873.7

申请日：2010-06-24

Applicant: Fujikura, Ltd.

Inventor： YAMAMOTO, Satoshi ,  HASHIMOTO, Hirokazu

IPC: H05K1/11 ,  H01L23/36 ,  H05K1/02 ,  H05K3/00 ,  H05K3/40

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0272 ,  H05K1/115 ,  H05K3/101 ,  H05K3/42 ,  H05K2201/09245 ,  H05K2201/09845 ,  H05K2201/09981 ,  H01L2924/00

Abstract: A through wiring substrate includes a substrate including a first face and a second face, and a plurality of through-wires formed by filling, or forming a film of, an electrically-conductive substance in through-holes that penetrate between the first face and the second face. The through-wires are separated from each other, and, include at least one overlap section in a plan view of the substrate.

Abstract translation: 通过布线基板包括具有第一面和第二面的基板，以及通过在贯通第一面和第二面之间的通孔中填充或形成导电性物质的膜而形成的多根贯通丝 第二面。 通线彼此分离，并且在基板的平面图中包括至少一个重叠部分。

公开(公告)号：EP1956877B1

公开(公告)日：2011-05-11

申请号：EP08101303.9

申请日：2008-02-06

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： Tanaka, Koichi c/o Shinko Electric Industries Co., Ltd.

IPC: H05K3/46

CPC classification number: H05K3/462 ,  H05K1/0289 ,  H05K3/4647 ,  H05K2201/09245 ,  H05K2203/0733 ,  H05K2203/1327 ,  Y10T29/49126

公开(公告)号：EP1820284B1

公开(公告)日：2011-04-13

申请号：EP05813757.1

申请日：2005-10-18

Applicant: COMMSCOPE INC. OF NORTH CAROLINA

Inventor： HASHIM, Amid

IPC: H04B3/32

CPC classification number: H05K1/0228 ,  H01R13/6469 ,  H01R13/6658 ,  H01R24/64 ,  H05K2201/09245 ,  H05K2201/10189

Abstract: A communications jack assembly (200) includes: a jack frame (212) having a plug aperture (214); a dielectric mounting substrate attached to the jack frame; and a plurality of conductors (222a-228b) engaged with the mounting substrate, each of the conductors including a fixed end portion mounted with the mounting substrate and a free end portion extending into the plug aperture for electrical contact with a mating plug, each of the free end portions having substantially the same profile and being substantially transversely aligned in side-by-side relationship. A first pair of conductors (222) is sandwiched inside a second pair of conductors (226). The second pair of conductors includes a crossover (231), the positioning of crossover being selected to provide differential to common mode crosstalk compensation.