Abstract:
An apparatus for curing a printing plate made of or having photo-curable material, a method of curing such a printing plate, and a printing plate cured by the method. One embodiment of the method includes curing a printing plate made of or having photo-curable material thereon. The method includes producing light energy on part of the printing plate using a light exposure unit capable of generating at least a first illumination intensity and a second illumination intensity, such that curing can produce printing features on the plate that can be switched to have either flat tops or round tops according to the illumination intensity output by the light exposure unit.
Abstract:
An apparatus, a method, and a plate made by the method, e.g., using the apparatus. The apparatus includes a light tunnel of light reflective walls with polygonal cross-section like a kaleidoscope, and a light source, located at one end to produce light radiation to the inside of the light tunnel towards the other end. Light entering the light tunnel towards an inner reflective surface of a wall is reflected off the inner reflective surface so that it can emerge from the other end to cure a plate having photo-curable material thereon.
Abstract:
A method of manufacturing a master plate includes the steps of forming a photoresist film on a substrate, disposing a photomask having a plurality of island radiation shields on the photoresist film followed by integrating the photomask and the photoresist film, applying light from a light source to the photoresist film through the photomask for selectively exposing the photoresist film, and developing the photoresist film to form a master plate, in which the method includes irradiating the photoresist film with the light from plural directions through the photomask to selectively expose the photoresist film from the respective directions.
Abstract:
A method and a device for transferring minute patterns (12) on the mask (11) to the substratum (17) by means of illuminating optical system (1-10) projecting beams of illuminating light onto the mask (11) and a projection aligner having a projection optical system (13) for projecting images of minute patterns (12) on the substratum (17). Beams of said illuminating light are thrown, as at least a pair of luminous fluxes slantwise facing the mask (11), through a pair of light transmitting windows (6a, 6b) of a spatial filter (6) onto the minute patterns (12), and, as a result, one of diffracted beams of the light of ± first orders caused by minute patterns (12) of the illuminated mask (11) and diffracted beams of zero order pass portions, equidistantly spaced apart from the optical axis of the projection optical system, of or near the Fourier transform surface (14) in the projection optical system (13) for minute patterns (12) on the mask (11) so that projected images may be formed to be sharp in contrast and high in resolution on the substratum (17) at a large focal depth.
Abstract:
Ion beam lithography technique wherein a higher amount of radiation energy is deposited to predetermined regions in the bulk if a suitable substrate. By selecting the radiation nature, its energy and the irradiation parameters a structure can be created in the bulk of the material leaving the surface essentially untouched.
Abstract:
What is described is a lithographic method for fabricating three-dimensional structures on the micrometric and submicro-metric scale, including the operations of: depositing a layer (L1) of a first resist (R1) on a substrate (S); depositing a layer (L') of a second resist (R2) on the layer (L1) of the first resist (R1); forming a pattern of the second resist (R2) by lithography; depositing a further layer (L2) of the first resist (R1) on the previous layers; and forming a pattern of the first resist (R1) by lithography. The second resist (R2) is sensitive to exposure to charged particles or to electromagnetic radiation in a different way from the first (R1); in other words, it is transparent to the particles or to the electromagnetic radiation to which the first resist (R1) is sensitive, and therefore the processes of exposure and development of the two resists (R1, R2) are mutually incompatible to the extent that the exposure and development of one does not interfere with the exposure and development of the other.
Abstract:
In a lithographic proximity method for wiring an end or internal side surface of a substrate the required exposure of strips (76), defining the wiring pattern, is performed by means of a mask (70) comprising a diffraction structure (74) to deflect exposure radiation (b) to the side surface. An exposure beam, which is perpendicularly incident on the mask, is used so that enhanced tolerance for proximity gap width variations is obtained. The method allows manufacture of accurate and fine wiring.
Abstract:
Procédé de formation de motifs dans une couche de résine photosensible, hologramme pour sa mise en oeuvre et système d'enregistrement de l'hologramme, application aux sources et écrans à micropointes. Selon l'invention, on restitue l'image (140) d'un hologramme (138) d'une monocouche de microbilles éclairée par un faisceau de lumière dont les rayons sont parallèles et qui est perpendiculaire à la monocouche pour obtenir une image holographique tridimensionnelle de cette monocouche et de pinceaux de lumière associés à celle-ci et concentrés sous les images des microbilles, on restitue l'image tridimensionnelle (144) des pinceaux dans l'épaisseur de la couche de résine photosensible (22) pour provoquer l'insolation de zones de cette couche de résine, et on développe la couche de résine ainsi insolée.
Abstract:
The present invention provides a processing method which comprises the steps of introducing into a reaction vessel (504) a reactive gas and a processing light that brings the reactive gas into excitation; and processing with the excited reactive gas the surface of a substrate (501) placed in said reaction vessel; wherein said surface of the substrate is simultaneously irradiated with light generated by a first light-generation means that causes vibration of the molecules constituting said surface of the substrate and light generated by a second light-generation means that causes photochemical reaction of said reactive gas with said surface of the substrate, to process said substrate. Furthermore, the present invention provides a processing apparatus for carrying out said processing method which comprises a reaction vessel, a gas feeding means (506), a light guiding means, a first light-generating means (510), a second light-generating means (516), and an irradiating means.