公开(公告)号：US20130220677A1

公开(公告)日：2013-08-29

申请号：US13770225

申请日：2013-02-19

Applicant: Hitachi Cable, Ltd. ,  Hitachi Cable Fine-Tech, Ltd.

Inventor： Satoru AMOU ,  Tomiya ABE ,  Daisuke SHANAI ,  Hiroaki KOMATSU ,  Kenichi MURAKAMI

IPC: C09J181/06 ,  H05K1/02 ,  B32B5/00

CPC classification number: C09J171/00 ,  B32B3/08 ,  B32B5/00 ,  B32B7/12 ,  B32B15/08 ,  B32B27/08 ,  B32B27/281 ,  B32B2307/306 ,  B32B2307/7246 ,  B32B2307/732 ,  B32B2457/08 ,  C08G2650/54 ,  C08L79/08 ,  C09J181/06 ,  H05K1/02 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/0248 ,  Y10T428/26 ,  Y10T428/263 ,  Y10T428/264 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/2826 ,  Y10T428/31681 ,  Y10T428/31721 ,  C08K5/3415 ,  C08K7/04

Abstract: Provided are a thermosetting adhesive composition excellent in storage stability, reliability, and low-temperature adhesion properties; and a curl-resistant heat-resistant film and a wiring film obtained using the composition. The thermosetting adhesive composition includes 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in the structure thereof; 5 to 30 parts by weight of a maleimide compound containing a plurality of maleimide groups in the structure thereof; and 3 to 20 vol % of an inorganic needle-like filler. The heat resistant adhesive film is obtained by applying the thermosetting adhesive composition onto a polyimide film, followed by drying. The wiring film is obtained by placing a conductor wiring layer on the heat resistant adhesive film.

Abstract translation: 提供了保存稳定性，可靠性和低温粘合性优异的热固性粘合剂组合物; 以及使用该组合物得到的卷曲耐热膜和布线膜。 热固性粘合剂组合物包含100重量份在其结构中具有双酚S骨架的苯氧基树脂; 5〜30重量份在其结构中含有多个马来酰亚胺基团的马来酰亚胺化合物; 和3〜20体积％的无机针状填料。 通过将热固性粘合剂组合物涂布在聚酰亚胺膜上，然后干燥获得耐热粘合剂膜。 通过将导体布线层放置在耐热粘合膜上而获得布线膜。

公开(公告)号：US08507803B2

公开(公告)日：2013-08-13

申请号：US12722810

申请日：2010-03-12

Applicant: Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Ayao Kariya ,  Katsuhiro Satou ,  Yasuhiro Okuda

Inventor： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Ayao Kariya ,  Katsuhiro Satou ,  Yasuhiro Okuda

IPC: H05K1/03

CPC classification number: H05K3/323 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2203/083 ,  H05K2203/087 ,  H05K2203/104 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boards 10 and 20 electrically connects a plurality of first electrodes 12 and 13 provided to be adjacent to each other on a first board 11 with a plurality of second electrodes 22 and 23 provided to be adjacent to each other on a second board 21 through an adhesive 30 that contains conductive particles 31 and that has anisotropic conductivity. By heating and pressing the adhesive placed between the mutually facing first electrode 12 and second electrode 22 and between the mutually facing first electrode 13 and second electrode 23, an adhesive layer 30a is formed between the first board 11 and the second board 21 and in the adhesive layer 30a, a cavity portion 33 is formed between the first electrodes 12 and 13 and between the second electrodes 22 and 23.

Abstract translation: 本发明提供一种板连接结构，其可以提供具有细间距的电极，并且可以组合绝缘性能和连接可靠性。 连接印刷电路板10和20的结构在第一板11上彼此相邻设置的多个第一电极12和13与设置成彼此相邻的多个第二电极22和23电连接 第二板21通过含有导电粒子31并具有各向异性导电性的粘合剂30。 通过加热和加压位于相互相对的第一电极12和第二电极22之间以及相互面对的第一电极13和第二电极23之间的粘合剂，在第一板11和第二板21之间形成粘接层30a， 粘合层30a，在第一电极12和13之间以及第二电极22和23之间形成空腔部分33。

公开(公告)号：US08216672B2

公开(公告)日：2012-07-10

申请号：US11152984

申请日：2005-06-14

Applicant: James David Blackhall Smith ,  Gary Stevens ,  John William Wood

Inventor： James David Blackhall Smith ,  Gary Stevens ,  John William Wood

IPC: B32B7/12 ,  H01L23/24

CPC classification number: C08K3/22 ,  C08K3/14 ,  C08K3/28 ,  C08K2201/016 ,  H05K1/0373 ,  H05K2201/0248 ,  Y10T428/24994 ,  Y10T428/249986 ,  Y10T428/28 ,  Y10T442/2418 ,  Y10T442/2992 ,  Y10T442/50

Abstract: In one embodiment the present invention provides for a high thermal conductivity highly structured resin that comprises a host highly structured resin matrix, and a high thermal conductivity filler 30. The high thermal conductivity fillers are from 1-1000 nm in length, and high thermal conductivity fillers have an aspect ratio of between 3-100. Particular highly structured highly structured resins include at least one of liquid crystal 40 polymers, interpenetrating networks, dendrimer type matrices, expanding polymers, ladder polymers, star polymers and structured organic-inorganic hybrids 60.

Abstract translation: 在一个实施方案中，本发明提供了包含主体高度结构化树脂基质和高导热性填料30的高导热性高结构化树脂。高热导率填料的长度为1-1000nm，高导热性 填料的纵横比在3-100之间。 特别高度结构化的高度结构化树脂包括液晶40聚合物，互穿网络，树枝状聚合物基质，膨胀聚合物，梯形聚合物，星形聚合物和结构化有机 - 无机杂化物60中的至少一种。

公开(公告)号：US20120119626A1

公开(公告)日：2012-05-17

申请号：US13359037

申请日：2012-01-26

Applicant: Wataru TAKAHASHI ,  Hitoshi YOSHIKAWA ,  Jun KOBAYASHI

Inventor： Wataru TAKAHASHI ,  Hitoshi YOSHIKAWA ,  Jun KOBAYASHI

IPC: H01B5/00 ,  H05K1/09 ,  H01L41/16

CPC classification number: H05K1/095 ,  C08K2201/001 ,  G06F3/044 ,  H01L41/0478 ,  H02N1/006 ,  H05K1/162 ,  H05K2201/0133 ,  H05K2201/0245 ,  H05K2201/0248

Abstract: To provide a conductive film that is flexible, extendable and contractible, and for which the electrical resistance hardly increases even when the conductive film is extended. The conductive film contains an elastomer and metallic filler particles, and satisfies a condition (A) [an average value of reference numbers is 0.8 (1/μm) or more, or the metallic filler particles include flake-like metallic filler particles having a thickness of 1 μm or less and an aspect ratio of 26 or more and the average value of the reference numbers is 0.4 (1/μm) or more] and a condition (B) [a number of unit areas for which an area percentage of the elastomer is 60% or more is 20 or more], the condition (A) being a conductivity indicator and the condition (B) being a flexibility indicator.

Abstract translation: 为了提供柔性，可延伸和收缩的导电膜，并且即使当导电膜延伸时，其电阻也几乎不增加。 导电膜含有弹性体和金属填料粒子，满足条件（A）[参考数字的平均值为0.8（1 /μm）以上），或者金属填料粒子包含具有厚度的片状金属填料粒子 为1μm以上，纵横比为26以上，基准数的平均值为0.4（1 /μm）以上]和条件（B）[单位面积的面积百分比 弹性体为60％以上为20以上]，条件（A）为电导率指标，条件（B）为柔性指标。

公开(公告)号：US20110256342A1

公开(公告)日：2011-10-20

申请号：US13141497

申请日：2009-12-03

Applicant: Hideaki Toshioka ,  Yasuhiro Okuda

Inventor： Hideaki Toshioka ,  Yasuhiro Okuda

IPC: C09J7/00 ,  C09J163/02 ,  B32B7/00

CPC classification number: C09J171/00 ,  C08G2650/40 ,  C08G2650/56 ,  C08L33/068 ,  C08L63/00 ,  C08L71/00 ,  C08L2205/03 ,  C08L2205/05 ,  C08L2666/02 ,  C08L2666/14 ,  C09J133/068 ,  C09J163/00 ,  H01B1/22 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/83851 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0248 ,  H05K2203/104 ,  Y10T428/24174 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00014

Abstract: Provided is a film adhesive that has a high flexibility and a high adhesion strength and is easy to prepare by mixing. The film adhesive contains, as essential components, a bisphenol A phenoxy resin having a molecular weight of 30,000 or more, an epoxy resin having a molecular weight of 500 or less, a glycidyl methacrylate copolymer, a rubber-modified epoxy resin, and a latent hardener. Preferably, the weight of the glycidyl methacrylate copolymer per epoxy equivalent is 1000 or less.

Abstract translation: 提供了具有高柔性和高粘合强度并且易于通过混合制备的胶粘剂。 作为必要成分，膜粘合剂含有分子量为30,000以上的双酚A苯氧基树脂，分子量为500以下的环氧树脂，甲基丙烯酸缩水甘油酯共聚物，橡胶改性环氧树脂和潜在的 硬化剂 优选地，每环氧当量的甲基丙烯酸缩水甘油酯共聚物的重量为1000以下。

公开(公告)号：US20110031001A1

公开(公告)日：2011-02-10

申请号：US12701676

申请日：2010-02-08

Applicant: Dai ISHIKAWA ,  Tomiya ABE ,  Masanobu ITO

Inventor： Dai ISHIKAWA ,  Tomiya ABE ,  Masanobu ITO

IPC: H05K1/09 ,  B32B15/04 ,  B22F7/04 ,  B22F1/02 ,  H01B9/02

CPC classification number: H05K1/097 ,  B22F2998/10 ,  B22F2999/00 ,  C23C24/087 ,  H05K3/105 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0272 ,  H05K2203/125 ,  Y10T428/12028 ,  Y10T428/12181 ,  B22F9/24 ,  B22F1/0062 ,  B22F1/0003 ,  B22F3/20 ,  B22F1/0018 ,  B22F1/0048 ,  B22F1/0025 ,  B22F2001/0037

Abstract: A composite metal fine particle material is provided, in which spherical silver nanoparticles synthesized from a silver compound, a solvent, a reducing agent, and a dispersant, and conductive fillers compose of non-spherical metal fine particles, are mixed. For example, the conductive fillers composed of the non-spherical metal fine particles are formed into slender columnar shapes, plate shapes, or ellipsoidal shapes.

Abstract translation: 提供一种复合金属微粒材料，其中由银化合物，溶剂，还原剂和分散剂合成的球形银纳米颗粒和由非球形金属微粒组成的导电填料混合。 例如，由非球形金属微粒构成的导电填料形成细长的柱状，板状或椭圆形。

公开(公告)号：US07872401B2

公开(公告)日：2011-01-18

申请号：US12855288

申请日：2010-08-12

Applicant: Osamu Onitsuka ,  Kazuyoshi Sugama ,  Sumihiko Kurita

Inventor： Osamu Onitsuka ,  Kazuyoshi Sugama ,  Sumihiko Kurita

IPC: H01L41/08

CPC classification number: H01L23/055 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/3011 ,  H03H9/1021 ,  H03H9/21 ,  H05K3/4061 ,  H05K2201/0248 ,  Y10T29/42 ,  H01L2924/00

Abstract: There is provided a piezoelectric vibrator 1 that includes a base substrate 2, a lid substrate 3, a piezoelectric vibrating reed 4, a pair of external electrodes 38 and 39, a pair of through electrodes 32 and 33, and routing electrodes 36 and 37. Both surfaces of the base substrate 2 are polished. The lid substrate 3 includes a recess 3a for a cavity C and is bonded to the base substrate. The piezoelectric vibrating reed 4 is bonded to the upper surface of the base substrate so as to be received in a cavity that is formed between the base substrate and the lid substrate. The pair of external electrodes 38 and 39 is formed on the lower surface of the base substrate. The pair of through electrodes 32 and 33 is formed so as to pass through the base substrate, maintains airtightness in the cavity, and is electrically connected to the pair of external electrodes, respectively. The routing electrodes 36 and 37 are formed on the upper surface of the base substrate and electrically connect the pair of through electrodes to the bonded piezoelectric vibrating reed. The through electrodes are formed by the hardening of paste that contains a plurality of nonspherical metal fine particles.

Abstract translation: 提供了一种压电振动器1，其包括基底基板2，盖基板3，压电振动片4，一对外部电极38和39，一对贯通电极32和33以及布线电极36和37。 对基底基板2的两面进行研磨。 盖基板3包括用于空腔C的凹部3a，并且与基板接合。 压电振动片4被接合到基底基板的上表面，从而被容纳在形成在基底基板和盖基板之间的空腔中。 一对外部电极38和39形成在基底基板的下表面上。 一对贯通电极32,33形成为通过基底基板，保持空腔内的气密性，并分别与一对外部电极电连接。 布线电极36和37形成在基底基板的上表面上，并将一对通孔电连接到键合的压电振动片上。 贯通电极通过含有多个非球形金属微粒的糊状物硬化而形成。

公开(公告)号：US20100301709A1

公开(公告)日：2010-12-02

申请号：US12855288

申请日：2010-08-12

Applicant: Osamu ONITSUKA ,  Kazuyoshi SUGAMA ,  Sumihiko KURITA

Inventor： Osamu ONITSUKA ,  Kazuyoshi SUGAMA ,  Sumihiko KURITA

IPC: H01L41/22 ,  H01L41/053 ,  H03B5/32

CPC classification number: H01L23/055 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/3011 ,  H03H9/1021 ,  H03H9/21 ,  H05K3/4061 ,  H05K2201/0248 ,  Y10T29/42 ,  H01L2924/00

Abstract: There is provided a piezoelectric vibrator 1 that includes a base substrate 2, a lid substrate 3, a piezoelectric vibrating reed 4, a pair of external electrodes 38 and 39, a pair of through electrodes 32 and 33, and routing electrodes 36 and 37. Both surfaces of the base substrate 2 are polished. The lid substrate 3 includes a recess 3a for a cavity C and is bonded to the base substrate. The piezoelectric vibrating reed 4 is bonded to the upper surface of the base substrate so as to be received in a cavity that is formed between the base substrate and the lid substrate. The pair of external electrodes 38 and 39 is formed on the lower surface of the base substrate. The pair of through electrodes 32 and 33 is formed so as to pass through the base substrate, maintains airtightness in the cavity, and is electrically connected to the pair of external electrodes, respectively. The routing electrodes 36 and 37 are formed on the upper surface of the base substrate and electrically connect the pair of through electrodes to the bonded piezoelectric vibrating reed. The through electrodes are formed by the hardening of paste that contains a plurality of nonspherical metal fine particles.

Abstract translation: 提供了一种压电振动器1，其包括基底基板2，盖基板3，压电振动片4，一对外部电极38和39，一对贯通电极32和33以及布线电极36和37。 对基底基板2的两面进行研磨。 盖基板3包括用于空腔C的凹部3a，并且与基板接合。 压电振动片4被接合到基底基板的上表面，从而被容纳在形成在基底基板和盖基板之间的空腔中。 一对外部电极38和39形成在基底基板的下表面上。 一对贯通电极32,33形成为通过基底基板，保持空腔内的气密性，并分别与一对外部电极电连接。 布线电极36和37形成在基底基板的上表面上，并将一对通孔电连接到键合的压电振动片上。 贯通电极通过含有多个非球形金属微粒的糊状物硬化而形成。

公开(公告)号：US20100141376A1

公开(公告)日：2010-06-10

申请号：US12703701

申请日：2010-02-10

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H01C7/10 ,  B05D5/12 ,  B32B15/04 ,  B32B9/00

CPC classification number: H01C7/1006 ,  B82Y10/00 ,  H01B1/22 ,  H01B1/24 ,  H01C7/105 ,  H01C17/0652 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0738 ,  H05K2203/0723 ,  H05K2203/105 ,  Y10S977/742 ,  Y10S977/779 ,  Y10T428/30 ,  Y10T428/31678

Abstract: One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.

Abstract translation: 一个或多个实施例提供了一种使用具有半导体或导电材料的电压可切换介电材料的器件，该器件具有相对较高的纵横比，以便增强器件上的VSD材料的机械和电学特性。

公开(公告)号：US07341680B2

公开(公告)日：2008-03-11

申请号：US11070657

申请日：2005-03-02

Applicant: Alfred I-Tsung Pan ,  Scott T. Haubrich

Inventor： Alfred I-Tsung Pan ,  Scott T. Haubrich

IPC: H01B1/00 ,  H01B1/02 ,  B32B5/16

CPC classification number: H05K1/097 ,  H01B1/22 ,  H01B1/24 ,  H01L21/288 ,  H01L21/76801 ,  H01L29/78681 ,  H01L29/7869 ,  H05K2201/0248 ,  H05K2201/0272 ,  H05K2201/0323 ,  Y10T428/2982

Abstract: A printable composition for use in forming a printed element by printing and curing is described. The printable composition comprises a plurality of nanostructures of a first type that, upon printing and curing, form an arrangement defining intermediate volumes thereamong. The printable composition further comprises a plurality of nanostructures of a second type that, upon printing and curing, at least partially fill the intermediate volumes to promote smooth surface topography and reduced porosity in the printed element.

Abstract translation: 描述了通过印刷和固化形成印刷元件的可印刷组合物。 可印刷组合物包括第一类型的多个纳米结构，其在印刷和固化时形成限定中间体积的布置。 可印刷组合物还包括第二类型的多个纳米结构，其在印刷和固化时至少部分地填充中间体积以促进印刷元件中的光滑表面形貌和降低的孔隙率。