Abstract:
The invention relates to a High Voltage switch configuration (10) having an input terminal (IN) which receives an input signal (Vin) to drive a load and an output terminal (OUT) which issues an output signal (Vout) to the load. Advantageously according to the invention, the High Voltage switch configuration ( 10) comprises at least a first and a second diode (D1, D2), being placed in antiseries between said input and output terminals (IN, OUT) and having a pair of corresponding terminals in common, in correspondence of a first internal circuit node (Xc1).
Abstract:
The present invention relates to a circuit architecture for the parallel supplying of power during an electric or electromagnetic testing, such as EMWS or EWS or WLBI testing, of a plurality of electronic devices (2) each integrated on a same semiconductor wafer (1) wherein the electronic devices (1) are neatly provided on the semiconductor wafer (1) through integration techniques and have edges (5) bounded by separation scribe lines (7). Advantageously according to the invention, the circuit architecture comprises: - at least one conductive grid (4), interconnecting at least one group of the electronic devices (2) and having a portion being external (14) to the devices of the group and a portion being internal (13) to the devices of the group; the external portion (14) of the conductive grid (4) being extended also along the separation scribe lines (7); the internal portion (13) being extended within at least a part of the devices of the group; interconnection pads (6) between the external portion (14) and the internal portion (13) of the conductive grid (4) being provided on at least a part of the devices of the group, the interconnection pads (6) forming, along with the internal and external portions, power supply lines which are common to different electronic devices (2) of the group.
Abstract:
In a reliable method and a relative circuit for monitoring the powering of a remote device through a LAN it is not necessary to generate an extra biasing voltage higher than the DC power supply voltage. As in known power distribution systems, the DC voltage used for supplying the remote device is applied to the LAN line and at the same time an AC voltage is applied to the same line for monitoring whether the remote device is connected or not to the LAN line. However, differently from prior techniques, the DC voltage is applied to a first or "high" terminal and the AC voltage is applied to the other or "low" terminal of the LAN line through a decoupling capacitor. This arrangement makes possible to supply the remote device with the largest possible DC voltage compatible with a fully integrated AC signal generator, disconnection detector and PSE controller and enhances the reliability of recognition of whether the powered device is connected to or disconnected from the LAN line.
Abstract:
An electrical circuit (1) for conversion from differential to single-ended is described, comprising: a differential amplifier stage (2) having a first (IN+) and a second (IN") input; a first (5) and a different second charging circuit (6) of the differential stage that can be operatively coupled, respectively, with an output (OUT*) of the conversion circuit (1) and with an auxiliary output (AUXOUT*). The circuit also comprises a first (7) and a second (8) buffer circuit each functionally arranged between one of said outputs\and between one of said charging circuits. The buffer circuits being configured so as to minimise a difference between the relative impedances seen towards said outputs (OUT*, AUXOUT*).
Abstract:
Herein described is a control device of a device for the correction of the power factor in forced switching power supplies; said device for the correction of the power factor comprises a converter (20) and said control device (1) is coupled to the converter to obtain from an alternating input line voltage (Vin) a regulated output voltage (Vout) . The control device (1) comprises generating means (421-423) associated to a capacitor (Cf f) for generating a signal (Vff) representative of the root-mean- square value of the alternating line voltage; the generating means (421-424) are associated to means for discharging (Rf f) said capacitor. The control device comprises further means for discharging (Ml, COMPl, Cl; Ml 6, COMPI 1, CI 1; M50, COMP22, C0MP33, Cint) the capacitor (Cf f) suitable for discharging said capacitor when the signal (Vff) representative of the root-mean- square value of the alternating line voltage goes below a given value (VCl, VCI 1, Vint) .
Abstract:
Described herein is a microelectromechanical device (10) having a mobile mass (12) that undergoes a movement, in particular a spurious movement, in a first direction (z) in response to an external event; the device moreover has a stopper structure (14, 20) configured so as to stop said spurious movement. In particular, a stopper element (20) is fixedly coupled to the mobile mass (12) and is configured so as to abut against a stopper mass (14) in response to the spurious movement, thereby stopping it. In detail, the stopper element (20) is arranged on the opposite side of the stopper mass (14) with respect to a direction of the spurious movement, protrudes from the space occupied by the mobile mass (12) and extends in the space occupied by the stopper mass, in the first direction (z).
Abstract:
A process for manufacturing a power semiconductor device (25; 35) envisages the steps of: providing a body of semiconductor material (3) having a top surface (4) and having a first conductivity; forming columnar regions (6) having a second type of conductivity within the body of semiconductor material (3), and surface extensions (10) of the columnar regions (6) above the top surface (4); and forming doped regions (19, 20) having the second type of conductivity, in the proximity of the top surface (4) and in contact with the columnar regions (6). The doped regions (19, 20) are formed at least partially within the surface extensions (10) of the columnar regions (6); the surface extensions (10) and the doped regions (20) have a non-planar surface pattern, in particular with a substantially V-shaped groove.
Abstract:
A chip for nucleic acid analysis includes a body (2, 9) , in which a detection chamber (7) is formed for accommodating nucleic acid probes (12, 12') . A waveguide (8) is integrated in the body (2, 9) is and is arranged at the bottom of the detection chamber (7) so that an evanescent wave (EW) , produced at an interface (8a) of the waveguide (8) when a light radiation is conveyed within the waveguide (8), is irradiated towards the inside of the detection chamber (7) . An apparatus for inspection of nucleic acid probes includes: a holder (22) , on which a chip (1) for nucleic acid analysis is loaded, the chip containing nucleic acid probes (12, 12'); a light source (24) for supplying an excitation radiation to the nucleic acid probes (12, 12'); and an optical sensor (25) arranged so as to receive radiation coming from the nucleic acid probes (12, 12') .
Abstract:
Process for manufacturing a multi-drain power electronic device (30) characterised in that it comprises the following steps: forming a first semiconductor layer (21) of the first type of conductivity - forming at least a second semiconductor layer (23) of a second type of conductivity on the first semiconductor layer (21), forming, in this at least a second semiconductor layer (23), a first plurality of implanted regions (D3) of the first type of conductivity forming implanted body regions (40) of the second type of conductivity in portions of said second semiconductor layer (23) free from said first plurality of implanted regions (D3), - carrying out a thermal diffusion process so that the first plurality of implanted regions (D3) form a first plurality of electrically continuous implanted column regions (D) of the first type of conductivity along this at least a second semiconductor layer (23) and in electric contact with the first semiconductor layer (21).
Abstract:
In a device (2) for determining the position (P 1 (X, y) ) of a touch on a contact surface (Ia) , a plurality of vibration sensors (4) are configured to detect mechanical vibrations (9) generated by the touch on the contact surface (1a) and to generate corresponding vibration signals, and a processing circuit (6) is connected to the vibration sensors (4) and is configured to determine the touch position (P 1 (x, y) ) via a time-of-f light algorithm, based on differences between times of detection (t 1 , t 2 , t 3 ) of the mechanical vibrations (9) by the vibration sensors (4) .