公开(公告)号：US08551315B2

公开(公告)日：2013-10-08

申请号：US13441573

申请日：2012-04-06

Applicant: Adam L. Cohen

Inventor： Adam L. Cohen

IPC: C25D5/02 ,  C25D5/10

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

公开(公告)号：US08551314B2

公开(公告)日：2013-10-08

申请号：US12611795

申请日：2009-11-03

Applicant: Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley

Inventor： Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley

IPC: C25D5/02 ,  C25D5/48

CPC classification number: C25D1/003 ,  B33Y10/00 ,  B81B2201/042 ,  B81C1/00293 ,  B81C1/00333 ,  B81C2201/0197 ,  B81C2203/0145 ,  C25D1/10 ,  C25D5/022 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647 ,  Y10T156/10

Abstract: Various embodiments of the invention are directed to formation of mesoscale or microscale devices using electrochemical fabrication techniques where structures are formed from a plurality of layers as opened structures which can be folded over or other otherwise combined to form structures of desired configuration. Each layer is formed from at least one structural material and at least one sacrificial material. The initial formation of open structures may facilitate release of the sacrificial material, ability to form fewer layers to complete a structure, ability to locate additional materials into the structure, ability to perform additional processing operations on regions exposed while the structure is open, and/or the ability to form completely encapsulated and possibly hollow structures.

公开(公告)号：US20100196660A1

公开(公告)日：2010-08-05

申请号：US12699171

申请日：2010-02-03

Applicant: MARTIN DRESSLER

Inventor： MARTIN DRESSLER

IPC: G03F7/20 ,  B32B3/10 ,  B32B3/26 ,  B32B3/30 ,  A61F2/02

CPC classification number: G03F7/0035 ,  B81C1/00087 ,  B81C2201/0197 ,  G03F7/0037 ,  G03F7/0047 ,  G03F7/09 ,  G03F7/091 ,  G03F7/38 ,  Y10T428/24331 ,  Y10T428/24752 ,  Y10T428/2495

Abstract: The invention relates to a method for producing micro-structured shaped parts (22) and the resulting products, wherein a first negative or positive photosensitive layer (12) with a layer thickness (D1) is deposited on a substrate (10) and the first negative or positive photosensitive layer (12) is exposed area-by-area with light of a suitable wavelength; a second negative or positive photosensitive layer (12′) with a layer thickness (D2) is deposited on the first negative or positive photosensitive layer (12) and exposed area-by-area with light of a suitable wavelength, wherein the exposed regions (16′) in the second layer (12′) are identical to and/or different from the exposed regions (16) in the first layer (12); the steps of depositing and exposing the photosensitive layer (12, 12′) area-by-area are performed repeatedly until a predetermined height H is attained, wherein the exposed regions (16, 16′) of the photosensitive layers (12, 12′) represent the positive or negative of the microstructure of the shaped part (22); the exposed (16, 16′) or the unexposed regions (18, 18′) of the shaped part (22) are washed out with a developer; and the remaining preform (20) is subsequently solidified.

Abstract translation: 本发明涉及一种用于生产微结构成形部件（22）和所得产品的方法，其中具有层厚度（D1）的第一负或正感光层（12）沉积在基板（10）上，第一 负的或正的感光层（12）用合适的波长的光线逐个曝光; 具有层厚度（D2）的第二负或正感光层（12'）沉积在第一负或正光敏层（12）上，并且用适当波长的光曝光逐个区域，其中曝光区域 16'）与第一层（12）中的暴露区域（16）相同和/或不同; 反复进行逐层沉积和曝光感光层（12,12'）的步骤，直到达到预定高度H，其中感光层（12,12'）的曝光区域（16,16'） ）表示成形部（22）的微结构的正或负。 用显影剂冲洗成形部件（22）的暴露（16,16'）或未曝光区域（18,18'）; 然后将剩余的预制件（20）固化。

公开(公告)号：US20100193366A1

公开(公告)日：2010-08-05

申请号：US12698026

申请日：2010-02-01

Applicant: Adam L. Cohen

Inventor： Adam L. Cohen

IPC: C25D5/02 ,  C25D5/48

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

公开(公告)号：US20100089868A1

公开(公告)日：2010-04-15

申请号：US12450659

申请日：2008-04-08

Applicant: Roland Scheuerer ,  Heribert Weber ,  Eckhard Graf

Inventor： Roland Scheuerer ,  Heribert Weber ,  Eckhard Graf

IPC: B81C1/00 ,  B44C1/22

CPC classification number: B81C1/00333 ,  B81B2203/033 ,  B81C1/0015 ,  B81C2201/0197

Abstract: A method for producing a micromechanical component is proposed, a trench structure being substantially completely filled up by a first filler layer, and a first mask layer being applied on the first filler layer, on which in turn a second filler layer and a second mask layer are applied. A micromechanical component is also proposed, the first filler layer filling up the trench structure of the micromechanical component and at the same time forming a movable sensor structure.

Abstract translation: 提出了一种用于制造微机械部件的方法，其中沟槽结构基本上被第一填充层完全填充，第一掩模层被施加在第一填料层上，第二掩模层又在第二填料层和第二掩模层 被应用。 还提出了微机械部件，第一填充层填充微机械部件的沟槽结构，同时形成可移动的传感器结构。

公开(公告)号：US20090250430A1

公开(公告)日：2009-10-08

申请号：US11278137

申请日：2006-03-30

Applicant: Gang Zhang

Inventor： Gang Zhang

IPC: B32B38/10 ,  C23F1/02

CPC classification number: B32B38/10 ,  B81C1/00119 ,  B81C2201/0109 ,  B81C2201/0197 ,  C23C28/322 ,  C23C28/325 ,  C23C28/345 ,  C25D1/003 ,  C25D5/022

Abstract: A multi-layer fabrication method for making three-dimensional structures is provided. In one embodiment, the formation of a multi-layer three-dimensional structure comprises: 1) fabricating a plurality of layers with each layer comprising at least two materials; 2) aligning the layers; 3) attaching the layers together to form a multi-layer structure; and 4) removing at least a portion of at least one of the materials from the multi-layer structure. Fabrication methods for making the required layers are also disclosed. In another embodiment, the formation of a multi-layer three-dimensional structure comprises: 1) attaching a layer of a material to a substrate or a previously formed layer; 2) machining the attached layer to form a layer that comprises at least two materials; and 3) repeating the operations of 1) and 2) a plurality of times to form a multi-layer structure; and 4) removing at least a portion of at least one of the materials from the multi-layer structure to form a desired three-dimensional structure.

Abstract translation: 提供了一种用于制造三维结构的多层制造方法。 在一个实施例中，多层三维结构的形成包括：1）制造多层，每层包含至少两种材料; 2）对齐层; 3）将层连接在一起以形成多层结构; 以及4）从多层结构中去除至少一种材料的至少一部分。 还公开了制备所需层的制造方法。 在另一个实施方案中，多层三维结构的形成包括：1）将材料层附着到基底或预先形成的层上; 2）加工附着层以形成包含至少两种材料的层; 和3）重复操作1）和2）多次以形成多层结构; 以及4）从多层结构中去除至少一种材料的至少一部分以形成所需的三维结构。

公开(公告)号：US20080097352A1

公开(公告)日：2008-04-24

申请号：US11520526

申请日：2006-09-12

Applicant: Patricia A. Beck ,  Ramesh Govinda Raju ,  Xio-An Sean Zhang

Inventor： Patricia A. Beck ,  Ramesh Govinda Raju ,  Xio-An Sean Zhang

IPC: A61M5/32

CPC classification number: B81C1/00111 ,  A61B5/14542 ,  A61B5/1473 ,  A61B5/685 ,  A61M37/0015 ,  B81B2201/055 ,  B81C2201/0197 ,  Y10T29/49204

Abstract: A method of fabricating a microneedle is disclosed. The method includes forming at least one recess in a substrate, the at least one recess comprising an apex, forming an electrically seed layer on the substrate including the at least one recess, forming at least one electrically nonconductive pattern on a portion of the seed layer, the at least one nonconductive pattern being a pattern for a sensory area, plating an electrically conductive material on the seed layer to create a plated layer with an opening that exposes a portion of the nonconductive pattern and separating the plated layer from the seed layer and the at least one nonconductive pattern to release a hollow microneedle comprising a tip and at least one sensory area.

Abstract translation: 公开了一种制造微针的方法。 该方法包括在衬底中形成至少一个凹部，所述至少一个凹部包括顶点，在衬底上形成包括所述至少一个凹部的电晶种层，在种子层的一部分上形成至少一个非导电图案 所述至少一个非导电图案是用于感觉区域的图案，在所述种子层上镀覆导电材料以产生具有暴露所述非导电图案的一部分并将所述镀层与所述种子层分离的开口的镀层，以及 所述至少一个非导电图案以释放包括尖端和至少一个感觉区域的中空微针。

公开(公告)号：US07288178B2

公开(公告)日：2007-10-30

申请号：US10271574

申请日：2002-10-15

Applicant: Adam L. Cohen ,  Gang Zhang ,  Qui T. Le ,  Michael S. Lockard ,  Dennis R. Smalley

Inventor： Adam L. Cohen ,  Gang Zhang ,  Qui T. Le ,  Michael S. Lockard ,  Dennis R. Smalley

IPC: C25D5/00 ,  C25D5/02

CPC classification number: B81C1/0038 ,  B33Y10/00 ,  B81C1/00619 ,  B81C2201/0197 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D7/12 ,  C25D17/02 ,  C25D21/14 ,  H01L21/2885 ,  H01L21/76885 ,  H05K3/241

Abstract: Various embodiments of the invention provide techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion process. Preferred embodiments perform the extrusion processes via depositions through anodeless conformable contact masks that are initially pressed against substrates that are then progressively pulled away or separated as the depositions thicken. A pattern of deposition may vary over the course of deposition by including more complex relative motion between the mask and the substrate elements. Such complex motion may include rotational components or translational motions having components that are not parallel to an axis of separation. More complex structures may be formed by combining the electrochemical extrusion process with the selective deposition, blanket deposition, planarization, etching, and multi-layer operations of a multi-layer electrochemical fabrication process.

公开(公告)号：US20070240993A1

公开(公告)日：2007-10-18

申请号：US11731242

申请日：2007-03-30

Applicant: Yoshihiro Nakato ,  Shuji Nakanishi ,  Kazuhiro Fukami ,  Toshio Tada ,  Sho-Ichiro Sakai ,  Tomoyuki Nagai ,  Haruka Yamasaki

Inventor： Yoshihiro Nakato ,  Shuji Nakanishi ,  Kazuhiro Fukami ,  Toshio Tada ,  Sho-Ichiro Sakai ,  Tomoyuki Nagai ,  Haruka Yamasaki

IPC: C25D5/18 ,  C25D21/12

CPC classification number: B81C1/00126 ,  B81C1/0038 ,  B81C2201/0197 ,  C25D1/00 ,  C25D1/003 ,  C25D3/56 ,  C25D5/18 ,  C25D21/12

Abstract: An electrochemical deposition method in which the structure of a substance to be deposited on the surface of a working electrode is determined, an electrochemical deposition apparatus, and a microstructure are provided. A positive electrode 1 and a negative electrode 2 functioning as a working electrode are arranged oppositely in a liquid tank 5 containing an electrolytic (acid) solution (hereinafter referred to as “solution”) 4 in which plural substance are dissolved in an ionic state, and then a predetermined voltage is applied between the positive electrode 1 and the negative electrode 2. A reference electrode 3 is also arranged in the liquid tank 5 and the potential between the negative electrode 2 and the reference electrode 3 is measured. Since the solution 4 can be considered as a conductor, the potential V1 of the negative electrode 2 relative to the solution 4 can be determined. Furthermore, a reaction inhibitor is admixed in the liquid tank 5, spontaneous electrochemical oscillation (current oscillation in this case) is generated in the electrochemical deposition reaction of the substances in the presence of the reaction inhibitor. The waveform of the electrochemical oscillation is controlled by regulating the potential V1 of the negative electrode, the concentrations of the substances in the solution, and the kind and concentration of the reaction inhibitor, thereby the structure of a substance to be deposited on the surface of the working electrode is determined.

Abstract translation: 确定要沉积在工作电极表面上的物质的结构，电化学沉积装置和微结构的电化学沉积方法。 作为工作电极起作用的正极1和负极2相对配置在含有多种物质以离子状态溶解的电解（酸）溶液（以下称为“溶液”）4的液体罐5中， 然后在正极1和负极2之间施加预定的电压。参考电极3也布置在液体罐5中，并且测量负极2和参考电极3之间的电位。 由于溶液4可以被认为是导体，所以可以确定负极2相对于溶液4的电位V 1。 此外，在液体罐5中混合反应抑制剂，在反应抑制剂存在下，在物质的电化学沉积反应中产生自发电化学振荡（在这种情况下为电流振荡）。 通过调节负极的电位V 1，溶液中物质的浓度以及反应抑制剂的种类和浓度，由此沉积在表面上的物质的结构来控制电化学振荡的波形 确定工作电极。

公开(公告)号：US20070141743A1

公开(公告)日：2007-06-21

申请号：US11306291

申请日：2005-12-21

Applicant: Gaetan Mathieu ,  Treliant Fang ,  Eric Hobbs

Inventor： Gaetan Mathieu ,  Treliant Fang ,  Eric Hobbs

IPC: H01L21/00

CPC classification number: B81C1/0046 ,  B33Y10/00 ,  B81B2201/014 ,  B81B2203/0118 ,  B81C2201/0184 ,  B81C2201/0197 ,  C23C18/1608 ,  C23C18/1844 ,  C25D1/003 ,  C25D1/12 ,  C25D5/02 ,  G01R1/06755 ,  G01R3/00 ,  H01L21/288 ,  H01L21/76873 ,  H01L2924/0001 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/1461 ,  H05K3/1275 ,  H01L2224/13099 ,  H01L2924/00

Abstract: Systems and methods for depositing a plurality of droplets in a three-dimensional array are disclosed. The array can comprise a first type of droplets disposed to form a support structure and a second type of droplets forming a conductive seed layer on the support structure. A structure material can be electrodeposited onto the seed layer to create a three-dimensional structure.

Abstract translation: 公开了用于在三维阵列中沉积多个液滴的系统和方法。 阵列可以包括设置成形成支撑结构的第一类型的液滴和在支撑结构上形成导电种子层的第二类型的液滴。 可以将结构材料电沉积到种子层上以产生三维结构。