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    METHOD OF FORMING HIERARCHICAL MICROSTRUCTURE USING PARTIAL CURING
    214.
    发明申请
    METHOD OF FORMING HIERARCHICAL MICROSTRUCTURE USING PARTIAL CURING 审中-公开
    使用部分固化形成分层微结构的方法

    公开(公告)号：US20120034390A1

    公开(公告)日：2012-02-09

    申请号：US13265521

    申请日：2009-04-20

    Applicant: Kahp Yang Suh ,  Hoon Eui Jeong ,  No Kyun Kwak

    Inventor： Kahp Yang Suh ,  Hoon Eui Jeong ,  No Kyun Kwak

    IPC: B82B3/00

    CPC classification number: B81C1/0046 ,  B81B2203/04 ,  B81C1/00206 ,  B81C2201/034

    Abstract: Disclosed is a method of forming a hierarchical microstructure using partial curing, which is simple in the manufacturing process and capable of forming a hierarchical structure without heterogeneous interfaces. To this end, there is provided a method of forming a hierarchical microstructure using partial curing, including forming a first polymer pattern having partial curing layers and forming a second polymer pattern on the first polymer pattern by using the partial curing layers. According to the present invention, a microstructure having various hierarchical structures can be formed by using a simple process. Accordingly, efficiency in various processes in which a microstructure having various hierarchical structures needs to be formed and economic efficiency can be improved. Furthermore, new functional materials, having not only super hydrophobicity, but also a high adhesive property even in a rough surface, can be developed.

    Abstract translation: 公开了一种使用部分固化形成分级微结构的方法，其制造过程简单并且能够形成没有异质界面的层次结构。 为此，提供了使用部分固化形成层状微结构的方法，包括通过使用部分固化层在第一聚合物图案上形成具有部分固化层并形成第二聚合物图案的第一聚合物图案。 根据本发明，可以通过使用简单的工艺形成具有各种分层结构的微结构。 因此，可以提高需要形成具有各种分层结构的微结构的各种工艺中的效率和经济效率。 此外，即使在粗糙表面上，也可以开发不仅具有超疏水性，而且具有高粘合性的新功能材料。

    Imprinting of supported and free-standing 3-D micro- or nano-structures
    216.
    发明授权
    Imprinting of supported and free-standing 3-D micro- or nano-structures 有权
    支持和独立的3-D微结构或纳米结构的印刷

    公开(公告)号：US08025831B2

    公开(公告)日：2011-09-27

    申请号：US10852448

    申请日：2004-05-24

    Applicant: Yen Peng Kong ,  Hong Yee Low ,  Stella W. Pang ,  Albert F. Yee

    Inventor： Yen Peng Kong ,  Hong Yee Low ,  Stella W. Pang ,  Albert F. Yee

    IPC: B27N3/08 ,  B28B5/00 ,  A61M25/00 ,  B28B5/02 ,  B32B3/00 ,  B32B5/16

    CPC classification number: A61M25/00 ,  B27N3/08 ,  B28B3/06 ,  B81C99/0085 ,  B81C2201/034 ,  B81C2203/032 ,  B81C2203/038 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10T428/24479 ,  Y10T428/254

    Abstract: The present invention is directed to micro- and nano-scale imprinting methods and the use of such methods to fabricate supported and/or free-standing 3-D micro- and/or nano-structures of polymeric, ceramic, and/or metallic materials. In some embodiments, a duo-mold approach is employed in the fabrication of these structures. In such methods, surface treatments are employed to impart differential surface energies to different molds and/or different parts of the mold(s). Such surface treatments permit the formation of three-dimensional (3-D) structures through imprinting and the transfer of such structures to a substrate. In some or other embodiments, such surface treatments and variation in glass transition temperature of the polymers used can facilitate separation of the 3-D structures from the molds to form free-standing micro- and/or nano-structures individually and/or in a film. In some or other embodiments, a “latch-on” assembly technique is utilized to form supported and/or free-standing stacked micro- and/or nano-structures that enable the assembly of polymers without a glass transition temperature and eliminate the heating required to assemble thermoplastic polymers.

    Abstract translation: 本发明涉及微尺度和纳米级压印方法，并且使用这种方法来制造聚合物，陶瓷和/或金属材料的负载和/或独立的3-D微观和/或纳米结构 。 在一些实施例中，在制造这些结构中采用双模方法。 在这种方法中，使用表面处理以将不同的表面能赋予模具的不同模具和/或模具的不同部分。 这种表面处理允许通过压印形成三维（3-D）结构并将这种结构转移到基底上。 在一些或其它实施方案中，所使用的聚合物的这种表面处理和玻璃化转变温度的变化可促进3-D结构与模具的分离，以单独形成独立的和/或纳米结构，并且/ 电影。 在一些或其它实施方案中，使用“闭锁”组装技术来形成支撑和/或独立堆叠的微结构和/或纳米结构，其能够组装聚合物而不具有玻璃化转变温度并消除所需的加热 组装热塑性聚合物。

    Microchip and Process for Producing Microchip
    217.
    发明申请
    Microchip and Process for Producing Microchip 有权
    Microchip和Microchip生产工艺

    公开(公告)号：US20110135539A1

    公开(公告)日：2011-06-09

    申请号：US13057466

    申请日：2009-07-13

    Applicant: Kanji Sekihara ,  Takehiko Goshima

    Inventor： Kanji Sekihara ,  Takehiko Goshima

    IPC: G01N33/48 ,  B29C45/14

    CPC classification number: B81C99/009 ,  B01J2219/00891 ,  B01L3/502707 ,  B01L3/502715 ,  B01L2200/027 ,  B01L2200/141 ,  B01L2300/0816 ,  B29C45/2628 ,  B29C45/40 ,  B29C65/02 ,  B29C66/54 ,  B29L2031/756 ,  B81B2201/051 ,  B81B2203/0338 ,  B81B2203/0384 ,  B81C2201/034

    Abstract: A microchip which comprises: a resinous base having a plurality of fine channels formed on one side thereof, one or more cylindrical parts disposed so as to protrude from the other side, and a through-hole which pierces each cylindrical part along the axis thereof and communicates with the fine channel so that the diameter of the inner wall of the through-hole gradually decreases from the tip end of the cylindrical part toward the fine channel at a first inclination angle; and a resinous covering member bonded to that side of the resinous base on which the fine channels have been formed. The microchip has been configured so that a liquid sample can be introduced from the tip end of each cylindrical part through the through-hole. The wall thickness of the cylindrical part on the end side where a liquid sample is to be introduced has been made smaller than the wall thickness thereof on the base side where the cylindrical part has been formed, by forming a step therebetween.

    Abstract translation: 一种微芯片，包括：具有形成在其一侧上的多个细通道的树脂基底，一个或多个从另一侧突出设置的圆柱形部分，以及沿着其轴线刺穿每个圆柱形部分的通孔， 与细通道连通，使得通孔的内壁的直径从圆筒部的前端朝向第一倾斜角的细通道逐渐减小; 以及与形成有微细通道的树脂基底的该侧接合的树脂覆盖部件。 微芯片已经被构造成使得液体样品可以通过通孔从每个圆柱形部分的末端引入。 通过在它们之间形成一个台阶，使得待引入液体样品的端侧的圆筒部分的壁厚比通过形成圆柱形部分的基底侧的壁厚小。

    Method for selectively anchoring large numbers of nanoscale structures
    218.
    发明授权
    Method for selectively anchoring large numbers of nanoscale structures 有权
    选择性地锚定大量纳米尺度结构的方法

    公开(公告)号：US07955644B2

    公开(公告)日：2011-06-07

    申请号：US11827169

    申请日：2007-07-10

    Applicant: Elijah Sansom ,  Derek Rinderknecht ,  Morteza Gharib

    Inventor： Elijah Sansom ,  Derek Rinderknecht ,  Morteza Gharib

    IPC: B05D7/00 ,  B05D1/38 ,  C01B31/02

    CPC classification number: B29C70/64 ,  B29K2105/162 ,  B81C3/008 ,  B81C2201/034 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/168 ,  C01B32/18 ,  C01B2202/08 ,  Y10S977/742 ,  Y10S977/753 ,  Y10T156/109 ,  Y10T428/24479

    Abstract: A method is provided for creating composites by combining pre-fabricated nanoscale structures (nanostructures) and other materials in which the nanostructures are anchored. This method results in anchored nanostructures with their base held and encased within the anchoring material to a specified depth and with a specified length of protrusion of the nanostructures from the anchoring material. This represents a major advance over previous methods of creating composites containing nanostructures which were limited to fully embedded nanostructures or, at best, very limited and uncontrolled protrusion of nanostructures. In summary, the current method involves bringing nanostructures and anchoring materials into physical contact in a controlled fashion and optionally conducting a treatment step to complete the anchoring process.

    Abstract translation: 提供了一种通过组合预制纳米尺度结构（纳米结构）和其中纳米结构被锚定的其它材料来产生复合材料的方法。 该方法导致锚定的纳米结构，其基部保持并且被包裹在锚固材料内到达指定的深度并且具有来自锚定材料的纳米结构的特定长度的突出。 这代表了先前创建含有纳米结构的复合材料的方法的重大进步，这些纳米结构限于完全嵌入的纳米结构，或者至多是非常有限的和不受控制的纳米结构突起。 总之，目前的方法涉及使纳米结构和锚定材料以受控的方式物理接触，并且可选地进行处理步骤以完成锚定过程。

    Fine Metal Structure, Process for Producing the Same, Fine Metal Mold and Device
    219.
    发明申请
    Fine Metal Structure, Process for Producing the Same, Fine Metal Mold and Device 失效
    精细金属结构，制造方法，精细金属模具和装置

    公开(公告)号：US20100310773A1

    公开(公告)日：2010-12-09

    申请号：US12859802

    申请日：2010-08-20

    Applicant: Hiroshi Yoshida ,  Haruo Akahoshi ,  Akihiro Miyauchi ,  Masahiko Ogino

    Inventor： Hiroshi Yoshida ,  Haruo Akahoshi ,  Akihiro Miyauchi ,  Masahiko Ogino

    IPC: B05D3/10

    CPC classification number: B29C33/3842 ,  B29C33/424 ,  B81B2203/0361 ,  B81C1/00111 ,  B81C1/00206 ,  B81C99/0085 ,  B81C99/009 ,  B81C2201/034 ,  B82Y10/00 ,  B82Y40/00 ,  C23C18/1608 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1657 ,  C23C18/1689 ,  C23C18/208 ,  C23C18/42 ,  G03F7/0002 ,  H01J1/304 ,  H01J9/025 ,  Y10T428/12389 ,  Y10T428/12993

    Abstract: A fine metal structure having its surface furnished with microprojections of high strength, high precision and large aspect ratio; and a process for producing the fine metal structure free of defects. There is provided a fine metal structure having its surface furnished with microprojections, characterized in that the microprojections have a minimum thickness or minimum diameter ranging from 10 nanometers to 10 micrometers and that the ratio between minimum thickness or minimum diameter (D) of microprojections and height of microprojections (H), H/D, is greater than 1. There is further provided a process for producing a fine metal structure, characterized by comprising providing a substrate having a fine rugged pattern on its surface, applying a molecular electroless plating catalyst to the surface, thereafter carrying out electroless plating to thereby form a metal layer having the rugged pattern filled, and detaching the metal layer from the substrate to thereby obtain a fine metal structure furnished with a surface having undergone reversal transfer of the above rugged pattern.

    Abstract translation: 精细的金属结构，其表面具有高强度，高精度和大纵横比的微喷射体; 以及没有缺陷的金属微细结构的制造方法。 提供了具有微喷射体的表面的细金属结构，其特征在于，微喷射体具有10纳米至10微米的最小厚度或最小直径，并且微喷射体的最小厚度或最小直径（D）与高度 的微喷射体（H）H / D大于1.还提供了一种制造精细金属结构的方法，其特征在于，在其表面上提供具有细凹凸图案的基板，将分子无电镀催化剂 然后进行无电解电镀，从而形成具有凹凸图案的金属层，并将金属层与基板分离，从而获得配备有经过上述凹凸图案的反转传送的表面的精细金属结构。

    METHOD TO FABRICATE A MOULD FOR LITHOGRAPHY BY NANO-IMPRINTING
    220.
    发明申请
    METHOD TO FABRICATE A MOULD FOR LITHOGRAPHY BY NANO-IMPRINTING 有权
    用于通过纳米压印来雕刻模具的方法

    公开(公告)号：US20100227018A1

    公开(公告)日：2010-09-09

    申请号：US12715801

    申请日：2010-03-02

    Applicant: Stèfan LANDIS

    Inventor： Stèfan LANDIS

    IPC: C23F1/00 ,  B29C59/02

    CPC classification number: G03F7/2059 ,  B81C99/009 ,  B81C2201/0159 ,  B81C2201/034 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F7/0017

    Abstract: The invention concerns a device forming an imprint mould in three dimensions and comprising at least: a substrate, comprising at least one alternation of layers having at least one part perpendicular to the plane of the substrate, in a first type of material and a second type of material which can be etched selectively relative to each other, a surface topology comprising at least: a) first patterns whose top lies at a first level relative to a surface of the substrate located either side of said topology, these first patterns being in a first type of material, b) and second patterns having at least a second level relative to said surface of the substrate, different from and lower than the first level, and these second patterns being in a second type of material.

    Abstract translation: 本发明涉及一种在三维上形成压印模具的装置，其至少包括：基底，其包括至少一个具有垂直于基底的平面的部分的至少一部分的交替层，第一类型的材料和第二类型 可以相对于彼此选择性蚀刻的材料，表面拓扑结构至少包括：a）第一图案，其顶部相对于位于所​​述拓扑结构的任一侧的所述衬底的表面处于第一水平，所述第一图案位于 第一类型的材料，b）和具有相对于衬底的所述表面至少第二级别的第二图案，不同于和低于第一层级，并且这些第二图案是第二类型的材料。

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