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公开(公告)号：NO953809A
公开(公告)日：1995-09-26
申请号：NO953809
申请日：1995-09-26
Applicant: LOCTITE IRELAND LTD
Inventor： MCARDLE CIARAN BERNARD , BURKE JOSEPH
IPC: H05K1/09 , C09J5/06 , C09J9/02 , C09J11/04 , C09J201/00 , H01B1/00 , H01B1/20 , H01B5/00 , H01B5/16 , H01F1/44 , H01F41/16 , H01L21/60 , H01R4/04 , H05K3/32
CPC classification number: H05K3/323 , H01F1/44 , H01F41/16 , H01L2224/293 , H01L2924/01019 , H01L2924/01079 , H01L2924/07811 , H01R4/04 , H01R12/57 , H05K2201/0221 , H05K2201/023 , H05K2201/0233 , H05K2201/083 , H05K2203/104 , Y10T428/12069 , Y10T428/12347 , H01L2924/00
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公开(公告)号：US20170121571A1
公开(公告)日：2017-05-04
申请号：US15116081
申请日：2015-02-13
Applicant: DEXERIALS CORPORATION
Inventor： Hidetsugu NAMIKI , Shiyuki KANISAWA , Akira ISHIGAMI , Masaharu AOKI
CPC classification number: C09J9/02 , C08K3/22 , C08K7/16 , C08K9/02 , C08K2003/0806 , C08K2003/2241 , C08K2201/001 , C08K2201/003 , C08K2201/005 , C09J11/04 , C09J163/00 , C09J201/00 , H01B1/22 , H01L24/29 , H01L24/81 , H01L24/83 , H01L33/60 , H01L33/62 , H01L33/641 , H01L33/644 , H01L33/647 , H01L2224/16238 , H01L2224/2929 , H01L2224/293 , H01L2224/29386 , H01L2224/2939 , H01L2224/29439 , H01L2224/29499 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49107 , H01L2224/73204 , H01L2224/73265 , H01L2224/81193 , H01L2224/81194 , H01L2224/81203 , H01L2933/0066 , H01L2933/0075 , H05K3/323 , H05K2201/0221 , H05K2201/0272 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014 , H01L2224/16225 , H01L2924/00 , H01L2924/014 , H01L2924/05341 , H01L2924/05432
Abstract: Provided is an anisotropic conductive adhesive in which excellent optical characteristics and heat dissipation characteristics are obtainable. The anisotropic conductive adhesive contains conductive particles each comprising a metal layer having Ag as a primary constituent formed on an outermost surface of a resin particle, solder particles having a smaller average particle diameter than the conductive particles, reflective insulating particles having a smaller average particle diameter than the solder particles and a binder into which the conductive particles solder particles and reflective insulating particles are dispersed. The conductive particles and the reflective insulating particles efficiently reflect light, thereby improving light-extraction efficiency of an LED mounting body. Additionally, inter-terminal solder bonding of the solder particles during compression bonding increases contact area between opposing terminals, thereby enabling achievement of high heat dissipation characteristics.
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公开(公告)号：US09490046B2
公开(公告)日：2016-11-08
申请号：US14891615
申请日：2014-05-20
Applicant: SEKISUI CHEMICAL CO., LTD.
Inventor： Hideaki Ishizawa , Takashi Kubota
IPC: H01B1/22 , H05K1/09 , C08L63/00 , C08L101/02 , H01L23/00 , H05K3/34 , H05K3/32 , C08J3/12 , B22F1/02 , H05K3/36 , B22F1/00
CPC classification number: H01B1/22 , B22F1/0062 , B22F1/02 , B22F1/025 , C08J3/128 , C08L63/00 , C08L101/02 , H01L24/80 , H01L2924/01322 , H01L2924/15788 , H05K1/09 , H05K3/323 , H05K3/3436 , H05K3/3457 , H05K3/363 , H05K2201/0221 , H01L2924/00
Abstract: There is provided a conductive material which has a rapid reaction rate and is high in fluxing effect. The conductive material according to the present invention includes a conductive particle having solder at at least an external surface, an anionically hardenable compound, an anionic hardener, and an organic acid having a carboxyl group and having a functional group that is an esterified carboxyl group.
Abstract translation: 提供了具有快速反应速率并且具有高的助焊效果的导电材料。 根据本发明的导电材料包括在至少外表面具有焊料的导电颗粒，阴离子可硬化的化合物，阴离子硬化剂和具有羧基并具有被酯化的羧基的官能团的有机酸。
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公开(公告)号：US20160135297A1
公开(公告)日：2016-05-12
申请号：US15001140
申请日：2016-01-19
Applicant: SIERRA CIRCUITS, INC.
Inventor： Konstantine Karavakis , Kenneth S. Bahl
CPC classification number: H05K3/387 , H05K3/427 , H05K2201/0221 , H05K2201/0236 , H05K2203/0709 , Y10T29/49167
Abstract: A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material. A layer of catalytic adhesive coats walls within the hole. The patterned metal layer is placed over the catalytic adhesive within the hole.
Abstract translation: 印刷电路板中的通孔由延伸穿过介电层压材料中的孔的图案化金属层组成。 一层催化粘合剂涂在孔内的墙壁。 图案化金属层放置在孔内的催化粘合剂上。
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215.发明申请公开(公告)号：US20160005504A1
公开(公告)日：2016-01-07
申请号：US14768837
申请日：2014-02-28
Applicant: SEKISUI CHEMICAL CO., LTD.
Inventor： Hiroya ISHIDA , Kiyoto MATSUSHITA
CPC classification number: H01B1/22 , B22F1/025 , B23K35/0244 , B23K35/262 , C22C13/00 , C23C18/1635 , C23C18/1651 , C23C18/1653 , C25D5/12 , H01B1/02 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/27003 , H01L2224/271 , H01L2224/27312 , H01L2224/2732 , H01L2224/27334 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/294 , H01L2224/29411 , H01L2224/29439 , H01L2224/29444 , H01L2224/29455 , H01L2224/29457 , H01L2224/29464 , H01L2224/29466 , H01L2224/29469 , H01L2224/29481 , H01L2224/29487 , H01L2224/32227 , H01L2224/83191 , H01L2224/834 , H01L2224/83447 , H01L2224/83815 , H01L2224/83851 , H01L2924/3512 , H01L2924/3651 , H05K3/323 , H05K2201/0218 , H05K2201/0221 , H05K2203/0425 , H01L2924/00014 , H01L2924/04941 , H01L2924/05342 , H01L2924/01015 , H01L2924/01005 , H01L2924/014 , H01L2924/01047 , H01L2924/01051 , H01L2924/01083 , H01L2924/01049 , H01L2924/01032 , H01L2924/01013 , H01L2924/0103 , H01L2924/01028 , H01L2924/01027 , H01L2924/01029
Abstract: The present invention aims to provide electroconductive microparticles which are less likely to cause disconnection due to breakage of connection interfaces between electrodes and the electroconductive microparticles even under application of an impact by dropping or the like and are less likely to be fatigued even after repetitive heating and cooling, and an anisotropic electroconductive material and an electroconductive connection structure each produced using the electroconductive microparticles. The present invention relates to electroconductive microparticles each including at least an electroconductive metal layer, a barrier layer, a copper layer, and a solder layer containing tin that are laminated in said order on a surface of a core particle made of a resin or metal, the copper layer and the solder layer being in contact with each other directly, the copper layer directly in contact with the solder layer containing copper at a ratio of 0.5 to 5% by weight relative to tin contained in the solder layer.
Abstract translation: 本发明的目的在于提供一种导电性微粒，即使在通过滴下等施加冲击时，由于电极和导电性微粒之间的连接界面的断裂，也不太可能导致断线，并且即使在重复加热之后也不易疲劳， 冷却，各向异性导电材料和导电连接结构，均使用导电性微粒制造。 本发明涉及在由树脂或金属制成的核心颗粒的表面上至少包含导电金属层，阻挡层，铜层和含有锡的焊料层的导电性微粒， 铜层和焊料层直接相互接触，铜层与含有铜的焊料层直接相对于焊料层中所含的锡的重量比为0.5〜5％。
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Patent Agency Ranking
公开(公告)号：US20140352888A1
公开(公告)日：2014-12-04
申请号：US14364026
申请日：2012-12-10
Applicant: DEXERIALS CORPORATION
Inventor： Ryosuke Odaka , Daisuke Sato
IPC: C09J4/00
CPC classification number: C09J4/00 , C08F220/32 , C09J4/06 , C09J163/10 , H05K3/323 , H05K3/361 , H05K2201/0221
Abstract: Provided are an adhesive agent capable of providing sufficient electrical continuity to a substrate to which a preflux treatment has been applied and a method for connecting electronic components. There is used an adhesive agent including a (meth)acrylate having an epoxy group in one molecule and a radical polymerization initiator having a one minute half-life temperature of 110 degrees C. or more. A surplus adhesive agent component between terminals flows, whereby an imidazole component in a preflux, the component binding to an epoxy group of an epoxy group-containing acrylate, is drawn out thereby to be removed from a surface of the terminal.
Abstract translation: 提供一种能够对已经施加了前路处理的基板提供足够的电连续性的粘合剂和用于连接电子部件的方法。 使用包含一分子中具有环氧基的（甲基）丙烯酸酯和1分钟半衰期为110℃以上的自由基聚合引发剂的粘合剂。 端子之间的多余的粘合剂成分流动，由此从外表面除去预流中的咪唑成分，与环氧基丙烯酸酯的环氧基结合的成分。
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217.发明申请ANISOTROPIC CONDUCTIVE FILM, ANISOTROPIC CONDUCTIVE FILM PRODUCTION METHOD, CONNECTING METHOD, AND BONDED STRUCTURE 有权各向异性导电膜，各向异性导电膜生产方法，连接方法和结合结构公开(公告)号：US20140168919A1
公开(公告)日：2014-06-19
申请号：US14184733
申请日：2014-02-20
Applicant: DEXERIALS CORPORATION
Inventor： Tomoyuki ISHIMATSU
CPC classification number: H05K1/181 , H01R4/04 , H05K3/323 , H05K13/046 , H05K2201/0209 , H05K2201/0221 , H05K2201/0224 , Y10T156/10 , Y10T428/2991
Abstract: To provide an anisotropic conductive film, which contains conductive particles, wherein the anisotropic conductive film is an anisotropic conductive film configured to anisotropic conductively connect a terminal of a substrate with a terminal of an electronic component, wherein the conductive particles are conductive particles, in each of which a metal plated layer and an insulating layer are sequentially provided on a surface of a resin particle, or conductive particles, in each of which an insulating layer is provided on a metal particle, or both thereof, and wherein 3.0 to 10.0 conductive particles are linked together on average.
Abstract translation: 为了提供含有导电颗粒的各向异性导电膜，其中各向异性导电膜是各向异性导电膜，其被配置成各自导电地连接基板的端子与电子部件的端子，其中导电粒子是导电粒子 其中金属镀层和绝缘层依次设置在树脂颗粒或导电颗粒的表面上，每个导电颗粒中的金属颗粒中均设置有绝缘层，或者其两者，其中3.0至10.0导电颗粒 平均连接在一起。
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公开(公告)号：US20120112215A1
公开(公告)日：2012-05-10
申请号：US12941799
申请日：2010-11-08
Applicant: Yan Chai , Calvin B. Ward
Inventor： Yan Chai , Calvin B. Ward
CPC classification number: H01L25/0753 , H01L33/50 , H01L33/62 , H01L33/64 , H01L2224/45144 , H01L2224/48091 , H01L2224/49107 , H01L2924/181 , H01L2924/3011 , H01L2933/0066 , H01L2933/0091 , H05K1/0274 , H05K1/111 , H05K3/284 , H05K3/323 , H05K2201/0209 , H05K2201/0221 , H05K2201/0233 , H05K2201/10106 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A light source and method for making the same are disclosed. The light source includes a plurality of surface mount LEDs that are bonded to a mounting substrate by a layer of asymmetric conductor. Each LED has surface mount contacts on a first surface thereof and emits light from a second surface thereof that is opposite the first surface. The mounting substrate includes a top surface having a plurality of connection traces. Each connection trace includes an n-trace positioned to underlie a corresponding one of the n-contacts and a p-trace positioned to underlie a corresponding one of the p-contacts, the p-trace having an area greater than the p-contact. The layer of asymmetric conductor is sandwiched between the surface mount contacts and the connection traces, and can optionally extend into the spaces between the LEDs to provide a scattering medium for redirecting light leaving the sides of the LEDs.
Abstract translation: 公开了一种光源及其制造方法。 光源包括通过不对称导体层结合到安装基板的多个表面贴装LED。 每个LED在其第一表面上具有表面安装触点，并且从与第一表面相对的第二表面发射光。 安装基板包括具有多个连接迹线的顶表面。 每个连接迹线包括定位成位于n个触点中的相应一个的下方的n迹线和位于相应一个p触点下方的p迹线，p迹线具有大于p触点的面积。 不对称导体层被夹在表面安装触点和连接迹线之间，并且可以可选地延伸到LED之间的空间中，以提供用于重定向离开LED侧面的光的散射介质。
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219.发明授权Polymer particles, conductive particles, and an anisotropic conductive packaging materials containing the same 有权聚合物颗粒，导电颗粒和含有它们的各向异性导电包装材料公开(公告)号：US08129023B2
公开(公告)日：2012-03-06
申请号：US11763521
申请日：2007-06-15
Applicant: Jung Bae Jun , Jin Gyu Park , Jae Ho Lee , Tae Sub Bae
Inventor： Jung Bae Jun , Jin Gyu Park , Jae Ho Lee , Tae Sub Bae
CPC classification number: H05K3/323 , H05K2201/0221 , H05K2201/0233 , Y10T428/2982 , Y10T428/2991 , Y10T428/2998
Abstract: Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films which can be used in circuit board mounting applications. The conductive particles have a uniform shape, a narrow particle diameter distribution, and appropriate compressive de-formability and recoverability from deformation. In addition, the conductive particles exhibit enhanced conducting properties without being ruptured when interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Further disclosed are polymer-based particles used in the conductive particles.
Abstract translation: 本文公开了各向异性导电粘合剂膜中包含的各向异性导电颗粒，其可用于电路板安装应用中。 导电颗粒具有均匀的形状，窄的粒径分布，以及适当的压缩成形性和可变形性。 此外，导电颗粒在连接基板之间插入和压缩时表现出增强的导电性能而不会破裂，从而实现了颗粒和连接基板之间的足够的接触面积。 进一步公开的是在导电颗粒中使用的基于聚合物的颗粒。
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220.发明申请CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT MEMBER AND CONNECTION METHOD OF CIRCUIT MEMBER USING THE CIRCUIT CONNECTION MATERIAL 审中-公开电路连接材料，电路部件的连接结构以及使用电路连接材料的电路连接方法公开(公告)号：US20110267791A1
公开(公告)日：2011-11-03
申请号：US12671804
申请日：2008-07-31
Applicant: Katsuhiko Tomisaka , Kouji Kobayashi , Jun Taketatsu , Motohiro Arifuku , Kazuyoshi Kojima , Nichiomi Mochizuki
Inventor： Katsuhiko Tomisaka , Kouji Kobayashi , Jun Taketatsu , Motohiro Arifuku , Kazuyoshi Kojima , Nichiomi Mochizuki
CPC classification number: H05K3/323 , C08K7/16 , C08K9/02 , C09J9/02 , C09J11/04 , C09J163/00 , H01L24/29 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/13016 , H01L2224/13144 , H01L2224/16 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/294 , H01L2224/29439 , H01L2224/29447 , H01L2224/29455 , H01L2224/29499 , H01L2224/2989 , H01L2224/81903 , H01L2224/83192 , H01L2224/838 , H01L2224/83851 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01R4/04 , H01R11/01 , H01R12/52 , H01R13/03 , H05K2201/0218 , H05K2201/0221 , Y10T29/49117 , Y10T428/256 , H01L2924/01028 , H01L2924/01026 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: A circuit connection material 10 comprising an adhesive composition 11 and conductive particles 12, wherein the conductive particles 12 are conductive particles 12 with protrusions 14 comprising one or more metal layers 22 on a core 21, with the metal layer 22 being formed on at least surfaces of the protrusions 14 and the metal layer 22 being composed of nickel or a nickel alloy, and compression modulus of the conductive particles 12 under 20% compression is 100-800 kgf/mm2.
Abstract translation: 包括粘合剂组合物11和导电颗粒12的电路连接材料10，其中导电颗粒12是导电颗粒12，其中凸起14包括在芯21上的一个或多个金属层22，金属层22形成在至少表面 的突起14和金属层22由镍或镍合金构成，导电粒子12在20％压缩下的压缩模量为100-800kgf / mm2。
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