公开(公告)号：US20050230072A1

公开(公告)日：2005-10-20

申请号：US10826530

申请日：2004-04-16

Applicant: Mikhail Levit

Inventor： Mikhail Levit

IPC: D21H13/26 ,  D21H25/00 ,  D21H25/04 ,  H05K1/03

CPC classification number: D21H13/26 ,  D21H25/005 ,  D21H25/04 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293

Abstract: The present invention relates to aramid paper which is suitable for composite structures and which is made using a combination of para-aramid pulp, floc, and, optionally, a polymer binder material.

Abstract translation: 本发明涉及芳族聚酰胺纸，其适用于复合结构，并且是使用对位芳族聚酰胺纸浆，絮凝物和任选的聚合物粘合剂材料的组合制成的。

公开(公告)号：US06734375B2

公开(公告)日：2004-05-11

申请号：US09956205

申请日：2001-09-18

Applicant: Yoshihiro Kawakita ,  Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura

Inventor： Yoshihiro Kawakita ,  Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura

IPC: H05K111

CPC classification number: H05K3/4626 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4658 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

Abstract: A circuit board including a desired number of electrically insulating layers and wiring layers laminated alternately, and an inner via hole for securing an electrical connection between the wiring layers by compressing and hardening a conductive paste including a conductive particle and a resin. In the electrically insulating layer, a porous sheet is provided a resin sheet at least one surface, and the porous sheet is not impregnated with a resin at least at a central portion. A through hole penetrating the electrically insulating layer in the direction of the thickness of the electrically insulating layer is filled with a conductive paste including a conductive particle and a resin, and pores that are present inside the porous sheet are filled with laminated resin. The average hole diameter of the pores inside the porous sheet may be smaller than the average particle size of the conductive particle. Thereby, it is possible to make the insulating layer of the circuit board securing the interlayer electrically connection by an inner via hole including a conductive paste to be homogenized and ultra-thin and improve the reliability of the connection of the inner via hole.

Abstract translation: 包括所需数量的电绝缘层和交替层叠的布线层的电路板，以及用于通过压缩和硬化包括导电颗粒和树脂的导电膏来固定布线层之间的电连接的内通孔。 在电绝缘层中，多孔片材至少在一个表面上设置有树脂片，多孔片材至少在中心部分不浸渍树脂。 在电绝缘层的厚度方向贯通电绝缘层的贯通孔填充有包含导电性粒子和树脂的导电性糊剂，并且在多孔质片材内存在的孔填充有层叠树脂。 多孔片内的孔的平均孔径可以小于导电性粒子的平均粒径。 由此，可以使电路基板的绝缘层通过包含导电性糊剂的内部通路孔进行层间电连接，使其均匀化，超薄化，提高内部通孔连接的可靠性。

公开(公告)号：US06615616B2

公开(公告)日：2003-09-09

申请号：US10361701

申请日：2003-02-11

Applicant: Michio Konno ,  Yasushi Miura ,  Shoichi Saito ,  Shin Kasai

Inventor： Michio Konno ,  Yasushi Miura ,  Shoichi Saito ,  Shin Kasai

IPC: C03B37083

CPC classification number: H05K1/0366 ,  C03B37/083 ,  D04H1/4218 ,  D04H1/4226 ,  D04H1/4382 ,  D04H1/4391 ,  D04H3/00 ,  H05K2201/0293 ,  H05K2201/0296 ,  Y02P40/57

Abstract: A nonwoven fabric is constructed of a highly flat glass fiber which is a glass fiber whose section is flat and has a flatness ratio of 2.0 to 10 and which has such a section that the packing fraction is at least 85%, preferably at least 90%. In this nonwoven fabric, the glass fiber section has a shape near rectangle, and hence, the glass fibers can be arranged very densely to form a thin nonwoven fabric having a high bulk density, and when it is used as a laminate material, the glass fiber content can be increased and the surface smoothness can simultaneously be enhanced and can be used appropriately as a reinforcing material for a printed wiring board. Moreover, the above flat glass fiber can be produced by use of, for example, a nozzle having such a shape that one side of the major axis walls of a nozzle chip having a flat nozzle hole is partly notched.

Abstract translation: 非织造布由高度扁平的玻璃纤维构成，该玻璃纤维的截面为平坦的玻璃纤维，平坦度为2.0〜10，填充率为85％以上，优选为90％以上， 。 在该非织造布中，玻璃纤维部分的形状接近矩形，因此玻璃纤维可以非常密集地布置以形成具有高堆积密度的薄无纺布，并且当其用作层压材料时，玻璃纤维 可以提高纤维含量，同时可以提高表面平滑性，并且可以适当地用作印刷线路板的增强材料。 此外，上述平板玻璃纤维可以通过使用例如具有扁平喷嘴孔的喷嘴片的长轴壁的一侧部分凹口的形状的喷嘴来制造。

公开(公告)号：US20030131632A1

公开(公告)日：2003-07-17

申请号：US10361701

申请日：2003-02-11

Applicant: NITTO BOSEKI CO., LTD.

Inventor： Michio Konno ,  Yasushi Miura ,  Shoichi Saito ,  Shin Kasai

IPC: C03B037/083

CPC classification number: H05K1/0366 ,  C03B37/083 ,  D04H1/4218 ,  D04H1/4226 ,  D04H1/4382 ,  D04H1/4391 ,  D04H3/00 ,  H05K2201/0293 ,  H05K2201/0296 ,  Y02P40/57

Abstract: A nonwoven fabric is constructed of a highly flat glass fiber which is a glass fiber whose section is flat and has a flatness ratio of 2.0 to 10 and which has such a section that the packing fraction is at least 85%, preferably at least 90%. In this nonwoven fabric, the glass fiber section has a shape near rectangle, and hence, the glass fibers can be arranged very densely to form a thin nonwoven fabric having a high bulk density, and when it is used as a laminate material, the glass fiber content can be increased and the surface smoothness can simultaneously be enhanced and can be used appropriately as a reinforcing material for a printed wiring board. Moreover, the above flat glass fiber can be produced by use of, for example, a nozzle having such a shape that one side of the major axis walls of a nozzle chip having a flat nozzle hole is partly notched.

Abstract translation: 非织造布由高度扁平的玻璃纤维构成，该玻璃纤维的截面为平坦的玻璃纤维，平坦度为2.0〜10，填充率为85％以上，优选为90％以上的部分， 。 在该非织造布中，玻璃纤维部分的形状接近矩形，因此玻璃纤维可以非常密集地布置以形成具有高堆积密度的薄无纺布，并且当其用作层压材料时，玻璃纤维 可以提高纤维含量，同时可以提高表面平滑性，并且可以适当地用作印刷线路板的增强材料。 此外，上述平板玻璃纤维可以通过使用例如具有扁平喷嘴孔的喷嘴片的长轴壁的一侧部分凹口的形状的喷嘴来制造。

公开(公告)号：US20030082974A1

公开(公告)日：2003-05-01

申请号：US10227997

申请日：2002-08-26

Inventor： Michael R. Samuels ,  Subhotosh Khan ,  Mikhail R. Levit

IPC: D04H005/00 ,  D04H001/00 ,  D04H013/00 ,  D04H003/00

CPC classification number: H05K1/0366 ,  B29B13/10 ,  B32B15/04 ,  B32B27/12 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T442/60

Abstract: A solid sheet which contains an nonwoven fabric made from short high tensile modulus fibers and a thermoplastic polymer having a low moisture absorption matrix resin that is useful as a substrate for circuit boards.

Abstract translation: 包含由短的高拉伸模量纤维制成的无纺布的固体片材和具有低吸湿基质树脂的热塑性聚合物，其可用作电路板的基底。

公开(公告)号：US20030008590A1

公开(公告)日：2003-01-09

申请号：US10162027

申请日：2002-06-04

Applicant: Polymer Group, Inc.

Inventor： Jerry Zucker ,  Nick Mark Carter

IPC: B32B005/02 ,  B32B027/04 ,  B32B027/12 ,  D04H001/46 ,  D04H003/10 ,  D04H005/02

CPC classification number: H05K1/0366 ,  B29C70/12 ,  B29C70/16 ,  B29C70/50 ,  B29L2031/3425 ,  D04H1/48 ,  D04H1/49 ,  D04H1/495 ,  D04H3/11 ,  D04H5/02 ,  D04H5/03 ,  H05K1/0254 ,  H05K1/0271 ,  H05K1/0272 ,  H05K1/0393 ,  H05K3/0052 ,  H05K3/107 ,  H05K2201/0129 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2201/09045 ,  H05K2201/09127 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2203/065 ,  Y10T442/259 ,  Y10T442/689

Abstract: The present invention relates to a nonwoven substrate, and specifically to a nonwoven substrate imparted with a three-dimensional image, wherein the three-dimensional nonwoven substrate is particularly suited as a support substrate for a PCB (Printed Circuit Board) and similar application. By the utilization of a hydroentangled, three-dimensionally imaged support substrate impregnated with a durable resinous matrix, PCB's, and similar applications, can be imparted with unique and useful performance properties, to improve structural performance.

Abstract translation: 本发明涉及非织造基材，特别涉及赋予三维图像的非织造基材，其中三维非织造基材特别适用于PCB（印刷电路板）的支撑基板和类似应用。 通过利用浸渍有耐用的树脂基质，PCB和类似应用的水刺，三维成像的支撑基底，可以赋予独特且有用的性能特性，以改善结构性能。

公开(公告)号：US06407017B1

公开(公告)日：2002-06-18

申请号：US09416047

申请日：1999-10-12

Applicant: Masanori Wada ,  Sadamitsu Murayama ,  Michikage Matsui

Inventor： Masanori Wada ,  Sadamitsu Murayama ,  Michikage Matsui

IPC: D02G300

CPC classification number: H01B3/52 ,  D21H13/24 ,  D21H13/26 ,  D21H15/02 ,  D21H15/06 ,  D21H17/52 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/2973 ,  Y10T428/2976 ,  Y10T428/2978 ,  Y10T442/609 ,  Y10T442/61 ,  Y10T442/611 ,  Y10T442/69 ,  Y10T442/697

Abstract: A wholly aromatic polyamide (aramid) fiber synthetic paper sheet includes 70-96 wt % of an aramid staple fiber component which includes 30 wt % or more of a para-type aramid staple fibers each having two or more annular projections spaced from each other and having an average ratio R/&ggr; of the largest diameter R of the annular projections to the smallest diameter &ggr; of the annular projection-free portions of the staple fiber, of 1.1 or more, and 4-30 wt % of a binder component, namely a resinous binder and/or heat resistant fibrids.

Abstract translation: 全芳族聚酰胺（芳族聚酰胺）纤维合成纸片包括70-96重量％的芳族聚酰胺短纤维组分，其包含30重量％或更多的对位型芳族聚酰胺短纤维，每个具有两个或更多个环形突起彼此间隔开， 具有环形突起的最大直径R与短纤维的无环形突起部的最小直径γ的平均比R /γ为1.1以上，粘合剂成分为4-30重量％，即 树脂粘合剂和/或耐热纤维素。

公开(公告)号：US06368698B1

公开(公告)日：2002-04-09

申请号：US09573977

申请日：2000-05-19

Applicant: Kay Rokman ,  Rod Komlenic ,  Kelly Rennels ,  Hakan Sabel

Inventor： Kay Rokman ,  Rod Komlenic ,  Kelly Rennels ,  Hakan Sabel

IPC: B32B300

CPC classification number: C08J5/046 ,  B32B5/28 ,  C08J5/24 ,  D21F11/002 ,  D21H13/18 ,  D21H13/22 ,  D21H13/24 ,  D21H13/26 ,  D21H13/40 ,  D21H25/005 ,  D21H25/04 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T442/2008 ,  Y10T442/2738 ,  Y10T442/608 ,  Y10T442/632 ,  Y10T442/637

Abstract: A printed circuit board is made from at least one non-woven sheet or web layer comprising at least 50% by weight acrylic fibers, with any balance substantially electrically non-conductive fibers, filler, and binder. The sheet or web is preferably made by the foam process, and may contain 60-80% straight polyacrylonitrile fibers and 40-20% fibrillated (pulp) ones. The web or sheet is preferably compressed by thermal calendering so that it has a density of about 0.1-1 grams per cubic centimeter; and the web or sheet may have a basis weight of between about 20-120 grams per square meter. The web or sheet may also have a 1-40% of substantially electrically non-conductive organic or inorganic binder, or may be substantially binder free. A printed circuit board made using the layers of these non-woven webs or sheets is otherwise conventional, including a pre-preg material, electrically conductive circuit elements, and electronics, and has improved properties compared to woven glass and non-woven aramid products, including improved fiber consolidation, easy board construction, and improved MD/CD ratio and stability.

Abstract translation: 印刷电路板由至少一种包含至少50重量％的丙烯酸纤维的无纺布片材或纤维网层制成，任何平衡物基本上不导电的纤维，填料和粘合剂。 片材或纤维网优选通过泡沫方法制成，并且可以含有60-80％的直链聚丙烯腈纤维和40-20％的原纤化（纸浆）纤维。 纤维网或片材优选通过热压延来压缩，使其具有约0.1-1克/立方厘米的密度; 并且网或片可以具有介于约20-120克/平方米之间的基重。 幅材或片材还可以具有1-40％的基本上不导电的有机或无机粘合剂，或者可以是基本上不含粘合剂的。 使用这些非织造网或片的层制成的印刷电路板是常规的，包括预浸材料，导电电路元件和电子元件，并且与机织玻璃和非织造芳族聚酰胺产品相比具有改进的性能， 包括改进的纤维固结，易于板的构建，以及改善的MD / CD比和稳定性。

公开(公告)号：US06339116B1

公开(公告)日：2002-01-15

申请号：US08770212

申请日：1996-12-19

Applicant: Ali Afzali-Ardakani ,  Jeffrey Donald Gelorme ,  Laura Louise Kosbar

Inventor： Ali Afzali-Ardakani ,  Jeffrey Donald Gelorme ,  Laura Louise Kosbar

IPC: C08G5900

CPC classification number: C08H6/00 ,  H05K1/0313 ,  H05K1/0366 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/178

Abstract: Biobased cross-linked compositions, methods of fabrication and structures, in particular biobased printed wiring boards using the compositions and methods of making the structures are described. Biobased materials such as lignin, crop oils, wood resins, tannins, and polysaccharides and combinations thereof are cross-linked, preferably using heat, a cross-linking agent, and an initiator. The materials fabricated have suitable properties for printed wiring boards which are made by impregnating a fiberglass or biobased cloth with an admixture of the biobased material, cross-linking agent and initiator which is processed by conventional methods to produce a printed wiring board.

Abstract translation: 描述了生物基交联组合物，制造方法和结构，特别是使用组合物的生物基印刷线路板和制造结构的方法。 生物基材料如木质素，作物油，木材树脂，单宁和多糖及其组合是优选使用热交联剂和引发剂交联的。 制造的材料具有适用于印刷线路板的性能，其通过用生物基材料，交联剂和引发剂的混合物浸渍玻璃纤维或生物基布而制成，其通过常规方法加工以生产印刷线路板。

公开(公告)号：US06319605B1

公开(公告)日：2001-11-20

申请号：US09147630

申请日：1999-02-04

Applicant: Sadamitsu Murayama ,  Michikage Matsui

Inventor： Sadamitsu Murayama ,  Michikage Matsui

IPC: B32B2734

CPC classification number: C08J5/06 ,  D21H13/20 ,  D21H13/24 ,  D21H13/26 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10S428/903 ,  Y10T428/2969 ,  Y10T428/31562 ,  Y10T428/31681 ,  Y10T428/31725 ,  Y10T428/31993

Abstract: A heat resistant fiber sheet composed of staple fibers consisting of a heat resistant organic high molecular polymer and fibrids consisting of a heat resistant organic high molecular polymer as main components, having excellent heat resistance, dimensional stability to heat, interlaminar peeling strength, electric insulation resistance under a high humidity, etc., and also good resin impregnating property in spite of having a high bulk density, and especially suitable for a base substrates for an electric insulating material and a laminate for an electric circuit, is obtained by setting the amount of the staple fibers occupying in the total amount of the sheet as 40 to 97% by weight and the amount of the fibrids as 3 to 60% by weight and partially softening and/or melting the fibrids so as to act as a binder.

Abstract translation: 由耐热有机高分子聚合物和由耐热有机高分子聚合物组成的纤维状物作为主要成分的短纤维组成的耐热纤维片材，耐热性，热稳定性，层间剥离强度，电绝缘电阻 在高湿度等下，并且尽管具有高的堆积密度，并且特别适合于用于电绝缘材料的基底和用于电路的层压板的树脂浸渍性能通过设定量 占片材总量的短纤维为40〜97重量％，纤条体的量为3〜60重量％，部分软化和/或熔融纤条体，以起粘合剂的作用。