公开(公告)号：US20110020960A1

公开(公告)日：2011-01-27

申请号：US12824128

申请日：2010-06-25

Applicant: Michael David HENRY ,  Michael Shearn ,  Axel Scherer

Inventor： Michael David HENRY ,  Michael Shearn ,  Axel Scherer

IPC: H01L21/66

CPC classification number: H01L21/3086 ,  B81B2203/0361 ,  B81C1/00031 ,  H01L21/3065 ,  H01L21/3081

Abstract: A method to determine minimum etch mask dosage or thickness as a function of etch depth or maximum etch depth as a function of etch mask implantation dosage or thickness, for fabricating structures in or on a substrate through etch masking via addition or removal of a masking material and subsequent etching.

Abstract translation: 确定作为蚀刻深度或最大蚀刻深度的函数的最小蚀刻掩模剂量或厚度作为蚀刻掩模注入剂量或厚度的函数的方法，用于通过添加或除去掩蔽材料通过蚀刻掩模来制造在衬底中或衬底上的结构 和随后的蚀刻。

公开(公告)号：US20100288341A1

公开(公告)日：2010-11-18

申请号：US12711111

申请日：2010-02-23

Applicant: Seheon KIM ,  Axel Scherer

Inventor： Seheon KIM ,  Axel Scherer

IPC: G02B6/10 ,  H01S3/093 ,  H01S3/097 ,  H01S3/14 ,  H01L31/00 ,  H01L33/00 ,  H01L31/18

CPC classification number: H01S5/183 ,  B82Y20/00 ,  H01L31/0352 ,  H01L31/035281 ,  H01L33/0045 ,  H01L2933/0083 ,  H01S5/041 ,  H01S5/105 ,  H01S5/18319 ,  H01S5/18327 ,  H01S5/18352 ,  H01S5/34 ,  H01S5/3412 ,  Y02E10/50

Abstract: Photonic crystal cavities and related devices and methods are described. The described cavities can be used as lasers, photovoltaic sources, and single photon sources. The cavities can be both optically and electrically pumped. A fabrication process of the cavities is also described.

Abstract translation: 描述了光子晶体腔及相关装置和方法。 所描述的空腔可以用作激光器，光电源和单个光子源。 空腔可以光学和电气泵送。 还描述了空腔的制造工艺。

公开(公告)号：US20100200782A1

公开(公告)日：2010-08-12

申请号：US12566392

申请日：2009-09-24

Applicant: Marc A. Unger ,  Hou-Pu Chou ,  Todd A. Thorsen ,  Axel Scherer ,  Stephen R. Quake

Inventor： Marc A. Unger ,  Hou-Pu Chou ,  Todd A. Thorsen ,  Axel Scherer ,  Stephen R. Quake

IPC: F16K7/02

CPC classification number: B29C51/00 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2300/0861 ,  B01L2300/0887 ,  B01L2300/123 ,  B01L2400/046 ,  B01L2400/0481 ,  B01L2400/0655 ,  B33Y80/00 ,  B81B5/00 ,  B81B2201/036 ,  B81B2201/054 ,  B81C1/00119 ,  B81C2201/019 ,  B81C2201/034 ,  C12Q1/6874 ,  F04B43/043 ,  F15C1/06 ,  F15C5/00 ,  F16K11/20 ,  F16K13/00 ,  F16K31/126 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0046 ,  F16K99/0048 ,  F16K99/0051 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0094 ,  Y10T137/0491 ,  Y10T137/0497 ,  Y10T137/2224 ,  Y10T137/87249 ,  Y10T156/10 ,  Y10T428/24479 ,  Y10T428/24744 ,  C12Q2535/125

Abstract: A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

Abstract translation: 一种制造弹性体结构的方法，包括：在第一微加工模具的顶部上形成第一弹性体层，所述第一微加工模具具有形成沿所述第一弹性体层的底表面延伸的第一凹槽的第一凸起突起; 在第二微加工模具的顶部上形成第二弹性体层，所述第二微加工模具具有第二凸起突起，所述第二凸起突起形成沿所述第二弹性体层的底表面延伸的第二凹槽; 将第二弹性体层的底表面粘合到第一弹性体层的顶表面上，使得控制通道在第一和第二弹性体层之间的第二凹部中形成; 以及将第一弹性体层定位在平面基底的顶部上，使得流动通道在第一弹性体层和平面基底之间的第一凹部中形成。

公开(公告)号：US07766055B2

公开(公告)日：2010-08-03

申请号：US11932107

申请日：2007-10-31

Applicant: Marc A. Unger ,  Hou-Pu Chou ,  Todd A. Thorsen ,  Axel Scherer ,  Stephen R. Quake ,  Markus M. Enzelberger ,  Mark L. Adams ,  Carl L. Hansen

Inventor： Marc A. Unger ,  Hou-Pu Chou ,  Todd A. Thorsen ,  Axel Scherer ,  Stephen R. Quake ,  Markus M. Enzelberger ,  Mark L. Adams ,  Carl L. Hansen

IPC: B65B31/00

CPC classification number: B05D3/04 ,  B01J2219/00355 ,  B01J2219/00378 ,  B01J2219/00396 ,  B01J2219/00398 ,  B01J2219/00439 ,  B01J2219/005 ,  B01J2219/00527 ,  B01J2219/00605 ,  B01J2219/00612 ,  B01J2219/00621 ,  B01J2219/00659 ,  B01J2219/00707 ,  B01J2219/00722 ,  B01J2219/00725 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L7/54 ,  B01L9/527 ,  B01L2200/025 ,  B01L2200/027 ,  B01L2200/0605 ,  B01L2200/10 ,  B01L2300/0681 ,  B01L2300/0861 ,  B01L2300/0887 ,  B01L2300/123 ,  B01L2300/14 ,  B01L2300/18 ,  B01L2400/046 ,  B01L2400/0481 ,  B01L2400/06 ,  B01L2400/0655 ,  B01L2400/0688 ,  B32B2037/1081 ,  B65B31/00 ,  B81B2201/036 ,  B81B2201/054 ,  B81C1/00119 ,  B81C2201/019 ,  C12Q1/6832 ,  C12Q1/6874 ,  C30B29/54 ,  F04B43/043 ,  F15C1/06 ,  F15C3/00 ,  F15C5/00 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0046 ,  F16K99/0051 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0084 ,  F16K2099/0094 ,  Y10T137/0324 ,  Y10T137/0379 ,  Y10T137/0424 ,  Y10T137/206 ,  Y10T137/2082 ,  Y10T137/2164 ,  Y10T137/2169 ,  Y10T137/2174 ,  Y10T137/2202 ,  Y10T137/2224 ,  Y10T137/3084 ,  Y10T137/7837 ,  Y10T137/86027 ,  Y10T156/10 ,  Y10T428/24479 ,  Y10T428/24612 ,  C12Q2535/125

Abstract: A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

公开(公告)号：US07760970B2

公开(公告)日：2010-07-20

申请号：US12251032

申请日：2008-10-14

Applicant: Tom Baehr-Jones ,  Michael J. Hochberg ,  Axel Scherer

Inventor： Tom Baehr-Jones ,  Michael J. Hochberg ,  Axel Scherer

IPC: G02F1/035

CPC classification number: G02F1/3515 ,  G02F1/3517 ,  G02F1/365 ,  G02F2201/063

Abstract: A single-photon absorption all-optical modulator, systems employing the same, and methods of making and using the same. An illustrative example is provided based on silicon semiconductor technology that employs rectangular waveguides. In some embodiments, it is observed that the waveguides operate with an absorption density of less than 1017 cm−1s−1mW−1 to provide a single-photon absorption operation mode.

Abstract translation: 单光子吸收全光调制器，采用其的系统及其制造和使用方法。 提供了基于采用矩形波导的硅半导体技术的说明性示例。 在一些实施例中，观察到波导以小于1017cm-1s-1mW-1的吸收密度进行操作以提供单光子吸收操作模式。

公开(公告)号：US20100175767A1

公开(公告)日：2010-07-15

申请号：US12540994

申请日：2009-08-13

Applicant: Marc A. Unger ,  Hou-Pu Chou ,  Todd A. Thorsen ,  Axel Scherer ,  Stephen R. Quake

Inventor： Marc A. Unger ,  Hou-Pu Chou ,  Todd A. Thorsen ,  Axel Scherer ,  Stephen R. Quake

IPC: F15C1/06

CPC classification number: B29C51/00 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2300/0861 ,  B01L2300/0887 ,  B01L2300/123 ,  B01L2400/046 ,  B01L2400/0481 ,  B01L2400/0655 ,  B33Y80/00 ,  B81B5/00 ,  B81B2201/036 ,  B81B2201/054 ,  B81C1/00119 ,  B81C2201/019 ,  B81C2201/034 ,  C12Q1/6874 ,  F04B43/043 ,  F15C1/06 ,  F15C5/00 ,  F16K11/20 ,  F16K13/00 ,  F16K31/126 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0046 ,  F16K99/0048 ,  F16K99/0051 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0094 ,  Y10T137/0491 ,  Y10T137/0497 ,  Y10T137/2224 ,  Y10T137/87249 ,  Y10T156/10 ,  Y10T428/24479 ,  Y10T428/24744 ,  C12Q2535/125

Abstract: A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

Abstract translation: 一种制造弹性体结构的方法，包括：在第一微加工模具的顶部上形成第一弹性体层，所述第一微加工模具具有形成沿所述第一弹性体层的底表面延伸的第一凹槽的第一凸起突起; 在第二微加工模具的顶部上形成第二弹性体层，所述第二微加工模具具有第二凸起突起，所述第二凸起突起形成沿所述第二弹性体层的底表面延伸的第二凹槽; 将第二弹性体层的底表面粘合到第一弹性体层的顶表面上，使得控制通道在第一和第二弹性体层之间的第二凹部中形成; 以及将第一弹性体层定位在平面基底的顶部上，使得流动通道在第一弹性体层和平面基底之间的第一凹部中形成。

公开(公告)号：US07754010B2

公开(公告)日：2010-07-13

申请号：US11932171

申请日：2007-10-31

Applicant: Marc A. Unger ,  Hou-Pu Chou ,  Todd A. Thorsen ,  Axel Scherer ,  Stephen R. Quake ,  Markus M. Enzelberger ,  Mark L. Adams ,  Carl L. Hansen

Inventor： Marc A. Unger ,  Hou-Pu Chou ,  Todd A. Thorsen ,  Axel Scherer ,  Stephen R. Quake ,  Markus M. Enzelberger ,  Mark L. Adams ,  Carl L. Hansen

IPC: C30B29/54

CPC classification number: B05D3/04 ,  B01J2219/00355 ,  B01J2219/00378 ,  B01J2219/00396 ,  B01J2219/00398 ,  B01J2219/00439 ,  B01J2219/005 ,  B01J2219/00527 ,  B01J2219/00605 ,  B01J2219/00612 ,  B01J2219/00621 ,  B01J2219/00659 ,  B01J2219/00707 ,  B01J2219/00722 ,  B01J2219/00725 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L7/54 ,  B01L9/527 ,  B01L2200/025 ,  B01L2200/027 ,  B01L2200/0605 ,  B01L2200/10 ,  B01L2300/0681 ,  B01L2300/0861 ,  B01L2300/0887 ,  B01L2300/123 ,  B01L2300/14 ,  B01L2300/18 ,  B01L2400/046 ,  B01L2400/0481 ,  B01L2400/06 ,  B01L2400/0655 ,  B01L2400/0688 ,  B32B2037/1081 ,  B65B31/00 ,  B81B2201/036 ,  B81B2201/054 ,  B81C1/00119 ,  B81C2201/019 ,  C12Q1/6832 ,  C12Q1/6874 ,  C30B29/54 ,  F04B43/043 ,  F15C1/06 ,  F15C3/00 ,  F15C5/00 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0046 ,  F16K99/0051 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0084 ,  F16K2099/0094 ,  Y10T137/0324 ,  Y10T137/0379 ,  Y10T137/0424 ,  Y10T137/206 ,  Y10T137/2082 ,  Y10T137/2164 ,  Y10T137/2169 ,  Y10T137/2174 ,  Y10T137/2202 ,  Y10T137/2224 ,  Y10T137/3084 ,  Y10T137/7837 ,  Y10T137/86027 ,  Y10T156/10 ,  Y10T428/24479 ,  Y10T428/24612 ,  C12Q2535/125

Abstract: A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

Abstract translation: 一种制造弹性体结构的方法，包括：在第一微加工模具的顶部上形成第一弹性体层，所述第一微加工模具具有形成沿所述第一弹性体层的底表面延伸的第一凹槽的第一凸起突起; 在第二微加工模具的顶部上形成第二弹性体层，所述第二微加工模具具有第二凸起突起，所述第二凸起突起形成沿所述第二弹性体层的底表面延伸的第二凹槽; 将第二弹性体层的底表面粘合到第一弹性体层的顶表面上，使得控制通道在第一和第二弹性体层之间的第二凹部中形成; 以及将第一弹性体层定位在平面基底的顶部上，使得流动通道在第一弹性体层和平面基底之间的第一凹部中形成。

公开(公告)号：US20100155602A1

公开(公告)日：2010-06-24

申请号：US12572234

申请日：2009-10-01

Applicant: Axel Scherer ,  Michael D. Henry ,  Harold Hager

Inventor： Axel Scherer ,  Michael D. Henry ,  Harold Hager

IPC: H01L31/09 ,  H01L27/144 ,  H01L31/101

CPC classification number: H01L31/09 ,  H01L27/1446 ,  H01L31/0216 ,  H01L31/0547 ,  Y02E10/52

Abstract: Photodetection devices and methods are described. The photodetection devices comprise semiconductor tapered pillars.

Abstract translation: 描述了光检测装置和方法。 光检测装置包括半导体锥形支柱。

公开(公告)号：US20100152066A1

公开(公告)日：2010-06-17

申请号：US12638829

申请日：2009-12-15

Applicant: Imran R. MALIK ,  Axel Scherer

Inventor： Imran R. MALIK ,  Axel Scherer

IPC: C12M1/34 ,  F28F7/00 ,  H05B1/02 ,  C40B60/04

CPC classification number: B01L7/52 ,  B01L3/5027 ,  B01L3/502715 ,  B01L7/5255 ,  B01L2200/147 ,  B01L2300/0654 ,  B01L2300/0829 ,  B01L2300/1805 ,  B01L2300/1883 ,  C12Q1/6851 ,  F28D2021/0077 ,  F28F13/00 ,  F28F2013/008 ,  G01N21/6428 ,  C12Q2565/629 ,  C12Q2561/113 ,  C12Q2527/101

Abstract: Temperature control devices and methods are described. The described temperature control devices and methods comprise optical emission and detection assemblies and can be used in PCR and qPCR applications.

Abstract translation: 描述温度控制装置和方法。 所描述的温度控制装置和方法包括光发射和检测组件，并且可以用于PCR和qPCR应用中。

公开(公告)号：US07611673B2

公开(公告)日：2009-11-03

申请号：US11529130

申请日：2006-09-28

Applicant: Emil Kartalov ,  Axel Scherer ,  W. French Anderson

Inventor： Emil Kartalov ,  Axel Scherer ,  W. French Anderson

IPC: B01L11/00 ,  G01L7/00 ,  G01L27/00 ,  G01M3/02

CPC classification number: F16K99/0001 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2200/146 ,  B01L2300/0627 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2300/087 ,  B01L2300/0874 ,  B01L2400/0415 ,  B01L2400/0418 ,  B01L2400/043 ,  B01L2400/046 ,  B01L2400/0481 ,  B01L2400/0487 ,  B01L2400/0655 ,  F04B19/006 ,  G01L19/12 ,  Y10T137/206

Abstract: Component microfluidic devices which are integrated with polydimethylsiloxane (PDMS) microfluidic chips, include designs for an electrical and optical pressure gauge, valve, electrostatic and magnetic pumps, alternating or mixing pumps, a solenoid, a magnetometer, a magnetically actuated reversible filter and valve, and a hydrolysis valve. These devices enhance and miniaturize microfluidic control, thereby expanding the available capabilities and allowing complete system miniaturization for handheld diagnostic apparatuses.

Abstract translation: 与聚二甲基硅氧烷（PDMS）微流控芯片集成的组件微流体装置包括用于电和光学压力计，阀，静电和磁性泵，交替或混合泵，螺线管，磁力计，磁力驱动的可逆过滤器和阀的设计， 和水解阀。 这些设备增强了微流控制的微型化，从而扩展了可用的功能，并允许手持式诊断设备的完整的系统小型化。