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    Optical reflection element
    223.
    发明授权
    Optical reflection element 有权
    光反射元件

    公开(公告)号：US09523849B2

    公开(公告)日：2016-12-20

    申请号：US14388213

    申请日：2013-04-24

    Applicant: PANASONIC CORPORATION

    Inventor： Toshiaki Horie ,  Soichiro Hiraoka ,  Shinsuke Nakazono ,  Kazuki Komaki

    IPC: G02B26/08 ,  G02B26/10 ,  B81B3/00

    CPC classification number: G02B26/0858 ,  B81B3/0043 ,  B81B2201/032 ,  B81B2201/042 ,  B81B2203/0163 ,  G02B26/0833 ,  G02B26/10 ,  G02B26/101 ,  G02B26/105

    Abstract: An optical reflecting device includes a mirror part, a pair of joints, a pair of vibration parts, a plurality of driving parts, and a fixed part. Each of the joints has a first end connected to respective one the facing positions to each other on the mirror part and a second end opposite to the first end, and extends along a first axis. Each of the vibration parts has a central portion connected to the second end of respective one of the joints. A plurality of driving parts are disposed in each of the pair of vibration parts, and rotate the mirror part. Both ends of each of the pair of vibration parts are connected to the fixed part. The beam width defined as the length of each of the joints in a direction orthogonal to the first axis is greater than the beam width of each of the pair of vibration parts.

    Abstract translation: 光反射装置包括镜部，一对接头，一对振动部，多个驱动部以及固定部。 每个接头具有在反射镜部分上彼此相对的相应位置的第一端和与第一端相对的第二端，并且沿着第一轴线延伸。 每个振动部分具有连接到相应的一个接头的第二端的中心部分。 在所述一对振动部的每一个中设置有多个驱动部，并且旋转所述镜部。 一对振动部的两端部与固定部连接。 被定义为与第一轴正交的方向上的每个接头的长度的梁宽度大于该对振动部分中的每一个的梁宽度。

    Aluminum nitride (AlN) devices with infrared absorption structural layer
    224.
    发明授权
    Aluminum nitride (AlN) devices with infrared absorption structural layer 有权
    具有红外吸收结构层的氮化铝（AlN）器件

    公开(公告)号：US09511994B2

    公开(公告)日：2016-12-06

    申请号：US14480051

    申请日：2014-09-08

    Applicant: INVENSENSE, INC.

    Inventor： Julius Ming-Lin Tsai ,  Michael J. Daneman

    IPC: H01L29/84 ,  B81C1/00

    CPC classification number: B81B7/007 ,  B81B3/0029 ,  B81B2201/032 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/00182 ,  B81C1/00269 ,  B81C1/00301 ,  B81C2201/013 ,  B81C2201/019 ,  B81C2203/0109 ,  B81C2203/0792

    Abstract: A micro-electro-mechanical system device is disclosed. The micro-mechanical system device comprises a first silicon substrate comprising: a handle layer comprising a first surface and a second surface, the second surface comprises a cavity; an insulating layer deposited over the second surface of the handle layer; a device layer having a third surface bonded to the insulating layer and a fourth surface; a piezoelectric layer deposited over the fourth surface of the device layer; a metal conductivity layer disposed over the piezoelectric layer; a bond layer disposed over a portion of the metal conductivity layer; and a stand-off formed on the first silicon substrate; wherein the first silicon substrate is bonded to a second silicon substrate, comprising: a metal electrode configured to form an electrical connection between the metal conductivity layer formed on the first silicon substrate and the second silicon substrate.

    Abstract translation: 公开了一种微机电系统装置。 微机械系统装置包括第一硅衬底，其包括：手柄层，包括第一表面和第二表面，所述第二表面包括空腔; 沉积在手柄层的第二表面上的绝缘层; 具有结合到绝缘层的第三表面和第四表面的器件层; 沉积在器件层的第四表面上的压电层; 设置在所述压电层上的金属导电层; 设置在所述金属导电层的一部分上的接合层; 以及在所述第一硅衬底上形成的间隔件; 其中所述第一硅衬底接合到第二硅衬底，包括：金属电极，被配置为在所述第一硅衬底上形成的所述金属传导层与所述第二硅衬底之间形成电连接。

    MEMBRANE BONDING WITH PHOTORESIST
    225.
    发明申请
    MEMBRANE BONDING WITH PHOTORESIST 审中-公开
    膜与胶片粘合

    公开(公告)号：US20160340178A1

    公开(公告)日：2016-11-24

    申请号：US15154900

    申请日：2016-05-13

    Applicant: uBeam Inc.

    Inventor： Andrew Joyce ,  Sean Taffler ,  Paul Reynolds ,  Nicholas Lavada Nemeth ,  Adam Stephen Elhadad ,  Boozarjomehr Faraji

    IPC: B81C1/00 ,  B29C65/52 ,  B29C65/48 ,  B81B3/00

    CPC classification number: B81C1/00182 ,  B81B2201/0271 ,  B81B2201/032 ,  B81B2203/0127 ,  B81C2203/032 ,  F16B11/006 ,  G03F7/00 ,  H01L21/00

    Abstract: Systems and techniques are provided for membrane bonding. A photoresist may be applied to an ultrasonic device. A portion of the photoresist may be removed. A bonding agent may be applied a portion of the photoresist that is not removed. A membrane may be placed on the ultrasonic device such that the membrane is in contact with the ultrasonic device through the bonding agent and the photoresist. The membrane and the ultrasonic device may be placed in between a first flat plate and a second flat plate, such that the second flat plate rests on top of the membrane. Light pressure may be applied to the membrane. The light pressure may be applied by one or more of the weight of the second flat plate and a pressure providing device applying pressure to either or both of the first flat plate and the second flat plate.

    Abstract translation: 提供了用于膜结合的系统和技术。 可以将光致抗蚀剂施加到超声波装置。 光刻胶的一部分可以被去除。 粘合剂可以施加未被除去的光致抗蚀剂的一部分。 膜可以放置在超声波装置上，使得膜通过粘合剂和光致抗蚀剂与超声波装置接触。 膜和超声波装置可以放置在第一平板和第二平板之间，使得第二平板位于膜的顶部上。 可以对膜施加轻微的压力。 轻压力可以通过第二平板的一个或多个重量和对第一平板和第二平板中的任一个或两者施加压力的压力提供装置施加。

    Variable capacitor and switch structures in single crystal piezoelectric MEMS devices using bimorphs
    227.
    发明授权
    Variable capacitor and switch structures in single crystal piezoelectric MEMS devices using bimorphs 有权
    使用双压电晶片的单晶压电MEMS器件中的可变电容器和开关结构

    公开(公告)号：US09466430B2

    公开(公告)日：2016-10-11

    申请号：US14071025

    申请日：2013-11-04

    Applicant: RF Micro Devices, Inc.

    Inventor： Kushal Bhattacharjee

    IPC: H01L41/09 ,  H03H9/125 ,  H03H9/15 ,  H01G5/18 ,  H03H9/02 ,  H03H9/46 ,  H03H9/24 ,  B81B3/00

    CPC classification number: H01G5/18 ,  B81B3/0086 ,  B81B2201/018 ,  B81B2201/0271 ,  B81B2201/032 ,  H03H9/02275 ,  H03H9/02409 ,  H03H9/2405 ,  H03H9/2463 ,  H03H9/462 ,  H03H9/467 ,  H03H2009/241

    Abstract: A micro-electrical-mechanical systems (MEMS) device includes a substrate, one or more anchors formed on a first surface of the substrate, and a piezoelectric layer suspended over the first surface of the substrate by the one or more anchors. A first electrode may be provided on a first surface of the piezoelectric layer facing the first surface of the substrate, such that the first electrode is in contact with a first bimorph layer of the piezoelectric layer. A second electrode may be provided on a second surface of the piezoelectric layer opposite the first surface, such that the second electrode is in contact with a second bimorph layer of the piezoelectric layer.

    Abstract translation: 微电气机械系统（MEMS）装置包括衬底，形成在衬底的第一表面上的一个或多个锚固体和通过一个或多个锚固件悬挂在衬底的第一表面上的压电层。 第一电极可以设置在面向基板的第一表面的压电层的第一表面上，使得第一电极与压电层的第一双压电晶片层接触。 第二电极可以设置在与第一表面相对的压电层的第二表面上，使得第二电极与压电层的第二双晶片层接触。

    MIRROR DRIVE DEVICE AND DRIVING METHOD THEREOF
    229.
    发明申请
    MIRROR DRIVE DEVICE AND DRIVING METHOD THEREOF 有权
    镜子驱动装置及其驱动方法

    公开(公告)号：US20150309307A1

    公开(公告)日：2015-10-29

    申请号：US14330452

    申请日：2014-07-14

    Applicant: FUJIFILM CORPORATION

    Inventor： Takayuki NAONO

    IPC: G02B26/08 ,  H01L41/187 ,  B81B7/00 ,  G02B26/10 ,  B81B7/02

    CPC classification number: G02B26/0858 ,  B81B3/0043 ,  B81B7/008 ,  B81B7/02 ,  B81B2201/032 ,  B81B2201/042 ,  B81B2201/045 ,  B81B2203/04 ,  G02B26/105 ,  H01L41/0933 ,  H01L41/1876

    Abstract: In a mirror drive device, a first and second actuator sections are arranged on both sides of a mirror supporting section that supports a mirror section so as to sandwich the mirror supporting section. Division of an upper and lower electrodes of each of the first and second actuator sections is performed correspondingly to stress distribution of principal stresses in a piezoelectric body in resonant mode vibration, and a piezoelectric body portion corresponding to positions of a first and third upper electrode sections, and a piezoelectric body portion corresponding to positions of a second and fourth upper electrode sections have stresses in opposite directions to each other. Division of the lower electrodes is performed similar to the upper electrodes, and drive voltages having the same phase can be respectively applied to the upper and lower electrode sections of the piezoelectric body portions that are different due to a division arrangement.

    Abstract translation: 在反射镜驱动装置中，第一和第二致动器部分布置在支撑镜部分的镜支撑部分的两侧，以夹持反射镜支撑部分。 对应于谐振模式振动中的压电体的主应力的应力分布进行第一致动器部和第二致动器部中的每一个的上下电极的分割，以及对应于第一和第三上电极部的位置的压电体部 并且对应于第二和第四上部电极部分的位置的压电体部分具有彼此相反方向的应力。 下部电极的分割与上部电极类似地进行，并且可以将相同相位的驱动电压分别施加到由于分割布置而不同的压电体部分的上部和下部电极部分。

    OPTICAL AND INFRARED IMAGING SYSTEM
    230.
    发明申请
    OPTICAL AND INFRARED IMAGING SYSTEM 有权
    光学和红外成像系统

    公开(公告)号：US20150187828A1

    公开(公告)日：2015-07-02

    申请号：US13854834

    申请日：2013-04-01

    Applicant: Semiconductor Components Industries, LLC

    Inventor： Kenneth Edward Salsman

    IPC: H01L27/146 ,  H04N5/33 ,  B81B3/00 ,  G02B13/00

    CPC classification number: B81B3/0029 ,  B81B2201/032 ,  G01J3/0229 ,  G01J3/2823 ,  G06F3/0304 ,  H01L27/14629 ,  H04N5/2258 ,  H04N5/332 ,  H04N9/045

    Abstract: Imaging systems may include an image sensor and a microelectromechanical systems array. The microelectromechanical systems array may be mounted over the image sensor. The system may include an infrared lens that focuses infrared light onto a first surface of the microelectromechanical systems array and a visible light source that illuminates an opposing second surface of the microelectromechanical systems array. The image sensor may capture images of the opposing second surface of the microelectromechanical systems array. The system may include processing circuitry that generates infrared images of a scene using the captured images of the microelectromechanical systems array. Microelectromechanical systems elements in the microelectromechanical systems array may change position or shape in response to infrared light that is absorbed by the microelectromechanical systems elements. Each microelectromechanical systems element may include infrared absorbing material on a metal layer. The system may include optical elements that focus visible light onto the image sensor.

    Abstract translation: 成像系统可以包括图像传感器和微机电系统阵列。 微机电系统阵列可以安装在图像传感器上。 该系统可以包括将红外光聚焦到微机电系统阵列的第一表面上的红外透镜和照亮微机电系统阵列的相对的第二表面的可见光源。 图像传感器可以捕获微机电系统阵列的相对的第二表面的图像。 该系统可以包括利用微机电系统阵列的捕获图像产生场景的红外图像的处理电路。 微机电系统阵列中的微电子机械系统元件可以响应于被微机电系统元件吸收的红外光而改变位置或形状。 每个微机电系统元件可以包括在金属层上的红外吸收材料。 该系统可以包括将可见光聚焦到图像传感器上的光学元件。

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