公开(公告)号：US20150059449A1

公开(公告)日：2015-03-05

申请号：US14478620

申请日：2014-09-05

Applicant: Technische Universiteit Delft

Inventor： Qiang Xu ,  Gregory Schneider ,  Henny Zandbergen ,  Mengyue Wu ,  Bo Song ,  Cornelis Dekker

IPC: G01N33/487 ,  B81C1/00

CPC classification number: G01N33/48721 ,  B81C1/00492 ,  B81C1/00531 ,  B81C2201/0143 ,  B81C2203/00 ,  B82Y30/00 ,  B82Y40/00 ,  G03F7/00 ,  G03F7/2037 ,  G03F7/2059 ,  Y10T428/24355

Abstract: A method for removing a high definition nanostructure in a partly free-standing layer, the layer, a sensor comprising said layer, a use of said sensor, and a method of detecting a species, and optional further characteristics thereof, using said sensor. The sensor and method are suited for detecting single ions, molecules, low concentrations thereof, and identifying sequences of base pairs, e.g., in a DNA-strand.

Abstract translation: 一种用于去除部分自立层中的高分辨率纳米结构的方法，该层，包括所述层的传感器，所述传感器的使用，以及使用所述传感器检测物种的方法及其可选的其它特征。 传感器和方法适用于检测单个离子，分子，低浓度，以及鉴定碱基对序列，例如DNA链。

公开(公告)号：US20140349078A1

公开(公告)日：2014-11-27

申请号：US14455745

申请日：2014-08-08

Applicant: Honeywell International Inc.

Inventor： Robert Jon Carlson

IPC: B29C33/38 ,  B81B7/00 ,  B29C41/00 ,  B29C59/16 ,  B29C59/14

CPC classification number: B29C33/3842 ,  B29C41/00 ,  B29C59/14 ,  B29C59/16 ,  B29K2909/00 ,  B29K2995/0037 ,  B81B7/00 ,  B81B2201/05 ,  B81B2201/058 ,  B81B2203/0127 ,  B81C99/009 ,  B81C2201/0132 ,  B81C2201/0143 ,  B81C2201/034 ,  C23F1/02 ,  H01L21/30604 ,  Y10T428/24496

Abstract: The invention is directed to a patterned aerogel-based layer that serves as a mold for at least part of a microelectromechanical feature. The density of an aerogel is less than that of typical materials used in MEMS fabrication, such as poly-silicon, silicon oxide, single-crystal silicon, metals, metal alloys, and the like. Therefore, one may form structural features in an aerogel-based layer at rates significantly higher than the rates at which structural features can be formed in denser materials. The invention further includes a method of patterning an aerogel-based layer to produce such an aerogel-based mold. The invention further includes a method of fabricating a microelectromechanical feature using an aerogel-based mold. This method includes depositing a dense material layer directly onto the outline of at least part of a microelectromechanical feature that has been formed in the aerogel-based layer.

Abstract translation: 本发明涉及用作至少部分微机电特征的模具的图案化气凝胶基层。 气凝胶的密度小于MEMS制造中使用的典型材料的密度，例如多晶硅，氧化硅，单晶硅，金属，金属合金等。 因此，可以以明显高于在较致密的材料中形成结构特征的速率的速率在气凝胶层中形成结构特征。 本发明还包括一种图案化气凝胶层以产生这种基于气凝胶的模具的方法。 本发明还包括使用基于气凝胶的模具制造微机电特征的方法。 该方法包括将致密材料层直接沉积在已经形成在气凝胶层中的微机电特征的至少一部分的轮廓上。

公开(公告)号：US20140326702A1

公开(公告)日：2014-11-06

申请号：US14331957

申请日：2014-07-15

Applicant: Osamu NUKAGA ,  Satoshi YAMAMOTO ,  Kazuhito TABATA ,  Masakazu SUGIYAMA

Inventor： Osamu NUKAGA ,  Satoshi YAMAMOTO ,  Kazuhito TABATA ,  Masakazu SUGIYAMA

IPC: B81C1/00 ,  B23K26/00

CPC classification number: B81C1/00547 ,  B23K26/50 ,  B32B3/266 ,  B81B2201/0214 ,  B81B2201/058 ,  B81B2203/0353 ,  B81C1/00507 ,  B81C2201/013 ,  B81C2201/0143 ,  C03C15/00 ,  C03C23/0025 ,  Y10T428/24273

Abstract: A method of manufacturing a base body having a microscopic hole, includes: forming at least one of a first modified region and a second modified region by scanning inside of a base body with a focal point of a first laser light having a pulse duration on order of picoseconds or less; forming a periodic modified group formed of a plurality of third modified regions and fourth modified regions by scanning an inside of the base body with a focal point of a second laser light having a pulse duration on order of picoseconds or less; obtaining the base body which is formed so that the first modified region and the second modified region overlap or come into contact with the modified group; and forming a microscopic hole by removing the first modified region and the third modified regions by etching.

Abstract translation: 一种制造具有微小孔的基体的方法，包括：通过用具有脉冲持续时间的第一激光的焦点在基体上扫描来形成第一改质区域和第二改质区域中的至少一个 皮秒或更少; 通过用脉冲持续时间为皮秒或更小的第二激光的焦点扫描基体的内部，形成由多个第三改质区域和第四改质区域形成的周期性修饰基团; 获得形成为使得第一改质区域和第二改质区域与改性基团重叠或接触的基体; 并通过蚀刻去除第一改质区和第三改质区而形成微孔。

公开(公告)号：US20140222182A1

公开(公告)日：2014-08-07

申请号：US14169336

申请日：2014-01-31

Applicant: PowerPhotonic Ltd.

Inventor： Matthew Oren Currie ,  Simon Clovis Younger ,  Roy McBride

IPC: G05B15/02

CPC classification number: G05B19/41865 ,  B81C2201/0143 ,  Y02P90/20 ,  Y02P90/26 ,  Y10S977/889

Abstract: A process for the manufacture of custom freeform optical elements utilising parameterized modelling. A system for the automatic manufacture of a custom optical element is also described with the manufacturing being by laser micro-machining. The process and system allow customers to specify and order via a web interface and so reduce engineering time, overhead and cost.

Abstract translation: 使用参数化建模制造定制自由形状光学元件的过程。 还通过激光微加工制造用于自动制造定制光学元件的系统。 流程和系统允许客户通过Web界面指定和订购，从而减少工程时间，开销和成本。

公开(公告)号：US08790534B2

公开(公告)日：2014-07-29

申请号：US13098867

申请日：2011-05-02

Applicant: Michael A. Huff

Inventor： Michael A. Huff

IPC: B23K28/02

CPC classification number: B23K28/02 ,  B23K17/00 ,  B23K26/032 ,  B23K26/0624 ,  B23K26/083 ,  B23K26/1224 ,  B23K26/348 ,  B23K26/361 ,  B23K26/40 ,  B23K2103/30 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  B81C2201/0143 ,  B81C2900/00 ,  H01J37/3056 ,  H01J2237/31713 ,  H01J2237/31749 ,  Y10S977/84 ,  Y10S977/888 ,  Y10S977/889 ,  Y10S977/901

Abstract: A system and method are disclosed for the precision fabrication of Micro-Electro-Mechanical Systems (MEMS), Nano-Electro-Mechanical Systems (NEMS), Microsytems, Nanosystems, Photonics, 3-D integration, heterogeneous integration, and Nanotechology devices and structures. The disclosed system and method can also be used in any fabrication technology to increase the precision and accuracy of the devices and structures being made compared to conventional means of implementation. A platform holds and moves a substrate to be machined during machining and a plurality of lasers and/or ion beams are provided that are capable of achieving predetermined levels of machining resolution and precision and machining rates for a predetermined application. The plurality of lasers and/or ion beams comprises a plurality of the same type of laser and/or ion beam. Alternatively, a close-loop control system can be used with one laser or ion beam that is controlled and operated by the close-loop control system so as to achieve the predetermined levels of machining resolution and precision and machining rates for the predetermined application.

Abstract translation: 公开了一种用于微机电系统（MEMS），纳米机电系统（NEMS），微型模型，纳米系统，光子学，3-D集成，异构集成和纳米技术装置和结构的精密制造的系统和方法 。 所公开的系统和方法也可以用于任何制造技术，以增加与常规实施方式相比正在制造的装置和结构的精度和精度。 平台在加工过程中保持和移动待加工的基板，并且提供多个激光和/或离子束，其能够实现预定应用的预定水平的加工分辨率和精度和加工速率。 多个激光器和/或离子束包括多个相同类型的激光和/或离子束。 或者，可以使用由闭环控制系统控制和操作的一个激光器或离子束来使用闭环控制系统，以实现预定应用的预定级别的加工分辨率和精度和加工速率。

公开(公告)号：US08445390B1

公开(公告)日：2013-05-21

申请号：US13294114

申请日：2011-11-10

Applicant: Teruo Sasagawa

Inventor： Teruo Sasagawa

IPC: H01L21/302 ,  H01L21/461

CPC classification number: B81C1/00492 ,  B81C1/00269 ,  B81C2201/0143 ,  B81C2203/019

Abstract: A laser absorption layer is first selectively formed in a seal pattern region surrounding an array of electromechanical systems elements, followed by depositing an antistiction layer as a blanket layer over the substrate and the laser absorption layer. The antistiction layer is then selectively removed from the seal pattern using a laser. An epoxy sealing material is provided in the seal pattern where the antistiction layer was removed and a backplate is sealed to the substrate using epoxy.

Abstract translation: 首先在围绕机电系统元件的阵列的密封图案区域中选择性地形成激光吸收层，随后在基板和激光吸收层上沉积抗静电层作为覆盖层。 然后使用激光从密封图案中选择性地去除抗静电层。 在密封图案中提供环氧密封材料，其中除去抗静电层，并且使用环氧树脂将背板密封到基底上。

公开(公告)号：US08303833B2

公开(公告)日：2012-11-06

申请号：US11766680

申请日：2007-06-21

Applicant: Milos Toth ,  Noel Smith

Inventor： Milos Toth ,  Noel Smith

IPC: B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00

CPC classification number: B05C21/005 ,  B81C1/00531 ,  B81C2201/0132 ,  B81C2201/0143 ,  H01J37/3053 ,  H01J37/317 ,  H01J2237/3174 ,  H01J2237/31744 ,  H01J2237/31749

Abstract: A method for fabrication of microscopic structures that uses a beam process, such as beam-induced decomposition of a precursor, to deposit a mask in a precise pattern and then a selective, plasma beam is applied, comprising the steps of first creating a protective mask upon surface portions of a substrate using a beam process such as an electron beam, focused ion beam (FIB), or laser process, and secondly etching unmasked substrate portions using a selective plasma beam etch process. Optionally, a third step comprising the removal of the protective mask may be performed with a second, materially oppositely selective plasma beam process.

Abstract translation: 一种用于制造微结构的方法，其中使用诸如光束引发的前体分解的光束过程，以精确图案沉积掩模，然后选择性等离子体束，包括以下步骤：首先产生保护掩模 使用诸如电子束，聚焦离子束（FIB）或激光工艺的光束过程在衬底的表面部分上，并且其次使用选择性等离子体束蚀刻工艺来蚀刻未掩模的衬底部分。 可选地，包括去除保护掩模的第三步骤可以用第二种，实质上相对地选择的等离子体束工艺进行。

公开(公告)号：US20120125892A1

公开(公告)日：2012-05-24

申请号：US13361079

申请日：2012-01-30

Applicant: Hideki SHIMOI ,  Hiroyuki KYUSHIMA ,  Keisuke ARAKI

Inventor： Hideki SHIMOI ,  Hiroyuki KYUSHIMA ,  Keisuke ARAKI

IPC: B44C1/22

CPC classification number: H01L23/481 ,  B23K26/382 ,  B23K26/384 ,  B23K26/40 ,  B23K26/55 ,  B23K2103/50 ,  B81B2203/0353 ,  B81B2203/0384 ,  B81C1/00087 ,  B81C2201/0143 ,  H01L21/30608 ,  H01L21/76898 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A laser processing method for forming a hole in a sheet-like object to be processed made of silicon comprises a depression forming step of forming a depression in a part corresponding to the hole on a laser light entrance surface side of the object, the depression opening to the laser light entrance surface; a modified region forming step of forming a modified region along a part corresponding to the hole in the object by converging a laser light at the object after the depression forming step; and an etching step of anisotropically etching the object after the modified region forming step so as to advance the etching selectively along the modified region and form the hole in the object; wherein the modified region forming step exposes the modified region or a fracture extending from the modified region to an inner face of the depression.

Abstract translation: 在由硅制成的待加工的片状物体中形成孔的激光加工方法包括凹陷形成步骤，在与物体的激光入射面侧的孔对应的部分形成凹部，凹部开口 到激光入射面; 改变区域形成步骤，通过在所述凹陷形成步骤之后会聚所述物体上的激光，沿着与所述物体中的所述孔相对应的部分形成改质区域; 以及在改质区域形成工序后对物体进行各向异性蚀刻的蚀刻工序，以沿着改质区域选择性地进行蚀刻，并在物体上形成孔; 其中所述改性区域形成步骤将所述改性区域或从所述改质区域延伸的断裂暴露于所述凹陷的内表面。

公开(公告)号：US20120074598A1

公开(公告)日：2012-03-29

申请号：US13248087

申请日：2011-09-29

Applicant: Franz-Peter Kalz

Inventor： Franz-Peter Kalz

IPC: H01L23/28 ,  B23K26/00

CPC classification number: B81C1/00801 ,  B23K2103/50 ,  B81C2201/0142 ,  B81C2201/0143

Abstract: In various embodiments, a chip may include a substrate; a coating, the coating covering the substrate at least partially and the coating being designed for being stripped at least partially by means of laser ablation; wherein between the substrate and the coating, a laser detector layer is arranged at least partially, the laser detector layer being designed for generating a detector signal for ending the laser ablation.

Abstract translation: 在各种实施例中，芯片可以包括衬底; 涂层，所述涂层至少部分地覆盖所述基底，并且所述涂层被设计为至少部分地通过激光烧蚀剥离; 其中在所述基底和所述涂层之间，至少部分地布置有激光检测器层，所述激光检测器层被设计为产生用于结束所述激光烧蚀的检测器信号。

公开(公告)号：US20120019598A1

公开(公告)日：2012-01-26

申请号：US13146513

申请日：2010-01-20

Applicant: Paul A. Hoisington ,  Marc A. Torrey ,  Paul A. Hoisington ,  Marc A. Torrey

Inventor： Paul A. Hoisington ,  Marc A. Torrey ,  Paul A. Hoisington ,  Marc A. Torrey

IPC: B41J2/14 ,  H01L21/62

CPC classification number: B81C1/00904 ,  B81B2201/058 ,  B81C1/00119 ,  B81C2201/0143 ,  B81C2201/019

Abstract: A MEMS device is described that has a body with a component bonded to the body. The body has a main surface and a side surface adjacent to the main surface and smaller than the main surface. The body is formed of a material and the side surface is formed of the material and the body is in a crystalline structure different from the side surface. The body includes an outlet in the side surface and the component includes an aperture in fluid connection with the outlet.

Abstract translation: 描述了具有结合到身体的部件的主体的MEMS装置。 主体具有与主表面相邻并且小于主表面的主表面和侧表面。 主体由材料形成，侧表面由材料形成，并且主体是与侧面不同的晶体结构。 主体包括侧表面中的出口，并且部件包括与出口流体连接的孔。