公开(公告)号：US07270845B2

公开(公告)日：2007-09-18

申请号：US10812889

申请日：2004-03-31

Applicant: Robert Japp ,  Kostas Papathomas

Inventor： Robert Japp ,  Kostas Papathomas

IPC: H01K3/10

CPC classification number: H05K1/0373 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/24322 ,  Y10T428/24355 ,  Y10T428/24917

Abstract: A dielectric composition which forms a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like. As such a layer, it includes a cured resin material and a predetermined percentage by weight of particulate fillers, thus not including continuous fibers, semi-continuous fibers or the like as part thereof.

Abstract translation: 形成电介质层的电介质组合物，其可用于诸如PCB，芯片载体等的电路化基板中。 作为这样的层，其包括固化树脂材料和预定重量的颗粒填料，因此不包括连续纤维，半连续纤维等作为其一部分。

公开(公告)号：USRE39615E1

公开(公告)日：2007-05-08

申请号：US10617653

申请日：2002-10-17

Applicant: Charles A. Poutasse

Inventor： Charles A. Poutasse

IPC: B23B3/00

CPC classification number: H05K3/386 ,  C08G59/02 ,  C08G59/06 ,  C08G59/40 ,  C08L61/04 ,  C09J163/00 ,  H05K3/022 ,  H05K3/384 ,  H05K3/385 ,  H05K3/389 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0315 ,  H05K2203/0723 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/30 ,  Y10T428/31511 ,  Y10T428/31525 ,  Y10T428/31529 ,  Y10T428/31678

Abstract: The invention relates to an adhesive composition, comprising: (A) at least one phenolic resole resin; and (B) the product made by reacting (B-1) at least one difunctional epoxy resin, with (B-2) at least one compound represented by the formula wherein in Formulae (I) and (II): G, T and Q are each independently functional groups selected from the group consisting of COOH, OH, SH, NH2, NHR1, (NHC(═NH))mNH2, R2COOH, NR12, C(O)NHR1, R2NR12, R2OH, R2SH, R2NH2 and R2NHR1, wherein R1 is a hydrocarbon group, R2 is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; T can also be R1, OR1 or SO2C6H4—NH2; and Q can also be H. The invention also relates to copper foils having the foregoing adhesive composition adhered to at least one side thereof to enhance the adhesion between said foils and dielectric substrates. The invention also relates to laminates comprising copper foil, a dielectric substrate, and an adhesion-promoting layer comprising the foregoing adhesive composition disposed between and adhered to the foil and the substrate.

Abstract translation: 本发明涉及粘合剂组合物，其包含：（A）至少一种酚醛树脂树脂; 和（B）通过使（B-1）至少一种双官能环氧树脂与（B-2）至少一种由下式表示的化合物反应制备的产物：其中在式（I）和（II）中：G，T和 Q独立地为选自COOH，OH，SH，NH 2，NHR 1，（NHC（-NH））m的官能团。 NH 2，NR 2 COOH，NR 1，SO 2，C（O）NHR 2， 1，R 2，R 2，R 2，R 2，OH，R 2， 其中R 1，R 2，R 2，R 2，R 2， / SUP>是烃基，R 2是亚烷基或亚烷基，m是1至约4的数; T也可以是R 1，或者1或2或更高的C 1 H 4 > -NH 2 2; 并且Q也可以是H.本发明还涉及具有粘附到其至少一个侧面的上述粘合剂组合物的铜箔，以增强所述箔和电介质基底之间的粘附。 本发明还涉及包含铜箔，电介质基底和包含上述粘合剂组合物的粘合促进层的层压体，所述粘合剂组合物设置在箔和衬底之间并粘附到箔和衬底上。

公开(公告)号：US07164197B2

公开(公告)日：2007-01-16

申请号：US10465155

申请日：2003-06-19

Applicant: Guoping Mao ,  Shichun Qu ,  Fuming B. Li ,  Robert S. Clough ,  Nelson B. O'Bryan

Inventor： Guoping Mao ,  Shichun Qu ,  Fuming B. Li ,  Robert S. Clough ,  Nelson B. O'Bryan

IPC: H01L29/51 ,  H01L23/532

CPC classification number: C08L65/00 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0373 ,  H05K3/4626 ,  H05K2201/0209 ,  H05K2201/0239 ,  H01L2924/00

Abstract: A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.

Abstract translation: 含有增韧的苯并环丁烯树脂和至少约50重量％的无机填料的介电复合材料。 还有具有至少一个导电层和至少一层介电复合材料的电子封装。 介电复合材料的介电常数可以小于约3.5，介电损耗小于约0.004。

公开(公告)号：US20060157827A1

公开(公告)日：2006-07-20

申请号：US11332310

申请日：2006-01-17

Applicant: Yasuhiko Tanaka ,  Kenji Toyosawa

Inventor： Yasuhiko Tanaka ,  Kenji Toyosawa

IPC: H01L23/58

CPC classification number: H01L23/4985 ,  G02F1/13452 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/12044 ,  H01L2924/19105 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/323 ,  H05K3/389 ,  H05K2201/0239 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A semiconductor device is provided that includes wiring patterns on a substrate formed of an organic insulating film, and a semiconductor chip mounted on the substrate. A liquid crystal display panel and a PW board are electrically connected to each other with an anisotropic conductive adhesive. At least one surface of the insulating film is treated with a silicon coupling material. The silicon coupling material contains silicon (Si) at a surface element density of 0.5 atomic percent to 12.0 atomic percent on a surface of the insulating film.

公开(公告)号：US06977284B2

公开(公告)日：2005-12-20

申请号：US10504170

申请日：2003-02-17

Applicant: Takeharu Morita ,  Nobuhiro Goto ,  Hiroshi Yoshitani ,  Hiroshi Hiraike

Inventor： Takeharu Morita ,  Nobuhiro Goto ,  Hiroshi Yoshitani ,  Hiroshi Hiraike

IPC: C08G61/08 ,  C08L65/00 ,  H05K1/03 ,  C08F4/42

CPC classification number: H05K1/0373 ,  C08G61/08 ,  C08L65/00 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0239

Abstract: It is an object of the present invention to provide a polymerizable composition and a cured resin composition, linear expansion coefficients of which are significantly improved without impairment of the excellent properties such as heat resistance, mechanical strength and the like of norbornene-based resins. The present invention is a polymerizable composition, which comprises a polymerizable substance containing a norbornene-based monomer or oligomer as a main component, a metathesis polymerization catalyst and silica powder, the weight content of the silica powder being larger than the weight content of the polymerizable substance.

公开(公告)号：US20050257886A1

公开(公告)日：2005-11-24

申请号：US10505342

申请日：2003-02-14

Applicant: Takayuki Matsushima ,  Masao Saito

Inventor： Takayuki Matsushima ,  Masao Saito

IPC: C09J5/00 ,  C09J5/06 ,  H05K3/32 ,  B32B31/26

CPC classification number: H05K3/323 ,  C09J5/06 ,  H01L2924/01019 ,  H05K2201/0239 ,  H05K2203/1163 ,  H05K2203/1189 ,  H05K2203/121

Abstract: Disclosed is a method for producing an electrical device by electrically and mechanically interconnecting two objects for bonding. When an adhesive layer (25) provided to an LCD (11) and a layer of a second curing agent (28) provided to a TCP (15) are brought into tight contact with each other and thrust in this state to each other under heating, a first curing agent in the adhesive layer (25) and a second curing agent forming the layer of the second curing agent react with each other so that the thermosetting resin in the adhesive layer is polymerized to bond the LCD (11) and the TCP (15) together to produce an electrical device. In case a metal chelate or a metal alcoholate and a silane coupling agent are used as the first and second curing agents, respectively, the silane coupling agent and the metal chelate react with each other to yield cations and, by these cations, the thermosetting resin undergoes cationic polymerization. The adhesive may be cured to bond the LCD (11) and the TCP (15) together in a shorter time at a lower temperature than in case the conventional adhesive is used.

Abstract translation: 公开了一种通过电气和机械地互连两个物体进行接合来制造电气装置的方法。 当提供给LCD（11）的粘合剂层（25）和设置在TCP（15）上的第二固化剂（28）的层彼此紧密接触并且在加热下彼此以这种状态推进 在粘合剂层（25）中形成第一固化剂和形成第二固化剂层的第二固化剂彼此反应，使粘合剂层中的热固性树脂聚合以将LCD（11）和TCP （15）一起产生电气设备。 在金属螯合物或金属醇化物和硅烷偶联剂分别用作第一和第二固化剂的情况下，硅烷偶联剂和金属螯合物彼此反应以产生阳离子，并且通过这些阳离子，热固性树脂 进行阳离子聚合。 粘合剂可以固化以在比使用常规粘合剂的情况更低的温度下在更短的时间内将LCD（11）和TCP（15）结合在一起。

公开(公告)号：US20050238811A1

公开(公告)日：2005-10-27

申请号：US11165097

申请日：2005-06-23

Applicant: Roger Bernards ,  Joseph Bowers ,  Benjamin Carroll ,  Alvin Kucera

Inventor： Roger Bernards ,  Joseph Bowers ,  Benjamin Carroll ,  Alvin Kucera

IPC: B05D1/18 ,  B05D3/00 ,  B32B38/00 ,  C23C22/52 ,  C23F1/18 ,  H05K3/28 ,  H05K3/38

CPC classification number: B32B38/00 ,  B32B2038/0052 ,  B32B2311/12 ,  B32B2457/08 ,  C23C22/52 ,  C23F1/18 ,  H05K3/282 ,  H05K3/383 ,  H05K3/385 ,  H05K3/389 ,  H05K2201/0239 ,  H05K2203/0796 ,  H05K2203/121 ,  H05K2203/124

Abstract: The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

公开(公告)号：US20040109995A1

公开(公告)日：2004-06-10

申请号：US10399687

申请日：2003-06-19

Inventor： Takeshi Wakiya ,  Takeharu Morita ,  Hiroshi Hiraike ,  Katsutoshi Nagai ,  Tatsuo Taniguchi

IPC: B32B005/16

CPC classification number: H01B1/22 ,  B82Y30/00 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/64 ,  C08F2/44 ,  C08F292/00 ,  C08L51/08 ,  C09C3/10 ,  C09D5/24 ,  H01B1/02 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0239 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/2804 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2998

Abstract: It is an object of the invention to provide coated particles excellent in the reliability of connection. The invention provides coated particles each comprising a metal-surfaced particle as a core and resulting from a partial surface modification of that core particle with an organic compound via a functional group (A) capable of binding to a metal.

Abstract translation: 本发明的目的是提供连接可靠性优异的涂覆颗粒。 本发明提供了各自包含金属表面的颗粒作为芯并且通过能够与金属结合的官能团（A）通过有机化合物部分地表面改性核心颗粒而得到的涂覆颗粒。

公开(公告)号：US20040080918A1

公开(公告)日：2004-04-29

申请号：US10686576

申请日：2003-10-17

Applicant: MUTSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Shinobu Kokufu ,  Takeshi Suzuki ,  Fumio Echigo ,  Daizo Andoh ,  Tatsuo Ogawa ,  Yoshihiro Kawakita ,  Satoru Tomekawa

IPC: H05K001/00

CPC classification number: H05K3/4069 ,  H05K3/282 ,  H05K3/389 ,  H05K3/4614 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49171 ,  Y10T428/24917

Abstract: A protective agent 6 for protecting a wiring 1 is dispersed and placed in mottle-like on an interface between a via 3 and a wiring layer 2. Then, each dimension of interface regions 7 where the protective agent 6 does not exist is set to such a size that a plurality of conductive powders 4 constituting the via 3 can abutted on the wiring layer 2. Therefore, the plurality of conductive powders 4 and the wiring layer 2 are abutted each other in each interface region 7 where the protective agent 6 does not exist to electrically connect, thereby stabilizing the connection resistance for a prolonged period of time.

公开(公告)号：US06720080B2

公开(公告)日：2004-04-13

申请号：US09873401

申请日：2001-06-04

Applicant: Shobha Murari ,  Richard G. Adams ,  H. Landis Carter

Inventor： Shobha Murari ,  Richard G. Adams ,  H. Landis Carter

IPC: B32B1702

CPC classification number: C08J5/08 ,  C03C25/40 ,  C08J2363/00 ,  H05K1/0366 ,  H05K2201/0239 ,  Y10T428/249948 ,  Y10T428/249969 ,  Y10T428/31511 ,  Y10T428/31525 ,  Y10T428/31529 ,  Y10T428/31612 ,  Y10T428/31663 ,  Y10T442/2992

Abstract: A composition and method for selectively increasing the resin flow and gel time of an epoxy resin that fills the capillary region between filaments in fiberglass yarns making up a woven fabric. The composition and method are used in the lamination of fiberglass reinforced composites such as copper clad laminates for circuit boards and reduces the occurrence of voids in the capillary region.