TEST APPARATUS WITH DRY ENVIRONMENT
    241.
    发明申请
    TEST APPARATUS WITH DRY ENVIRONMENT 有权
    具有干燥环境的试验装置

    公开(公告)号:US20140182397A1

    公开(公告)日:2014-07-03

    申请号:US14108176

    申请日:2013-12-16

    CPC classification number: G01R31/2877 G01N1/42 G01R31/2865

    Abstract: A test apparatus includes a test site, a buffer carrying device, a transport carrying device, a handling mechanism and a dry air flow guide mechanism. The test site performs a test procedure on the objects. The buffer carrying device is disposed close to a side of the test site, holds the objects and performs a temperature conditioning process. The transport carrying device is disposed close to another side of the test site, moves back and forth along a transporting direction, transports the objects into and out of the test site, and heats up the objects. The handling mechanism carries the objects among the buffer carrying device, the test site and the transport carrying device. The dry air flow guide mechanism guides a dry air to surround the test site, the buffer carrying device, the transport carrying device and the handling mechanism and generates a dry environment to prevent dew condensation.

    Abstract translation: 试验装置包括试验部位,缓冲载体装置,输送装置,搬运机构以及干燥空气引导机构。 测试站点对对象执行测试程序。 缓冲载体装置靠近试验部位的一侧设置,保持物体并进行温度调节处理。 运送装置靠近试验场的另一侧,沿运送方向前后移动,运送物体进出试验场地,并加热物体。 处理机构携带缓冲运送装置,试验部位和运送装置中的物体。 干燥空气流动引导机构引导干燥空气围绕测试场所,缓冲装置,输送装置和处理机构,并产生干燥环境以防止结露。

    IMAGE CAPTURING DEVICE
    242.
    发明申请
    IMAGE CAPTURING DEVICE 审中-公开
    图像捕获设备

    公开(公告)号:US20130271640A1

    公开(公告)日:2013-10-17

    申请号:US13803553

    申请日:2013-03-14

    CPC classification number: H04N5/225 H04N9/097

    Abstract: An image capturing device includes a cube prism and three image capturing units. The cube prism includes an incident surface, a first exiting surface, a second exiting surface, and a third exiting surface orthogonal to each other, and further includes a first splitting surface, a second splitting surface, a third splitting surface, and a forth splitting surface orthogonal to each other. The light incident into the incident surface is split by the four splitting surfaces into monochromatic lights, and the monochromatic lights respectively exit from the three exiting surfaces to be received by the image capturing units to form images. The images can be combined as a multicolored image. Accordingly, the light-use efficiency and the image resolution can be improved, and the color fault of the image can be avoided.

    Abstract translation: 图像捕获装置包括立体棱镜和三个图像捕获单元。 立方棱镜包括彼此正交的入射表面,第一出射表面,第二出射表面和第三出射表面,并且还包括第一分离表面,第二分裂表面,第三分裂表面和第四分离表面 表面彼此正交。 入射到入射表面的光被四个分离表面分成单色光,并且单色光分别从三个离开的表面退出以被图像捕获单元接收以形成图像。 图像可以组合成多色图像。 因此,可以提高光利用效率和图像分辨率,并且可以避免图像的颜色错误。

    AC POWER SUPPLY CAPABLE OF PROGRAMMING OUTPUT IMPEDANCE AND A METHOD FOR SIMULATING OUTPUT IMPEDANCE

    公开(公告)号:EP4510035A1

    公开(公告)日:2025-02-19

    申请号:EP24193870.3

    申请日:2024-08-09

    Abstract: The present invention provides an AC power supply capable of programming output impedance and a method for simulating output impedance. The method comprises the following steps. The simulating command, selectively provided by a control circuit, is associated with a voltage adjustment value and a phase adjustment value of a test circuit (S20). The control circuit calculates the voltage adjustment value and a preset voltage value to form a voltage command (S22), and calculates the phase adjustment value and a preset phase value to form a phase command (S24). A power supply circuit generates a simulated output voltage according to the voltage command and the phase command. The preset voltage value and the preset phase value are related to a preset output voltage provided by the power supply circuit, and the simulated output voltage is a simulation of the preset output voltage, provided by the power supply circuit, passed through the test circuit (S26).

    COMPOSITE CALIBRATION PLATE
    244.
    发明公开

    公开(公告)号:EP4394357A1

    公开(公告)日:2024-07-03

    申请号:EP23220701.9

    申请日:2023-12-29

    Inventor: CHU, Chien-Hsun

    Abstract: A composite calibration plate (100) includes a control board (1), a light detection board (2), a diffusion board (3), a light-emitting sheet (4), and a fluorescent sheet (5). The control board (1) has a first setting surface (11) and a second setting surface (12). The light detection board (2) is stacked on the first setting surface (11). The diffusion board (3) is stacked on the light detection board (2). The light-emitting sheet (4) is stacked on the second setting surface (12) and includes a plurality of self-luminous sources (412). The fluorescent sheet (5) is optionally stacked on the light-emitting sheet (4) or the diffusion board (3), and has a plurality of fluorescent chips (52). When calibrating a lighting device (201), the fluorescent sheet (5) is disposed on the light-emitting sheet (4); and, when calibrating an imaging device (202), the fluorescent sheet (5) is disposed on the light-emitting sheet (4), such that the fluorescent sheet (5) is located at a focus position (FP) of an optical imaging path (IP).

    Aging test system and aging test method for thermal interface material and electronic device testing apparatus having the system

    公开(公告)号:US12196806B2

    公开(公告)日:2025-01-14

    申请号:US18054197

    申请日:2022-11-10

    Abstract: The present invention relates to an aging test system and an aging test method for a thermal interface material and an electronic device testing apparatus having the system, wherein a controller controls a movable carrier to move to a high temperature generating device so that the thermal interface material on the movable carrier is brought into contact with the high temperature generating device; the controller further controls a temperature sensor to detect the temperature of the thermal interface material; the controller compares an output temperature datum of the high temperature generating device with a temperature measurement datum detected by the temperature sensor. Accordingly, the thermal conductivity of the thermal interface material can be obtained for immediately determining the quality and the performance degradation of the thermal interface material, which can be used as a reference for selection or replacement of the thermal interface material.

    AUTOMATED OPTICAL MEASUREMENT SYSTEM AND METHOD FOR NEAR EYE DISPLAY

    公开(公告)号:US20240426656A1

    公开(公告)日:2024-12-26

    申请号:US18659429

    申请日:2024-05-09

    Abstract: An automated optical measurement system and method for a near eye display are provided. A controller first controls the near eye display to display a specific pattern, then controls a displacement generation module to drive an image sensing module toward or away from an imaging module, and controls the image sensing module to capture the specific pattern to obtain focus images; and the controller performs focusing according to the focus images. Finally, the controller measures an optical characteristic of the near eye display. Accordingly, the focusing method used is to capture the specific pattern displayed by the near eye display while moving the image sensing module, and perform automatic focusing by comparing the capture results.

    Chip-fixing device for a socket
    247.
    发明授权

    公开(公告)号:US12142868B2

    公开(公告)日:2024-11-12

    申请号:US17548655

    申请日:2021-12-13

    Abstract: The present invention relates to a chip-fixing device for a socket, which comprises a fixing base body and a movable stop. The socket is assembled in a socket-accommodating recess of the fixing base body. The movable stop is assembled in the fixing base body and controlled in such a manner that a stopper is moved between a first position and a second position, wherein the first position refers to a position where the stopper is located right above the socket, and the second position refers to a position where the stopper is not located right above the socket. Accordingly, the socket-accommodating recess can be used to install sockets of different sizes, and the movable stop can drive the stopper to restrict a chip from falling off the socket or drive the stopper to release the chip, depending on presence or absence of an external force.

    ANTI-OVERTURNING CABINET STRUCTURE
    248.
    发明公开

    公开(公告)号:US20240237824A1

    公开(公告)日:2024-07-18

    申请号:US18414549

    申请日:2024-01-17

    CPC classification number: A47B97/00 B60B33/0002 A47B2097/008

    Abstract: An anti-overturning device for cabinet and its cabinet structure is disclosed in the present invention. The anti-overturning device comprises a first fixing member, a second fixing component and a connecting part. The first fixing component is used for arranging detachably on the outside of the cabinet bottom. The second fixing component includes at least a second opening, and the second opening is used for fixing on the auxiliary wheel or on the ground. The anti-overturning devices are provided evenly on the periphery of the cabinet bottom. The anti-overturning devices change the horizontal position of the original overturning pivot of the cabinet and enlarge the overturning angle to prevent from overturning the cabinet.

    WAFER INSPECTION SYSTEM
    249.
    发明公开

    公开(公告)号:US20240219447A1

    公开(公告)日:2024-07-04

    申请号:US18129907

    申请日:2023-04-03

    CPC classification number: G01R31/2601 G01R1/06716 G01R1/06761

    Abstract: A wafer inspection system includes a carrier device, a probe card, a first metal kit and a surround separating unit. The probe card includes a detection portion and a conductive layer surrounding the detection portion and configured at a bottom surface of the probe card. The first metal kit is configured at a bottom portion of the probe card and coupled to the conductive layer and includes a first window and a first ring piece extending from a periphery of the first window. The first window is for the detection portion to extend out. The surround separating unit is configured as an electrically conductive wraparound unit surrounding and laterally enclosing the detection portion and a wafer to be inspected when the probe card performs a probe procedure on the wafer to be inspected. Thus, a probe procedure of the detection portion and the wafer to be inspected can be performed in an environment shielded from external noise or interference sources, thereby improving inspection accuracy.

    MULTIPHASE THERMAL INTERFACE COMPONENT, METHOD OF FORMING THE SAME AND ELECTRONIC DEVICE TESTING APPARATUS PROVIDED WITH THE SAME

    公开(公告)号:US20240192268A1

    公开(公告)日:2024-06-13

    申请号:US18511638

    申请日:2023-11-16

    CPC classification number: G01R31/2874 G01R31/2863 G05D23/20 H01L22/12

    Abstract: A multiphase thermal interface component, a method of forming the same, and an electronic device testing apparatus provided with the same are provided. The multiphase thermal interface component includes a thermal interface solid element and a thermal interface fluid material. The thermal conductive surface of the thermal interface solid element has an accommodation space, and the thermal interface fluid material is accommodated in the accommodation space. Therefore, the multiphase thermal interface component combines solid-phase and fluid-phase thermal interface materials. Since fluids have the properties of changing shape, flowing, and splitting arbitrarily, the thermal interface fluid material can completely fill up the air gaps between the thermal interface solid element and the thermal control device/the temperature-controlled component, so that the full surface temperature control of the contact interface can be achieved, thereby effectively improving the thermal conduction performance.

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