Abstract:
An actuator for moving a platform having electrical connections is provided. The actuator includes an outer frame connected to an inner frame by one or more spring elements that are electrically conductive. The actuator further includes one or more comb drive actuators that apply a controlled force between the outer frame and the inner frame. Each of the comb drive actuators includes one or more comb drives. Moreover, a method for moving a platform having electrical connections is also provided. The method includes connecting an outer frame to an inner frame using one or more spring elements that are electrically conductive. The method further includes generating a controlled force using one or more comb drive actuators. Each of the comb drive actuators includes one or more comb drives. In addition, the method includes applying the controlled force between the outer frame and the inner frame.
Abstract:
An actuator includes: an electrostatic actuation mechanism including a stationary electrode and a movable electrode; a first movable part driven by the electrostatic actuation mechanism; a first elastic support part that elastically supports the first movable part; an electret formed in at least one of the stationary electrode and the movable electrode; and a drive control unit that controls application of voltage to the electrostatic actuation mechanism. In the actuator a plurality of stable states are set in which the first movable part is positioned at a stable position at which an electrostatic force generated by the electret matches with an elastic force exerted by the first elastic support part or at a stable position near such stable position. By applying a voltage to the electrostatic actuation mechanism, the first movable part may be displaced from any stable position to another stable position.
Abstract:
Methods of measuring displacement of a movable mass in a microelectromechanical system (MEMS) include driving the mass against two displacement-stopping surfaces and measuring corresponding differential capacitances of sensing capacitors such as combs. A MEMS device having displacement-stopping surfaces is described. Such a MEMS device can be used in a method of measuring properties of an atomic force microscope (AFM) having a cantilever and a deflection sensor, or in a temperature sensor having a displacement-sensing unit for sensing a movable mass permitted to vibrate along a displacement axis. A motion-measuring device can include pairs of accelerometers and gyroscopes driven 90° out of phase.
Abstract:
A method of reactive ion etching a substrate 46 to form at least a first and a second etched feature (42, 44) is disclosed. The first etched feature (42) has a greater aspect ratio (depth:width) than the second etched feature (44). In a first etching stage the substrate (46) is etched so as to etch only said first feature (42) to a predetermined depth. Thereafter in a second etching stage, the substrate (46) is etched so as to etch both said first and said second features (42, 44) to a respective depth. A mask (40) may be applied to define apertures corresponding in shape to the features (42, 44). The region of the substrate (46) in which the second etched feature (44) is to be produced is selectively masked with a second maskant (50) during the first etching stage, The second maskant (50) is then removed prior to the second etching stage.
Abstract:
A method for making an actuator device includes forming a substantially planar structure, including an outer frame with a latch foot, a fixed frame coupled to the outer frame, a latch mass coupled to the fixed frame, a latch block coupled to the latch mass by a latch block flexure, a moveable frame coupled to the outer frame, and an actuator incorporating a plurality of interdigitated teeth alternately attached to the fixed and moving frames. For operation, the latch mass is rotated downward until an upper surface of the latch block is disposed below and held in latching contact with a lower surface of the latch foot by the latch block flexure.
Abstract:
The present invention relates to a design and microfabrication method for microgrippers that are capable of grasping micro and nano objects of a large range of sixes and two-axis force sensing capabilities. Gripping motion is produced by one or more electrothermal actuators. Integrated force sensors along x and y directions enable the measurement of gripping forces as well as the forces applied at the end of microgripper arms along the normal direction, both with a resolution down to nanoNewton. The microfabrication method enables monolithic integration of the actuators and the force sensors.
Abstract:
The present invention relates to a design and microfabrication method for microgrippers that are capable of grasping micro and nano objects of a large range of sizes and two-axis force sensing capabilities. Gripping motion is produced by one or more electrothermal actuators. Integrated force sensors along x and y directions enable the measurement of gripping forces as well as the forces applied at the end of microgripper arms along the normal direction, both with a resolution down to nanoNewton. The microfabrication method enables monolithic integration of the actuators and the force sensors.
Abstract:
A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.
Abstract:
A Micro Electro Mechanical Systems (MEMS) device comprising: a rotor, comprising a first plurality of rotor teeth and a second plurality of rotor teeth, formed in at least two layers of silicon-on-insulator (SOI) substrate, wherein each rotor tooth belonging to the first plurality of rotor teeth is formed in a first layer and each rotor tooth of the second plurality of rotor teeth is formed in a second layer; and a stator comprising a first plurality of stator teeth and a second plurality of stator teeth, formed in at least two layers of SOI substrate, wherein each stator tooth belonging to the first plurality of stator teeth is formed in a first layer, and each stator tooth of the second plurality of stator teeth is formed in a second layer.
Abstract:
A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.