公开(公告)号：US09371222B2

公开(公告)日：2016-06-21

申请号：US13839923

申请日：2013-03-15

Applicant: Honeywell International Inc.

Inventor： Gordon A. Shaw ,  Daniel Baseman ,  Chris Finn ,  Jim G. Hunter

IPC: G01D11/00 ,  B81C1/00

CPC classification number: B81B3/0021 ,  B81B2201/0292 ,  B81B2203/0118 ,  B81B2207/015 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/013 ,  B81C2201/0197

Abstract: Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.

Abstract translation: 本文描述了微结构电镀系统和方法。 一种方法包括在微结构和结合层之间沉积耐镀材料，其中微结构包括电镀工艺基材并将微结构浸入电镀液中。

公开(公告)号：US09334156B2

公开(公告)日：2016-05-10

申请号：US14747507

申请日：2015-06-23

Applicant: XINTEC INC.

Inventor： Chien-Min Lin ,  Yu-Ting Huang ,  Chen-Ning Fu ,  Yen-Shih Ho

IPC: B81B7/00 ,  B81C1/00 ,  H01L21/48 ,  H01L23/498

CPC classification number: B81B7/007 ,  B81C1/00182 ,  B81C1/00269 ,  B81C2201/0197 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A chip package includes a semiconductor chip, an interposer, a polymer adhesive supporting layer, a redistribution layer and a packaging layer. The semiconductor chip has a sensor device and a conductive pad electrically connected to the sensing device, and the interposer is disposed on the semiconductor chip. The interposer has a trench and a through hole, which the trench exposes a portion of the sensing device, and the through hole exposes the conductive pad. The polymer adhesive supporting layer is interposed between the semiconductor chip and the interposer, and the redistribution layer is disposed on the interposer and in the through hole to be electrically connected to the conductive pad. The packaging layer covers the interposer and the redistribution layer, which the packaging layer has an opening exposing the trench.

Abstract translation: 芯片封装包括半导体芯片，插入件，聚合物粘合剂支撑层，再分布层和包装层。 半导体芯片具有传感器装置和与感测装置电连接的导电焊盘，并且插入器设置在半导体芯片上。 插入器具有沟槽和通孔，沟槽暴露感测装置的一部分，并且通孔暴露导电垫。 聚合物粘合剂支撑层插入在半导体芯片和插入件之间，并且再分配层设置在插入件上和通孔中以与导电焊盘电连接。 包装层覆盖插入件和再分配层，其中封装层具有露出沟槽的开口。

公开(公告)号：US20150226555A1

公开(公告)日：2015-08-13

申请号：US14178229

申请日：2014-02-11

Applicant: InSighTech, LLC

Inventor： Biao Zhang ,  Tao Ju

IPC: G01C19/5712 ,  G01R33/09

CPC classification number: G01P15/105 ,  B81B5/00 ,  B81C1/00357 ,  B81C3/001 ,  B81C2201/0197 ,  B81C2203/038 ,  G01C19/56 ,  G01C19/5712 ,  G01C19/5776 ,  G01P15/125 ,  G01R33/091 ,  G01R33/093 ,  G01R33/098

Abstract: A MEMS gyroscope is disclosed herein, wherein the MEMS gyroscope comprised a magnetic sensing mechanism and a magnetic source that is associated with the proof-mass. The magnetic sensing mechanism is disposed at a location wherein the magnetic field gradient from the magnetic source is maximum.

Abstract translation: 本文公开了一种MEMS陀螺仪，其中MEMS陀螺仪包括与检测质量相关联的磁感测机构和磁源。 磁感测机构设置在磁源的磁场梯度最大的位置。

公开(公告)号：US08970043B2

公开(公告)日：2015-03-03

申请号：US13018534

申请日：2011-02-01

Applicant: Quanbo Zou ,  Uppili Sridhar ,  Amit S. Kelkar ,  Xuejun Ying

Inventor： Quanbo Zou ,  Uppili Sridhar ,  Amit S. Kelkar ,  Xuejun Ying

IPC: H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  C25D17/00 ,  B81C3/00 ,  C25D7/12 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01L24/83 ,  B81C3/001 ,  B81C2201/0197 ,  B81C2203/035 ,  C25D7/123 ,  C25D17/001 ,  C25D17/005 ,  C25D17/007 ,  H01L23/481 ,  H01L24/13 ,  H01L24/94 ,  H01L25/50 ,  H01L2224/13144 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01068 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/30101 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A wafer structure includes a first wafer stack and a first bonding layer disposed on the first wafer stack. The wafer structure further includes a second wafer stack that includes a first surface and a second surface opposing the first surface. A second bonding layer is disposed on the second surface and is in contact with the first bonding layer. The second wafer stack comprises through-silicon-vias (TSVs) that extend from the first surface to the second bonding layer. A seed layer is disposed on the first surface and is in contact with the TSVs.

Abstract translation: 晶片结构包括第一晶片堆叠和设置在第一晶片堆叠上的第一结合层。 晶片结构还包括第二晶片堆叠，其包括第一表面和与第一表面相对的第二表面。 第二接合层设置在第二表面上并与第一接合层接触。 第二晶片堆叠包括从第一表面延伸到第二结合层的穿硅通孔（TSV）。 种子层设置在第一表面上并与TSV接触。

公开(公告)号：US20150034620A1

公开(公告)日：2015-02-05

申请号：US14518688

申请日：2014-10-20

Applicant: InSighTech, LLC

Inventor： BIAO ZHANG ,  TAO JU

IPC: B81C3/00 ,  B81C1/00

CPC classification number: G01P15/105 ,  B81B5/00 ,  B81C1/00357 ,  B81C3/001 ,  B81C2201/0197 ,  B81C2203/038 ,  G01C19/56 ,  G01C19/5712 ,  G01C19/5776 ,  G01P15/125 ,  G01R33/091 ,  G01R33/093 ,  G01R33/098

Abstract: A method of making a MEMS gyroscope is disclosed herein, wherein the MEMS gyroscope comprised a magnetic sensing mechanism on a magnetic sensor wafer and a magnetic source on a MEMS wafer that further comprises a proof-mass.

Abstract translation: 本文公开了一种制造MEMS陀螺仪的方法，其中MEMS陀螺仪包括在磁传感器晶片上的磁感测机构以及还包括校验质量的MEMS晶片上的磁源。

公开(公告)号：US20150033854A1

公开(公告)日：2015-02-05

申请号：US14518355

申请日：2014-10-20

Applicant: IlnSighTeCh, LLC

Inventor： BIAO ZHANG ,  TAO JU

IPC: G01C19/5712 ,  G01P15/105

CPC classification number: G01P15/105 ,  B81B5/00 ,  B81C1/00357 ,  B81C3/001 ,  B81C2201/0197 ,  B81C2203/038 ,  G01C19/56 ,  G01C19/5712 ,  G01C19/5776 ,  G01P15/125 ,  G01R33/091 ,  G01R33/093 ,  G01R33/098

Abstract: A MEMS gyroscope is disclosed herein, wherein the MEMS gyroscope comprised plurality of movable portions that are capable of moving in response to angular velocity and a plurality of magnetic sensing mechanisms for measuring movements of the movable portions.

公开(公告)号：US20140190257A1

公开(公告)日：2014-07-10

申请号：US13936143

申请日：2013-07-06

Applicant: Biao Zhang ,  Tao Ju

Inventor： Biao Zhang ,  Tao Ju

IPC: G01C19/56

CPC classification number: G01P15/105 ,  B81B5/00 ,  B81C1/00357 ,  B81C3/001 ,  B81C2201/0197 ,  B81C2203/038 ,  G01C19/56 ,  G01C19/5712 ,  G01C19/5776 ,  G01P15/125 ,  G01R33/091 ,  G01R33/093 ,  G01R33/098

Abstract: A method of using a MEMS gyroscope is disclosed herein, wherein the MEMS gyroscope comprised a magnetic sensing mechanism. A magnetic field is generated by a magnetic source, and is detected by a magnetic sensor. The magnetic field varies at the location of the magnetic sensor; and the variation of the magnetic field is associated with the movement of the proof-mass of the MEMS gyroscope. By detecting the variation of the magnetic field, the movement and thus the target angular velocity can be measured.

公开(公告)号：US20140026658A1

公开(公告)日：2014-01-30

申请号：US13935557

申请日：2013-07-05

Applicant: BIAO ZHANG ,  TAO JU

Inventor： BIAO ZHANG ,  TAO JU

IPC: G01C19/56

CPC classification number: G01P15/105 ,  B81B5/00 ,  B81C1/00357 ,  B81C3/001 ,  B81C2201/0197 ,  B81C2203/038 ,  G01C19/56 ,  G01C19/5712 ,  G01C19/5776 ,  G01P15/125 ,  G01R33/091 ,  G01R33/093 ,  G01R33/098

Abstract: A method of using a MEMS gyroscope is disclosed herein, wherein the MEMS gyroscope comprised a magnetic sensing mechanism. A magnetic field is generated by a magnetic source, and is detected by a magnetic sensor. The magnetic field varies at the location of the magnetic sensor; and the variation of the magnetic field is associated with the movement of the proof-mass of the MEMS gyroscope. By detecting the variation of the magnetic field, the movement and thus the target angular velocity can be measured.

Abstract translation: 本文公开了一种使用MEMS陀螺仪的方法，其中MEMS陀螺仪包括磁感测机构。 磁场由磁源产生，并由磁传感器检测。 磁场在磁传感器的位置变化; 并且磁场的变化与MEMS陀螺仪的校验质量的运动相关联。 通过检测磁场的变化，可以测量运动，从而测量目标角速度。

公开(公告)号：US20130168253A1

公开(公告)日：2013-07-04

申请号：US13822070

申请日：2010-10-21

Applicant: Peter Mardilovich ,  Qingqiao Wei ,  Irina Nikolaevna Milonova ,  Anthony M. Fuller

Inventor： Peter Mardilovich ,  Qingqiao Wei ,  Irina Nikolaevna Milonova ,  Anthony M. Fuller

IPC: C25D1/00

CPC classification number: C25D1/006 ,  B81C1/00031 ,  B81C2201/013 ,  B81C2201/0197 ,  C25D11/045 ,  C25D11/08 ,  C25D11/10 ,  C25D11/12 ,  C25D11/24 ,  C25D11/26

Abstract: A nano-structure (100, 100′) includes an oxidized layer (14′), and at least two sets (24, 24′) of super nano-pillars (20) positioned on the oxidized layer (14′). Each of the at least two sets (24, 24′) of super nano-pillars (20) includes a plurality of super nano-pillars (20), where each set (24, 24′) is separated a spaced distance from each other set (24, 24′).

Abstract translation: 纳米结构（100,100'）包括氧化层（14'）和位于氧化层（14'）上的超级纳米柱（20）的至少两组（24,24'）。 超级纳米柱（20）的至少两个组（24,24'）中的每一个包括多个超级纳米柱（20），其中每个组（24,24'）彼此间隔开距离 设置（24,24'）。

公开(公告)号：US08419957B2

公开(公告)日：2013-04-16

申请号：US12450659

申请日：2008-04-08

Applicant: Roland Scheuerer ,  Heribert Weber ,  Eckhard Graf

Inventor： Roland Scheuerer ,  Heribert Weber ,  Eckhard Graf

IPC: C03C15/00

CPC classification number: B81C1/00333 ,  B81B2203/033 ,  B81C1/0015 ,  B81C2201/0197

Abstract: A method for producing a micromechanical component is proposed, a trench structure being substantially completely filled up by a first filler layer, and a first mask layer being applied on the first filler layer, on which in turn a second filler layer and a second mask layer are applied. A micromechanical component is also proposed, the first filler layer filling up the trench structure of the micromechanical component and at the same time forming a movable sensor structure.

Abstract translation: 提出了一种用于制造微机械部件的方法，其中沟槽结构基本上被第一填充层完全填充，第一掩模层被施加在第一填料层上，第二掩模层又在第二填料层和第二掩模层 被应用。 还提出了微机械部件，第一填充层填充微机械部件的沟槽结构，同时形成可移动的传感器结构。