公开(公告)号：EP3317753A1

公开(公告)日：2018-05-09

申请号：EP16745888.4

申请日：2016-06-23

Applicant: 3M Innovative Properties Company

Inventor： STAY, Matthew S. ,  DODDS, Shawn C. ,  GILMAN, Ann Marie ,  PEKUROVSKY, Mikhail L. ,  THEIS, Daniel J. ,  SMITH, Matthew R.

IPC: G06F3/041 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4069 ,  G06F3/041 ,  G06F2203/04102 ,  G06F2203/04103 ,  H05K1/0283 ,  H05K1/0393 ,  H05K1/097 ,  H05K3/0091 ,  H05K3/0097 ,  H05K3/4664 ,  H05K3/4679 ,  H05K2201/026 ,  H05K2203/1173 ,  H05K2203/1545 ,  H05K2203/166

Abstract: A composite article includes a conductive layer on at least a portion of a flexible substrate, wherein the conductive layer has a conductive surface. A patterned layer of a low surface energy material is on a first region of the conductive surface. An overcoat layer free of conductive particulates is on a first portion of a second region of the conductive surface unoccupied by the patterned layer. A via is in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer. A conductive material is in the via to provide an electrical connection to the conductive surface.

公开(公告)号：EP3180792A4

公开(公告)日：2017-12-20

申请号：EP15827431

申请日：2015-07-27

Applicant: C3NANO INC

Inventor： LI YING-SYI ,  YANG XIQIANG ,  KAMBE YU ,  CHEN XIAOFENG ,  GU HUA ,  LAM STEVEN MICHAEL ,  INOUYE MELANIE MARIKO ,  CHENG ARTHUR YUNG-CHI ,  TAN ALEX DA ZHANG ,  SCULLY CHRISTOPHER S ,  VIRKAR AJAY

IPC: H01B1/22 ,  B05D1/02 ,  B05D1/18 ,  B05D1/28 ,  B05D5/06 ,  C09D11/08 ,  C09D11/10 ,  C09D11/102 ,  C09D11/106 ,  C09D11/14 ,  C09D11/52 ,  C09D101/02

CPC classification number: C09D11/52 ,  B05D1/005 ,  B05D1/02 ,  B05D1/18 ,  B05D1/265 ,  B05D1/28 ,  B05D3/0254 ,  B05D5/06 ,  C09D11/08 ,  C09D11/10 ,  C09D11/102 ,  C09D11/106 ,  C09D11/14 ,  C09D101/02 ,  C09D139/06 ,  C23C30/00 ,  G06F3/044 ,  G06F3/045 ,  G06F2203/04103 ,  H01B1/02 ,  H01B1/22 ,  H01B13/30 ,  H05K1/0274 ,  H05K1/097 ,  H05K2201/0108 ,  H05K2201/026 ,  H05K2201/10128 ,  H05K2201/10151

Abstract: Fusing nanowire inks are described that can also comprise a hydrophilic polymer binder, such as a cellulose based binder. The fusing nanowire inks can be deposited onto a substrate surface and dried to drive the fusing process. Transparent conductive films can be formed with desirable properties.

公开(公告)号：EP3162561A1

公开(公告)日：2017-05-03

申请号：EP14752247.8

申请日：2014-06-10

Applicant: Shengyi Technology Co., Ltd.

Inventor： CHAI, Songgang

IPC: B32B27/08

CPC classification number: B32B27/20 ,  B32B5/022 ,  B32B5/024 ,  B32B15/092 ,  B32B15/20 ,  B32B27/08 ,  B32B27/12 ,  B32B27/38 ,  B32B37/14 ,  B32B2038/0076 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/076 ,  B32B2307/204 ,  B32B2457/08 ,  D06N1/00 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/09 ,  H05K3/022 ,  H05K2201/0129 ,  H05K2201/026

Abstract: The present invention relates to a thermosetting resin sandwich prepreg, and the copper clad laminates and multi-layered printed circuit wiring boards manufactured therefrom. The interlayer of the thermosetting resin sandwich prepreg contains the thermosetting resin composition with a high content of fillers, and the outer layer of the prepreg contains the thermosetting resin composition with a low content of fillers. The copper clad laminates prepared by using the prepregs have good adhesion to metal foils, insulativity and uniform dielectric constant distribution.

Abstract translation: 本发明涉及一种热固性树脂夹心预浸料，以及由其制造的覆铜层压板和多层印刷电路板。 热固性树脂夹心预浸料坯的夹层包含具有高含量填料的热固性树脂组合物，并且预浸料坯的外层包含具有低含量填料的热固性树脂组合物。 采用预浸料制备的覆铜箔层压板对金属箔具有良好的附着力，绝缘性和均匀的介电常数分布。

公开(公告)号：EP3028126A1

公开(公告)日：2016-06-08

申请号：EP14832317.3

申请日：2014-07-18

Applicant: 3M Innovative Properties Company

Inventor： STAY, Matthew S. ,  PEKUROVSKY, Mikhail L. ,  DODDS, Shawn C. ,  GILMAN, Ann M. ,  THEIS, Daniel J.

IPC: G06F3/041 ,  H01B13/00

CPC classification number: H05K3/284 ,  G06F3/041 ,  G06F3/0412 ,  G06F3/047 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/097 ,  H05K3/048 ,  H05K3/103 ,  H05K3/323 ,  H05K2201/026 ,  H05K2201/10128 ,  H05K2203/0143 ,  H05K2203/1469 ,  H05K2203/1545

Abstract: A method for making an electronic assembly includes applying a conductive adhesive to a resist layer overlying a patterned conductive nanowire layer on a substrate and engaging an electrical contact of an electronic component with the conductive adhesive to provide an electrical connection between the electronic component and the conductive nanowire layer.

公开(公告)号：EP1810329B1

公开(公告)日：2016-04-27

申请号：EP05799869.2

申请日：2005-11-04

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： WYLAND, Chris

IPC: H01L23/373 ,  H01L23/14 ,  B82Y10/00 ,  H01L23/31 ,  H01L23/498 ,  H05K1/02 ,  H05K1/05

CPC classification number: H05K1/056 ,  B82Y10/00 ,  H01L23/14 ,  H01L23/3128 ,  H01L23/373 ,  H01L23/49827 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0206 ,  H05K2201/026 ,  H05K2201/0323 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP2961801A2

公开(公告)日：2016-01-06

申请号：EP14757422.2

申请日：2014-02-21

Applicant: C3Nano Inc.

Inventor： VIRKAR, Ajay ,  YANG, Xiqiang ,  LI, Ying-syi ,  MCKEAN, Dennis ,  LEMIEUX, Melburne, C.

IPC: C09D11/52 ,  B82Y30/00

CPC classification number: H03K17/9622 ,  B32B15/02 ,  B32B15/08 ,  B32B15/18 ,  B32B27/281 ,  B32B27/286 ,  B32B27/288 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/40 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2457/00 ,  C09D11/52 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H03K2217/96031 ,  H05K1/097 ,  H05K3/027 ,  H05K3/06 ,  H05K3/1283 ,  H05K2201/0108 ,  H05K2201/026 ,  H05K2203/107 ,  H05K2203/1131 ,  H05K2203/1157 ,  H05K2203/125 ,  Y10T428/12424 ,  Y10T428/12444 ,  Y10T442/655

Abstract: Reduction/oxidation reagents have been found to be effective to chemically cure a sparse metal nanowire film into a fused metal nanostructured network through evidently a ripening type process. The resulting fused network can provide desirable low sheet resistances while maintaining good optical transparency. The transparent conductive films can be effectively applied as a single conductive ink or through sequential forming of a metal nanowire film with the subsequent addition of a fusing agent. The fused metal nanowire films can be effectively patterned, and the patterned films can be useful in devices, such as touch sensors.

Abstract translation: 已经发现还原/氧化试剂通过明显成熟型过程将稀疏金属纳米线膜化学固化成熔融金属纳米结构网络是有效的。 所得到的融合网络可以提供期望的低表面电阻，同时保持良好的光学透明度。 透明导电膜可以作为单一导电墨水或通过顺序形成金属纳米线膜并随后添加熔剂而有效地应用。 融合的金属纳米线膜可以被有效地图案化，并且图案化的膜可以用于诸如触摸传感器的器件中。

公开(公告)号：EP2332883A4

公开(公告)日：2015-06-03

申请号：EP09813245

申请日：2009-09-10

Applicant: LG CHEMICAL LTD

Inventor： KWON WON-JONG ,  KIM JAE-HONG ,  JIN SUN-MI ,  LEE SANG-UCK ,  LIM YOUNG-SOO

IPC: B82B3/00 ,  C09D11/52

CPC classification number: H01B1/22 ,  B22F1/0018 ,  B22F9/24 ,  B22F2001/0033 ,  B82Y10/00 ,  B82Y30/00 ,  C09D11/52 ,  H01B1/24 ,  H01L31/022433 ,  H05K1/092 ,  H05K1/097 ,  H05K2201/026 ,  Y02E10/50 ,  Y10S977/762 ,  Y10S977/81 ,  Y10S977/895 ,  Y10S977/90 ,  Y10T428/12229

公开(公告)号：EP2477230B1

公开(公告)日：2015-02-25

申请号：EP12159544.1

申请日：2006-08-14

Applicant: Cambrios Technologies Corporation

Inventor： Alden, Jonathan ,  Wolk, Jeffrey ,  Dai, Haixia ,  Knapp, Michael R. ,  Na, Shuo ,  Pakbaz, Hash ,  Pschenitzka, Florian ,  Quan, Xina ,  Spaid, Michael, A. ,  Winoto, Adrian

IPC: H01L31/0224 ,  H01B1/22 ,  G02F1/1343 ,  G02B5/02 ,  C30B7/02 ,  C30B29/02 ,  C30B29/60 ,  C30B33/00 ,  B82Y30/00 ,  B82Y20/00

CPC classification number: H01B1/22 ,  B22F2998/00 ,  B82Y20/00 ,  B82Y30/00 ,  C03C17/007 ,  C03C17/008 ,  C03C2217/445 ,  C03C2217/479 ,  C09D11/52 ,  C23F11/02 ,  C30B7/02 ,  C30B29/02 ,  C30B29/60 ,  C30B33/00 ,  G02F1/13439 ,  H01L27/14623 ,  H01L31/02164 ,  H01L31/022466 ,  H01L2224/45139 ,  H01L2224/49175 ,  H01L2924/00011 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/0269 ,  H05K1/097 ,  H05K3/048 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/026 ,  H05K2201/10128 ,  H05K2203/1545 ,  Y10S977/762 ,  B22F1/0025 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01039

Abstract: A Transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires which may be embedded in a matrix and one more corrosion inhibitors. The conductive layer is optically transparent and flexible. It can be coated or laminated onto a variety of substrates, including flexible and rigid substrates.

Abstract translation: 描述了包括涂覆在基板上的导电层的透明导体。 更具体地，导电层包括纳米线网络，其可以嵌入基质中，另外还有一个腐蚀抑制剂。 导电层是光学透明和柔性的。 它可以涂覆或层压在各种基材上，包括柔性和刚性基材。

公开(公告)号：EP2426787A4

公开(公告)日：2013-11-20

申请号：EP10769664

申请日：2010-04-22

Applicant: HITACHI CHEMICAL CO LTD

Inventor： ARIFUKU MOTOHIRO ,  KOBAYASHI KOUJI ,  FUJINAWA TOHRU

IPC: H01R11/01 ,  C09D5/25 ,  C09D133/00 ,  C09D179/08 ,  C09D183/04 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  H01B1/00 ,  H01B1/22 ,  H01B1/24 ,  H05K1/14 ,  H05K3/32 ,  H05K3/36

CPC classification number: H05K3/323 ,  B82Y10/00 ,  H01L2224/83101 ,  H01L2924/12044 ,  H05K3/361 ,  H05K2201/0224 ,  H05K2201/026 ,  H05K2201/0323 ,  Y10T29/49117 ,  Y10T29/532 ,  H01L2924/00

Abstract: The circuit connecting material of the invention is situated between mutually opposing circuit electrodes, and provides electrical connection between the electrodes in the pressing direction when the mutually opposing circuit electrodes are pressed, the circuit connecting material comprising anisotropic conductive particles wherein conductive fine particles are dispersed in an organic insulating material.

公开(公告)号：EP2651841A1

公开(公告)日：2013-10-23

申请号：EP11808462.3

申请日：2011-12-15

Applicant: Sun Chemical Corporation

Inventor： COENJARTS, Christopher

IPC: C03C15/00 ,  H01L31/18 ,  C09K13/06

CPC classification number: C09K13/06 ,  C03C15/00 ,  C09D11/30 ,  C09D11/38 ,  C23F1/00 ,  C23F1/02 ,  C23F1/30 ,  H05K3/067 ,  H05K2201/0108 ,  H05K2201/026

Abstract: The present invention relates to a novel printable paste composition and its use in etching conductive films formed by a plurality of interconnecting silver nano-wires. After etching, the conductive film has a pattern of conductive and non-conductive areas with low visibility. The etched films are suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.