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    Low cost capacitors manufactured from conductive loaded resin-based materials
    242.
    发明授权
    Low cost capacitors manufactured from conductive loaded resin-based materials 失效
    由导电负载的树脂基材料制成的低成本电容器

    公开(公告)号：US07002234B2

    公开(公告)日：2006-02-21

    申请号：US10825988

    申请日：2004-04-16

    Applicant: Thomas Aisenbrey

    Inventor： Thomas Aisenbrey

    IPC: H01L29/00

    CPC classification number: H05K3/101 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H01G4/008 ,  H05K1/095 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

    Abstract: Capacitors are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

    Abstract translation: 电容器由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或导电粉末和导电纤维的组合的重量与基础树脂主体的重量的比率在约0.20至0.40之间。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。

    Interposer structure and method
    243.
    发明申请
    Interposer structure and method 审中-公开
    内插结构和方法

    公开(公告)号：US20060003624A1

    公开(公告)日：2006-01-05

    申请号：US11151630

    申请日：2005-06-13

    Applicant: Richard Dow ,  Timothy Ellis ,  Stephen Kryven

    Inventor： Richard Dow ,  Timothy Ellis ,  Stephen Kryven

    IPC: H01R13/58

    CPC classification number: H05K7/1069 ,  H01L23/3733 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/10 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0323 ,  H01L2924/00

    Abstract: A structure comprises at least one layer of thermally conductive, electrically insulating fibers, rovings, strands or yarns having first and second major surfaces, and at least one electrically insulated and/or non-insulated conductive wire or strand woven with the thermally conductive fibers, rovings, strands or yarns so that the electrically insulated and/or non-insulated conductive wire or strand extends from the first major surface to the second major surface in a plurality of locations.

    Abstract translation: 一种结构包括至少一层导热的，电绝缘的纤维，具有第一和第二主表面的粗纱，股线或纱线，以及与导热纤维编织的至少一个电绝缘和/或非绝缘导电线或股线， 粗纱，股线或纱线，使得电绝缘和/或非绝缘的导线或股线在多个位置从第一主表面延伸到第二主表面。

    Systems and methods for connecting electrical components
    244.
    发明申请
    Systems and methods for connecting electrical components 有权
    用于连接电气部件的系统和方法

    公开(公告)号：US20050239329A1

    公开(公告)日：2005-10-27

    申请号：US11170283

    申请日：2005-06-29

    Applicant: Matthew Sweetland

    Inventor： Matthew Sweetland

    IPC: H01R4/58 ,  H01R13/193 ,  H05K3/10 ,  H01R13/648

    CPC classification number: H01R4/58 ,  H01R13/193 ,  H05K3/10 ,  H05K2201/0281 ,  H05K2201/029

    Abstract: The present disclosure is directed to methods and devices that use a contact interface for establishing an electrical connection with an electrical component. In certain exemplary embodiments, the contact interface of a device includes at least one loading fiber and at least one conductor having at least one contact point. The conductor(s) is coupled to a loading fiber so that an electrical connection can be established between the contact point(s) of the conductor(s) and the electrical component when the device is engaged with the electrical component. In certain exemplary embodiments, a conductor is woven with, or wound around, a loading fiber. In some exemplary embodiments, the conductor is comprised of a shaped contact and a conductive lead. The present disclosure is also directed to methods and devices for testing the electrical integrity or functionality of an electrical component. In certain exemplary embodiments, the device includes a plurality of loading fibers, a plurality of conductors and a plurality of tensioning guides. Each conductor can be coupled to at least one loading fiber. The tensioning guides can be disposed on at least one side of each said conductor. In such embodiments, electrical connections can be established between at least a portion of the plurality of conductors and the electrical component when the device is engaged with the electrical component. At least a portion of the plurality of loading fibers may come into contact with the plurality of tensioning guides when the device is engaged with the electrical component. In one exemplary embodiment, the device comprises a burn-in socket device. In another exemplary embodiment, the device comprises a test socket device.

    Abstract translation: 本公开涉及使用接触界面来建立与电气部件的电连接的方法和装置。 在某些示例性实施例中，设备的接触界面包括至少一个加载光纤和至少一个具有至少一个接触点的导体。 导体耦合到加载光纤，使得当设备与电气部件接合时，可以在导体的接触点和电气部件之间建立电连接。 在某些示例性实施例中，导体与装载纤维编织或缠绕在装载纤维上。 在一些示例性实施例中，导体由成形接触件和导电引线构成。 本公开还涉及用于测试电气部件的电气完整性或功能性的方法和装置。 在某些示例性实施例中，该装置包括多个加载纤维，多个导体和多个张紧导向件。 每个导体可以耦合到至少一个加载光纤。 张紧引导件可以设置在每个所述导体的至少一侧上。 在这样的实施例中，当设备与电气部件接合时，可以在多个导体的至少一部分与电气部件之间建立电连接。 当装置与电气部件接合时，多个装载纤维的至少一部分可能与多个张紧导向装置接触。 在一个示例性实施例中，该装置包括老化插座装置。 在另一示例性实施例中，该设备包括测试插座设备。

    Low cost hardware manufactured from conductive loaded resin-based materials
    246.
    发明申请
    Low cost hardware manufactured from conductive loaded resin-based materials 审中-公开
    由导电负载树脂基材料制造的低成本硬件

    公开(公告)号：US20050200041A1

    公开(公告)日：2005-09-15

    申请号：US11121376

    申请日：2005-05-04

    Applicant: Thomas Aisenbrey

    Inventor： Thomas Aisenbrey

    IPC: B29C45/00 ,  G06K19/077 ,  H01Q1/12 ,  H01Q1/24 ,  H01Q1/32 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/04 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q21/00 ,  H05K1/09 ,  H05K3/10

    CPC classification number: H05K3/101 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H05K1/095 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

    Abstract: Hardware fastener devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

    Abstract translation: 硬件紧固装置由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

    Low cost gaskets manufactured from conductive loaded resin-based materials
    248.
    发明申请
    Low cost gaskets manufactured from conductive loaded resin-based materials 审中-公开
    由导电负载的树脂基材料制成的低成本垫片

    公开(公告)号：US20050167133A1

    公开(公告)日：2005-08-04

    申请号：US11086853

    申请日：2005-03-22

    Applicant: Thomas Aisenbrey

    Inventor： Thomas Aisenbrey

    IPC: B29C45/00 ,  G06K19/077 ,  H01Q1/12 ,  H01Q1/24 ,  H01Q1/32 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/04 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q21/00 ,  H05K1/09 ,  H05K3/10 ,  H01B7/00

    CPC classification number: B29C45/0013 ,  B29C45/0001 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H01Q1/1271 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

    Abstract: Conductive gaskets are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

    Abstract translation: 导电垫圈由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

    Low cost shielded cable manufactured from conductive loaded resin-based materials
    250.
    发明申请
    Low cost shielded cable manufactured from conductive loaded resin-based materials 有权
    由导电负载的树脂基材料制成的低成本屏蔽电缆

    公开(公告)号：US20050006126A1

    公开(公告)日：2005-01-13

    申请号：US10811371

    申请日：2004-03-26

    Applicant: Thomas Aisenbrey

    Inventor： Thomas Aisenbrey

    IPC: H01B7/17 ,  B29C45/00 ,  G06K19/077 ,  H01B3/30 ,  H01B11/06 ,  H01B11/10 ,  H01B13/22 ,  H01Q1/12 ,  H01Q1/24 ,  H01Q1/32 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/04 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q21/00 ,  H05K1/09 ,  H05K3/10 ,  H01B1/00

    CPC classification number: H01B11/1066 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

    Abstract: Shielded cable devices are formed of a conductive loaded resin-based material. Non-insulated conductors with shields, coaxial shielded cables, twisted pair shielded cables, and multi-wire shielded cables are described. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like. The conductive loaded resin-based conductive shield of the shielded cable devices can be formed using methods such as injection molding compression molding or extrusion. The conductive loaded resin-based material used to form the conductive shield of the shield cable devices can also be in the form of a thin flexible woven fabric that can readily be cut to the desired shape.

    Abstract translation: 屏蔽电缆装置由导电负载的树脂基材料形成。 描述了具有屏蔽，同轴屏蔽电缆，双绞屏蔽电缆和多线屏蔽电缆的非绝缘导体。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或导电粉末和导电纤维的组合的重量与基础树脂主体的重量的比率在约0.20至0.40之间。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。 屏蔽电缆装置的导电负载的树脂基导电屏蔽可以使用诸如注射成型压缩成型或挤压的方法来形成。 用于形成屏蔽电缆装置的导电屏蔽的导电负载树脂基材料也可以是可以容易地切割成所需形状的薄柔性机织织物的形式。

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