Abstract:
PROBLEM TO BE SOLVED: To provide a structure for a signal line capable of reducing leak of a signal in the signal line provided with a strip conductor on an insulation layer formed on a surface of a semiconductor layer, and a switch using the signal line. SOLUTION: A lower insulating layer 23, a semiconductor layer 24 and an upper insulating layer 25 are laminated on a base 22, and a strip conductor 26 is wired on the upper surface of the upper insulating layer 25. The signal line 21 is formed into an island, and the semiconductor layer 24 and the upper insulating layer 25 have each a width nearly equal to that of the strip conductor 26. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method for an electrical component which reduces the contact resistance of the surface of the electrical component. SOLUTION: The manufacturing method includes the processes of forming a resist on a part of the surface of a board, forming a metal layer on the board surface after the formation of the resist, removing a part of the metal layer, removing a metal oxide film that is formed on the surface of the metal layer as a result of the removal of the part of the metal layer, and removing the resist. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
The present disclosure provides a radio frequency micro-electro-mechanical switch and a radio frequency device, belong to the field of micro-electro-mechanical systems technology, and can at least partially solve a problem that functional performance of an existing radio frequency micro-electro-mechanical switch is easily to be affected in scenarios such as bending deformation of devices. The radio frequency micro-electro-mechanical switch provided by the present disclosure includes: a substrate; and a signal electrode, a first ground electrode, a second ground electrode and a connecting membrane bridge disposed on the substrate, the connecting membrane bridge crosses over the signal electrode, two ends of the connecting membrane bridge are connected to the first ground electrode and the second ground electrode respectively, and the connecting membrane bridge includes a stretchable structure being stretchable in a stretchable direction the same as an extending direction in which the connecting membrane bridge extends.
Abstract:
Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity. The method for forming the cavity further includes forming at least one first vent hole of a first dimension which is sized to avoid or minimize material deposition on a beam structure during sealing processes. The method for forming the cavity further includes forming at least one second vent hole of a second dimension, larger than the first dimension.
Abstract:
The present application discloses a method for forming electrical contacts on a semiconductor substrate. The method includes forming a first metal layer over the substrate, and forming a layer of a second metal oxide by sputter deposition of a second metal in an oxygen environment.
Abstract:
To provide a contact point structure of an electronic device capable of maintaining stable impact resistance. There is provided a contact point structure including: a base portion that is a semiconductor substrate; a movable contact point portion that is supported by the base portion and is a part of a movable member capable of being driven in a predetermined direction; and a fixed contact point portion that faces the movable contact point portion. The fixed contact point portion includes a fixed portion that is supported by the base portion and an extending member that extends from the fixed portion and is capable of being displaced relative to the fixed portion.
Abstract:
According to various embodiments, a MEMS device includes a substrate, an electrically movable heating element having a first node coupled to a first terminal of a first voltage source and the second node coupled to a reference voltage source, a first anchor anchoring the first node and a second anchor anchoring the second node of the electrically movable heating element to the substrate, and a cavity between the first anchor and the second anchor and between the electrically movable heating element and the substrate.