公开(公告)号：US20100035066A1

公开(公告)日：2010-02-11

申请号：US12404311

申请日：2009-03-15

Applicant: Charng-Shing Lu ,  Shu-Chu Shih ,  Jinn-Shing King ,  Shur-Fen Liu

Inventor： Charng-Shing Lu ,  Shu-Chu Shih ,  Jinn-Shing King ,  Shur-Fen Liu

IPC: B32B27/38 ,  B32B15/08 ,  B32B37/06 ,  B32B37/10

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/18 ,  B32B27/20 ,  B32B27/24 ,  B32B27/281 ,  B32B27/34 ,  B32B37/02 ,  B32B37/153 ,  B32B2250/40 ,  B32B2264/02 ,  B32B2264/104 ,  B32B2264/107 ,  B32B2307/306 ,  B32B2307/734 ,  B32B2309/105 ,  B32B2379/08 ,  B32B2457/00 ,  H05K1/036 ,  H05K3/022 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T156/1089 ,  Y10T156/1092 ,  Y10T428/24942 ,  Y10T428/31522 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: The invention discloses double-sided metal clad laminates and fabrication methods thereof. A plurality of polyamic acid coatings is co-extruded on a first metal foil and heat imidization to provide a multilayer polyimide film. A second metal foil is hot pressed on the multilayer polyimide film, thus providing a double-sided metal clad laminate. The polyamic acid coatings include a first, a second, and a third polyamic acid coating with surface tensions of S1, S2, and S3, respectively, satisfying relations of S1>S2>S3, wherein the first polyamic acid coating is the coating directly applied on the first metal foil.

Abstract translation: 本发明公开了双面金属包覆层压板及其制造方法。 将多个聚酰胺酸涂层共挤出在第一金属箔上并加热酰亚胺化以提供多层聚酰亚胺膜。 将第二金属箔热压在多层聚酰亚胺膜上，从而提供双面金属箔层压板。 聚酰胺酸涂料包括分别具有S1，S2和S3的表面张力的第一，第二和第三聚酰胺酸涂料，其满足S1> S2> S3的关系，其中第一聚酰胺酸涂层是直接涂覆的涂层 在第一金属箔上。

公开(公告)号：US07534648B2

公开(公告)日：2009-05-19

申请号：US11479246

申请日：2006-06-29

Applicant: Nachiket Raravikar ,  Ravindra Tanikella

Inventor： Nachiket Raravikar ,  Ravindra Tanikella

IPC: H01L21/00

CPC classification number: H01L23/29 ,  B82Y10/00 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/026 ,  Y10S977/70 ,  Y10T428/24 ,  Y10T428/24331 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A composite material including an arrangement of approximately aligned nanofilaments overlying at least another arrangement of approximately aligned nanofilaments, the longitudinal axis of the nanotubes of the first arrangement being approximately perpendicular to the longitudinal axis of the nanotubes of the other arrangement, and the arrangements forming at least one array. A resin material having nanoparticles dispersed throughout is disposed among the array(s) of nanofilaments, and cured, and openings may be formed into or through the composite material corresponding to spaces provided in the array of nanofilaments. A composite material according to embodiments forms a microelectronic substrate or some portion thereof, such as a substrate core.

Abstract translation: 一种复合材料，其包括大致排列的纳米丝的布置，其覆盖至少另一布置的大致排列的纳米丝，第一布置的纳米管的纵向轴线大致垂直于另一布置的纳米管的纵向轴线，并且形成在 最少一个数组。 将具有分散在其中的纳米颗粒分散在其中的树脂材料设置在纳米丝阵列中，并固化，并且可以将复合材料的开口形成为对应于在纳米丝阵列中提供的空间的复合材料。 根据实施方案的复合材料形成微电子衬底或其某些部分，例如衬底芯。

公开(公告)号：US20090104429A1

公开(公告)日：2009-04-23

申请号：US12066893

申请日：2006-09-14

Applicant: Nobuhiro Goto ,  Hiroshi Kouyanagi ,  Takayuki Kobayashi ,  Masaru Heishi

Inventor： Nobuhiro Goto ,  Hiroshi Kouyanagi ,  Takayuki Kobayashi ,  Masaru Heishi

IPC: B32B3/26 ,  C08L63/00 ,  B32B15/092

CPC classification number: H05K1/0373 ,  B32B27/06 ,  C08J5/24 ,  C08J2363/00 ,  C08L63/00 ,  H05K3/4626 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/249991 ,  Y10T428/31678

Abstract: Provided is a resin composition, a prepreg, a cured body, a sheet-like formed body, a laminate, and a multilayered laminate using the resin composition, the resin composition including an epoxy resin and an inorganic filler. For example, when a second layer is formed onto the surface of a cured body, the cured body has improved adhesive property or adhesive property between the cured body and the second layer. A resin composition comprising an epoxy resin, a curing agent for the epoxy resin, a silica treated with an imidazole silane and having a mean particle diameter not more than 5 micrometers, the resin composition including the silica at a proportion of 0.1 to 80 parts by weight to a mixture consisting of the epoxy resin and the curing agent for the epoxy resin 100 parts by weight.

Abstract translation: 提供了使用该树脂组合物的树脂组合物，预浸料坯，固化体，片状成形体，层压体和使用该树脂组合物的多层叠层，该树脂组合物包含环氧树脂和无机填料。 例如，当在固化体的表面上形成第二层时，固化体在固化体与第二层之间具有改善的粘合性或粘合性。 一种树脂组合物，其包含环氧树脂，环氧树脂用固化剂，用咪唑硅烷处理的平均粒径不超过5微米的二氧化硅，所述二氧化硅的比例为0.1〜80份， 重量与由环氧树脂和环氧树脂固化剂组成的混合物100重量份。

公开(公告)号：US20080303439A1

公开(公告)日：2008-12-11

申请号：US12155939

申请日：2008-06-11

Applicant: Chul-Hong Kim

Inventor： Chul-Hong Kim

IPC: H01J1/53

CPC classification number: H01J11/48 ,  C08K3/22 ,  C08K5/3472 ,  C08K5/54 ,  C09D1/00 ,  C09D7/60 ,  C09D183/04 ,  H01J11/12 ,  H01J11/46 ,  H05K3/282 ,  H05K3/361 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0769 ,  H05K2203/124

Abstract: Provided are a coating composition for an interconnection part of an electrode and a plasma display panel including the same. Specifically, the coating composition for an interconnection part of an electrode is used to effectively prevent opens and short circuits of an electrode due to damage of an interconnection unit caused by gases and humidity in the surrounding environment and due to a migration phenomenon.

Abstract translation: 提供了一种用于电极的互连部分的涂料组合物和包括其的等离子体显示面板。 具体地说，用于电极互连部分的涂料组合物用于有效地防止由于周围环境中由气体和湿度引起的互连单元的损坏以及由于迁移现象导致的电极开路和短路。

公开(公告)号：US20080075872A1

公开(公告)日：2008-03-27

申请号：US11839462

申请日：2007-08-15

Applicant: Joseph Lichtenhan ,  Andre Lee ,  Sukhendu Hait

Inventor： Joseph Lichtenhan ,  Andre Lee ,  Sukhendu Hait

IPC: C08G77/00 ,  B05D3/02

CPC classification number: H05K3/285 ,  C09D183/02 ,  C09D183/04 ,  H01L23/296 ,  H01L24/01 ,  H01L24/80 ,  H01L2224/131 ,  H01L2224/1379 ,  H01L2224/13888 ,  H01L2224/13891 ,  H01L2224/291 ,  H01L2224/29191 ,  H01L2224/2979 ,  H01L2224/29888 ,  H01L2224/29891 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01016 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01055 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01064 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H05K3/284 ,  H05K3/3463 ,  H05K2201/0239 ,  H05K2201/0769 ,  H05K2201/10977 ,  H01L2924/0715 ,  H01L2924/014

Abstract: Nanoscopic silicon containing agents including polyhedral oligomeric silsesquioxane and polyhedral oligomeric silicate are used to eliminate the formation of conductive metal whiskers at the surface of lead-free solders joints and atom migration in semiconductors.

Abstract translation: 包括多面体低聚倍半硅氧烷和多面体低聚硅酸盐在内的含纳米硅的试剂被用来消除无铅焊料表面的导电金属晶须的形成和半导体中的原子迁移。

公开(公告)号：US20070085212A1

公开(公告)日：2007-04-19

申请号：US11558163

申请日：2006-11-09

Applicant: Guoping Mao ,  Shichun Qu ,  Fuming Li ,  Robert Clough ,  Nelson O'Bryan

Inventor： Guoping Mao ,  Shichun Qu ,  Fuming Li ,  Robert Clough ,  Nelson O'Bryan

IPC: H01L23/52

CPC classification number: C08L65/00 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0373 ,  H05K3/4626 ,  H05K2201/0209 ,  H05K2201/0239 ,  H01L2924/00

Abstract: A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.

Abstract translation: 含有增韧的苯并环丁烯树脂和至少约50重量％的无机填料的介电复合材料。 还有具有至少一个导电层和至少一层介电复合材料的电子封装。 介电复合材料的介电常数可以小于约3.5，介电损耗小于约0.004。

公开(公告)号：US20060191869A1

公开(公告)日：2006-08-31

申请号：US11414283

申请日：2006-04-28

Applicant: Roger Bernards ,  Hector Gonzalez ,  Al Kucera ,  Mike Schanhaar

Inventor： Roger Bernards ,  Hector Gonzalez ,  Al Kucera ,  Mike Schanhaar

IPC: H01B13/00 ,  B44C1/22 ,  C23F1/00

CPC classification number: C23C22/68 ,  C23C22/52 ,  C23C2222/20 ,  C23F1/18 ,  H05K3/383 ,  H05K3/385 ,  H05K3/389 ,  H05K3/4611 ,  H05K2201/0239 ,  H05K2203/0793 ,  H05K2203/0796 ,  H05K2203/124

Abstract: The invention is directed to a method and composition for providing roughened copper surfaces suitable for subsequent multilayer lamination. A smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition consisting essentially of an oxidizer, a pH adjuster, a topography modifier, and a uniformity enhancer. A coating promoter may be used in place of the uniformity enhancer or in addition to the uniformity enhancer. The adhesion promoting composition does not require a surfactant. The process may further comprise the step of contacting the uniform roughened copper surface with a post-dip, wherein the post-dip comprises an azole or silane compound or a combination of said azole and said silane. The post-dip may further comprise, alone or in combination, a titanate, zirconate, and an aluminate. The pH adjuster is preferably sulfuric acid and the oxidizer is preferably hydrogen peroxide. A hydrogen peroxide stabilizer may be used in the adhesion promoting composition.

公开(公告)号：US07056585B2

公开(公告)日：2006-06-06

申请号：US10626574

申请日：2003-07-25

Applicant: Hiroyuki Mishima ,  Tsuyoshi Isozaki ,  Hidenori Kimbara ,  Norio Nagai

Inventor： Hiroyuki Mishima ,  Tsuyoshi Isozaki ,  Hidenori Kimbara ,  Norio Nagai

IPC: C08K3/22

CPC classification number: C08J5/10 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31663

Abstract: A prepreg comprising a thermosetting resin (D) composition containing, as an essential component, an aluminum hydroxide-boehmite composite (A) obtained by hydrothermal treatment of aluminum hydroxide, and a substrate (I), a laminate using the above prepreg, and a metal-foil-clad laminate using the above laminate.

Abstract translation: 一种预浸料，其包含热固性树脂（D）组合物，其含有通过水热处理氢氧化铝获得的氢氧化铝 - 勃姆石复合材料（A）和基材（I）作为必要成分，使用上述预浸料的层压体，以及 使用上述层叠体的覆盖箔的层叠体。

公开(公告)号：US07047629B2

公开(公告)日：2006-05-23

申请号：US10686576

申请日：2003-10-17

Applicant: Shinobu Kokufu ,  Takeshi Suzuki ,  Fumio Echigo ,  Daizo Andoh ,  Tatsuo Ogawa ,  Yoshihiro Kawakita ,  Satoru Tomekawa

Inventor： Shinobu Kokufu ,  Takeshi Suzuki ,  Fumio Echigo ,  Daizo Andoh ,  Tatsuo Ogawa ,  Yoshihiro Kawakita ,  Satoru Tomekawa

IPC: H05K3/20

CPC classification number: H05K3/4069 ,  H05K3/282 ,  H05K3/389 ,  H05K3/4614 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49171 ,  Y10T428/24917

Abstract: A circuit board manufacturing method including the steps of forming a through hole on an insulator layer and then filling the through hole with a conductive paste; dispersing and forming a protective agent on an adhesion surface of a conductor foil so as to include adhesion surface regions where the protective agent does not exist; sticking the conductor foil to the insulator layer; and abutting a plurality of conductive powders constituting the conductive paste and the conductor foil to each other through the adhesion surface regions by means of heating and pressurizing the insulator layer and conductor foil.

Abstract translation: 一种电路板制造方法，包括以下步骤：在绝缘体层上形成通孔，然后用导电浆料填充所述通孔; 在导体箔的粘合表面上分散形成保护剂，以包括不存在保护剂的粘合表面区域; 将导体箔粘附到绝缘体层上; 并且通过加热和加压绝缘体层和导体箔，通过粘合表面区域将构成导电浆料和导体箔的多个导电粉末彼此邻接。

公开(公告)号：US07034070B2

公开(公告)日：2006-04-25

申请号：US10670132

申请日：2003-09-24

Applicant: Vincent Chuang

Inventor： Vincent Chuang

IPC: C08L31/02 ,  B05D3/02

CPC classification number: B32B5/26 ,  C03C25/40 ,  C07F7/1804 ,  H05K1/0366 ,  H05K2201/0239 ,  Y10T428/31663

Abstract: Epoxy laminates with outstanding strength were obtained from glass fabrics finished with certain non-styryl arylalkyl aminofunctional alkoxysilane compounds having the formula: and HCl salts thereof, wherein R is an alkyl group having 1 to 6 carbon atoms; R1 is an alkyl group having 1 to 6 carbon atoms; R2 may be the same or different and are independently selected from alkyl groups having 1 to 6 carbon atoms; and n has a value of 0 or 1, wherein the compounds are prepared using readily available starting materials without the need for styrenic double bond.

Abstract translation: 具有优异强度的环氧层压板由具有下式的某些非苯乙烯基芳基烷基氨基官能烷氧基硅烷化合物及其HCl盐完成的玻璃织物得到，其中R是具有1至6个碳原子的烷基; R 1是具有1至6个碳原子的烷基; R 2可以相同或不同，并且独立地选自具有1至6个碳原子的烷基; n为0或1，其中使用容易获得的原料制备化合物，而不需要苯乙烯双键。