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公开(公告)号：WO2011129351A1
公开(公告)日：2011-10-20
申请号：PCT/JP2011/059137
申请日：2011-04-13
CPC classification number: H03H3/0072 , B81B2201/0271 , B81C1/00182 , H03H9/2405 , H03H9/2452 , H03H2009/02496 , H03H2009/02519
Abstract: 【課題】ＭＥＭＳデバイスの製造方法において、基板表面と振動部材下面とが十分に狭い間隙で対向した構造を容易に製造可能とする。 【解決手段】ＭＥＭＳデバイスの製造方法は、ＳＯＩ基板を用意する工程Ｓ１と、第１シリコン層をパターニングして、外枠部と、かさ上げ対向部と、かさ上げ対向部と外枠部の３以上の箇所とをそれぞれ接続する支持梁部とを形成する工程Ｓ２と、上記かさ上げ対向部と第２シリコン層との間に位置する中間絶縁層をエッチング除去することによって上記かさ上げ対向部と上記第２シリコン層とが互いに離隔した状態を作り出す工程Ｓ３と、上記外枠部および上記かさ上げ対向部に対して一括して基材を貼り付ける工程Ｓ４と、上記第２シリコン層をパターニングすることによって浮き構造体を形成し、さらに上記支持梁部を分断して上記かさ上げ対向部を孤立させる工程Ｓ５とを含む。
Abstract translation: 公开了一种MEMS器件制造方法，其能够容易地制造其中衬底表面和振动构件下表面之间彼此具有足够窄的间隙的结构。 MEMS器件制造方法包括：准备SOI衬底的工序（S1） 形成第一硅树脂层被图案化的台阶（S2），并且形成连接升高和面对部分与外框架部分的至少三个位置的外框架部分，升高和面对部分以及支撑梁部分 ; 步骤（S3），其中通过蚀刻位于升高和面对部分和第二硅氧烷层之间的中间绝缘层来产生升高和面对部分与第二硅层之间的分离状态; 步骤（S4），其中基板被共同地粘贴到外框架部分和升起面对部分; 以及步骤（S5），其中通过对第二硅层进行图案化而形成浮动结构，并且支撑梁部分被分割以隔离升高和面对部分。
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公开(公告)号：WO2011042597A1
公开(公告)日：2011-04-14
申请号：PCT/FI2010/050744
申请日：2010-09-27
Applicant: VALTION TEKNILLINEN TUTKIMUSKESKUS , OJA, Aarne , PENSALA, Tuomas , MELTAUS, Johanna
Inventor： OJA, Aarne , PENSALA, Tuomas , MELTAUS, Johanna
CPC classification number: H03H9/02259 , B81B3/0081 , B81B2201/0271 , H03H3/0076 , H03H9/02338 , H03H9/02448 , H03H9/2436 , H03H9/2452 , H03H9/2463 , H03H2003/027 , H03H2003/0407 , H03H2009/02496 , H03H2009/02503 , H03H2009/02511 , H03H2009/241 , H03H2009/2442
Abstract: The invention relates to a micromechanical resonator comprising a substrate (1) of first material (2), a resonator (3) suspended to the supporting structure (1), the resonator (3) being at least partially of the same material (2) as the supporting structure and dimensioned for resonation at a specific frequency f o , coupling means (5) for initiating, maintaining and coupling the resonation of the resonator (3) to an external circuit (6), and the resonator (3) including second material (4), the thermal properties of which being different from the first material (2). In accordance with the invention the resonator (3) includes the second material (4) located concentrated in specific places of the resonator (3).
Abstract translation: 本发明涉及一种微机械谐振器，其包括第一材料（2）的衬底（1），悬挂于支撑结构（1）的谐振器（3），谐振器（3）至少部分由相同的材料（2）组成， 作为用于以特定频率fo谐振的支撑结构和尺寸，用于启动，保持和耦合谐振器（3）的谐振到外部电路（6）的耦合装置（5）和包括第二材料的谐振器（3） （4），其热性质与第一材料（2）不同。 根据本发明，谐振器（3）包括集中在谐振器（3）的特定位置的第二材料（4）。
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公开(公告)号：WO2009104486A1
公开(公告)日：2009-08-27
申请号：PCT/JP2009/052145
申请日：2009-02-09
Inventor： 長崎 寛範
CPC classification number: H03H3/0072 , B81B2201/0271 , B81B2203/0118 , B81B2203/033 , B81B2203/04 , B81C1/00182 , B81C2201/0178 , H01G5/16 , H03H9/2463 , H03H2009/02496 , Y10T29/49002
Abstract: 【課題】ギャップを更に狭小化することが可能なマイクロエレクトロメカニカルデバイスの構造及びその製造方法を提供する。 【解決手段】本発明に係るマイクロエレクトロメカニカルデバイスにおいては、共振子２２と電極２１が互いに対向し、その対向面には一対の熱酸化膜５、５が形成されて、両熱酸化膜間に狭小化されたギャップを有している。本発明に係るマイクロエレクトロメカニカルデバイスの製造工程においては、共振子２２と電極２１となるＳｉ層に対し、フォトリソグラフィとエッチングを用いた加工を施して、ギャップとなる溝２０を形成した後、該Ｓｉ層に対し、熱酸化処理を施して、溝２０の対向面に一対のＳｉ熱酸化膜５、５を形成する。
Abstract translation: 提供了一种微机电装置的结构，其中间隙可以变窄。 还提供了一种制造微机电装置的方法。 微机电装置包括谐振器（22）和彼此面对的电极（21），形成在谐振器和彼此面对的电极的表面上的一对热氧化膜（5,5），以及设置在热 氧化膜。 一种制造微机电装置的方法包括通过使用光刻和蚀刻来处理作为谐振器（22）和电极（21）的Si层以形成沟槽（20）成为间隙的步骤，以及执行步骤 在Si层上进行热氧化，以在沟槽（20）的相对表面上形成一对Si的热氧化膜（5,5）。
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274.发明申请ELASTIC WAVE TRANSDUCER, ELASTIC WAVE TRANSDUCER ARRAY, ULTRASONIC PROBE, AND ULTRASONIC IMAGING APPARATUS 审中-公开弹性波传感器，弹性波传感器阵列，超声波探头和超声波成像装置
公开(公告)号：WO2009096576A2
公开(公告)日：2009-08-06
申请号：PCT/JP2009051678
申请日：2009-01-27
Applicant: CANON KK , UNIV KYOTO , NAGAE KENICHI , TABATA OSAMU
Inventor： NAGAE KENICHI , TABATA OSAMU
CPC classification number: B06B1/0292 , B81B3/007 , B81B2201/0271 , B81B2203/0127
Abstract: An elastic wave transducer includes a substrate (101) having a lower electrode, a support member (102) formed on the substrate, and a membrane (103) that is held by the support member and has an upper electrode. The membrane has a first region (105) that is in contact with the support member, and a second region (106) that is out of contact with said support member and is deformed by receiving an elastic wave. The second region of the membrane has a region in which the bulk density of the second region becomes smaller in accordance with an increasing distance thereof from the first region of the membrane. In addition, the second region has a bulk density ratio that is larger than or equal to 0.1 and is less than or equal to 0.5.
Abstract translation: 弹性波传感器包括具有下电极的基板（101），形成在基板上的支撑部件（102）和由支撑部件保持并具有上电极的膜（103）。 膜具有与支撑构件接触的第一区域（105）和与所述支撑构件不接触并且通过接收弹性波而变形的第二区域（106）。 膜的第二区域具有根据其与膜的第一区域的距离的增加而使第二区域的体积密度变小的区域。 此外，第二区域的体积密度比大于或等于0.1且小于或等于0.5。
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公开(公告)号：WO2007147137A2
公开(公告)日：2007-12-21
申请号：PCT/US2007/071378
申请日：2007-06-15
Applicant: SITIME CORPORATION , GUPTA, Pavan , RAZDA, Eric
Inventor： GUPTA, Pavan , RAZDA, Eric
IPC: H01L23/52
CPC classification number: B81B7/0083 , B81B7/007 , B81B7/0077 , B81B2201/0271 , B81B2207/07 , B81B2207/094 , B81C1/0023 , B81C1/00301 , B81C1/00333 , B81C1/00341 , B81C2201/016 , B81C2203/0118 , B81C2203/0154 , H01L23/3107 , H01L23/34 , H01L23/498 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/10253 , H01L2924/1461 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
Abstract: A stacked die package for an electromechanical resonator system includes a chip that contains an electromechanical resonator bonded onto the control chip for the electromechanical resonator by a thermally and/or electrically conductive epoxy. In various embodiments, the electromechanical resonator can be a micro-electromechanical system (MEMS) resonator or a nano-electromechanical system (NEMS) resonator. Packaging configurations that may include the chip that contains the electromechanical resonator and the control chip include chip-on-lead (COL), chip-on-paddle (COP), and chip-on-tape (COT) packages. The stacked die package provides small package footprint and/or low package thickness, as well as low thermal resistance and a robust conductive path between the chip that contains the electromechanical resonator and the control chip.
Abstract translation: 用于机电谐振器系统的堆叠管芯封装包括芯片，其包含通过热和/或导电环氧树脂粘合到用于机电谐振器的控制芯片上的机电谐振器。 在各种实施例中，机电谐振器可以是微机电系统（MEMS）谐振器或纳米机电系统（NEMS）谐振器。 可以包括包含机电谐振器和控制芯片的芯片的封装结构包括芯片引线（COL），片上芯片（COP）和片上芯片（COT）封装。 堆叠管芯封装提供小的封装封装和/或低封装厚度，以及低热阻和在包含机电谐振器的芯片和控制芯片之间的坚固的导电路径。
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Patent Agency Ranking
公开(公告)号：WO0187767A3
公开(公告)日：2002-04-11
申请号：PCT/US0116061
申请日：2001-05-17
Applicant: SCHRIJVER STEFAAN DE
Inventor： DE SCHRIJVER STEFAAN
CPC classification number: B81C1/00246 , B81B3/0078 , B81B2201/0271 , B81B2203/0118 , B81C2203/0771 , H03H9/2426
Abstract: A micro-electromechanical structure (MEMS) usable as actuator or sensor device that is mechanically robust while it is subject to various frequencies and sudden changes in frequencies while it measures signals, and converts the mechanical signals to electrical signals for data storage and analysis that includes mechanical arms on which a resistor is etched using well-known lithographic techniques. A mechanical arm can be designed to measure a different frequency, and the mechanical arm thickness, length, and width determine the frequency to which a respective arm will resonate. An arm can be connected to operational circuitry through the etched resistor to record the mechanical vibrations of the respective mechanical arm. Multiple mechanical arms in two directions can be designed to measure frequencies in two orthogonal directions. The mechanical arms can be actuated statically or dynamically, by mechanical, acoustic, electro-magnetic, thermal, or humidity stimuli. The elasticity is obtained by creating thin slices of silicon that support IC's and by bonding them into multi-layered stacks.
Abstract translation: 可用作致动器或传感器装置的微机电结构（MEMS），其在测量信号的同时受到各种频率和频率的突然变化的机械鲁棒性，并将机械信号转换为电信号用于数据存储和分析，包括 使用公知的光刻技术在其上刻蚀电阻器的机械臂。 机械臂可以被设计成测量不同的频率，并且机械臂的厚度，长度和宽度决定相应臂将共振的频率。 臂可以通过蚀刻电阻器连接到操作电路，以记录相应的机械臂的机械振动。 可以设计两个方向上的多个机械臂来测量两个正交方向上的频率。 机械臂可以通过机械，声学，电磁，热或湿度刺激静态或动态地致动。 通过产生支持IC的薄片硅片并将它们粘合成多层叠层来获得弹性。
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公开(公告)号：WO02012114A2
公开(公告)日：2002-02-14
申请号：PCT/US2001/024645
申请日：2001-08-04
CPC classification number: B81C1/0015 , B81B2201/0271 , B81C2201/0109 , H01H59/0009 , H01P1/127 , H05K1/092 , H05K3/02 , Y10T29/49117 , Y10T428/24926 , Y10T428/2495
Abstract: A microelectromechanical structure having a ceramic substrate formed from low temperature co-fired ceramic sheets. A low loss photodefinable dielectric planarizing layer is formed over one surface of the ceramic substrate. This layer can be a sacrificial layer or a subsequent sacrificial layer added. A photodefined conductor is printed over the low loss dielectric planarizing layer and formed with the sacrificial layer into a structural circuit component. A switch is formed with a biasing actuator and deflectable member formed over the biasing actuator and moveable into open and closed circuit positions.
Abstract translation: 一种具有由低温共烧陶瓷片形成的陶瓷衬底的微机电结构。 在陶瓷基板的一个表面上形成低损耗可光限定介电平面化层。 该层可以是牺牲层或随后的牺牲层。 在低损耗介电平面化层上印刷光致定导体，并将牺牲层形成为结构电路部件。 开关形成有偏置致动器和可偏转构件，偏置致动器形成在偏置致动器上方并且可移动到打开和闭合的位置。
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公开(公告)号：WO01087767A2
公开(公告)日：2001-11-22
申请号：PCT/US2001/016061
申请日：2001-05-17
CPC classification number: B81C1/00246 , B81B3/0078 , B81B2201/0271 , B81B2203/0118 , B81C2203/0771 , H03H9/2426
Abstract: A micro-electromechanical structure (MEMS) usable as actuator or sensor device that is mechanically robust while it is subject to various frequencies and sudden changes in frequencies while it measures signals, and converts the mechanical signals to electrical signals for data storage and analysis that includes mechanical arms on which a resistor is etched using well-known lithographic techniques. A mechanical arm can be designed to measure a different frequency, and the mechanical arm thickness, length, and width determine the frequency to which a respective arm will resonate. An arm can be connected to operational circuitry through the etched resistor to record the mechanical vibrations of the respective mechanical arm. Multiple mechanical arms in two directions can be designed to measure frequencies in two orthogonal directions. The mechanical arms can be actuated statically or dynamically, by mechanical, acoustic, electro-magnetic, thermal, or humidity stimuli. The present invention allows obtaining miniature MEMS sensors that are robust with extremely small footprint. The robustness is obtained by adding elasticity to MEMS structures. The elasticity is obtained by creating thin slices of silicon that support IC's and by bonding them into multi-layered stacks.
Abstract translation: 可用作致动器或传感器装置的微机电结构（MEMS），其在测量信号的同时受到各种频率和频率的突然变化的机械稳定性，并将机械信号转换为电信号用于数据存储和分析，包括 使用公知的光刻技术在其上刻蚀电阻器的机械臂。 机械臂可以被设计成测量不同的频率，并且机械臂的厚度，长度和宽度决定相应臂将共振的频率。 臂可以通过蚀刻电阻器连接到操作电路，以记录相应的机械臂的机械振动。 可以设计两个方向上的多个机械臂来测量两个正交方向上的频率。 机械臂可以通过机械，声学，电磁，热或湿度刺激静态或动态地致动。 本发明允许获得具有极小占地面积的鲁棒的微型MEMS传感器。 通过向MEMS结构增加弹性来获得鲁棒性。 通过产生支持IC的薄片硅片并将它们粘合成多层叠层来获得弹性。
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公开(公告)号：WO1998029943A1
公开(公告)日：1998-07-09
申请号：PCT/US1997020639
申请日：1997-11-13
Applicant: HONEYWELL INC.
Inventor： HONEYWELL INC. , HERB, William, R. , BURNS, David, W. , YOUNGNER, Daniel, W.
IPC: H03H09/24
CPC classification number: B81B3/0072 , B81B2201/0271 , H03H9/02448 , H03H9/2463 , H03H9/2473
Abstract: A multi-material resonant thin film beam for a micromechanical sensor having a zero temperature coefficient of frequency (TCF) which is the resonant frequency shift with temperature change. One of the materials may be polysilicon and the other material may be silicon nitride or silicon oxide. Each material has a different thermal coefficient of expansion. The proportion of the various materials is adjusted and the specific geometries are determined so that the TCF is zero. One embodiment is a microbeam composed of two polysilicon thin films with a silicon nitride thin film inserted between the polysilicon films. The thickness of the silicon nitride film may be adjusted to trim the TCF to zero. The film of nitride instead may be placed on one side of a polysilicon film to form a beam. Dual or multiple beam resonators likewise may be made with several materials. The nitride may be placed in the shank areas which join and secure the ends of the beams. Such zero TCF beams may be incorporated in microsensor structures for measuring pressure, temperature, strain and other parameters.
Abstract translation: 一种用于微机械传感器的多材料谐振薄膜波束，其具有零温度频率系数（TCF），其是随着温度变化的谐振频率偏移。 其中一种材料可以是多晶硅，另一种材料可以是氮化硅或氧化硅。 每种材料具有不同的热膨胀系数。 调整各种材料的比例，确定特定几何形状，使得TCF为零。 一个实施例是由两个多晶硅薄膜组成的微束，其中氮化硅薄膜插入在多晶硅膜之间。 可以调节氮化硅膜的厚度以将TCF修整为零。 氮化物膜可以放置在多晶硅膜的一侧以形成光束。 双或多束谐振器同样可以由几种材料制成。 氮化物可以放置在连接并固定梁的端部的柄部区域中。 这种零TCF光束可以被并入用于测量压力，温度，应变和其它参数的微传感器结构中。
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公开(公告)号：WO2018101814A1
公开(公告)日：2018-06-07
申请号：PCT/MY2017/050071
申请日：2017-11-15
Applicant: SILTERRA MALAYSIA SDN. BHD.
Inventor： SOUNDARA PANDIAN, Mohanraj , TAY, Wee Song , MADHAVEN, Venkatesh , KANTIMAHANTI, Arjun Kumar
IPC: H01L41/27 , H01L41/311 , H01L41/047 , H01L41/053 , H01L21/56
CPC classification number: H01L27/20 , B81B2201/0271 , B81B2207/015 , B81C1/00246 , B81C2203/0714 , B81C2203/0735 , B81C2203/0771 , H03H9/0538 , H03H9/173 , H03H9/25
Abstract: This disclosure describes a monolithic integrated device having an architecture that allows the acoustic device to transduce either the surface acoustic waves or the bulk acoustic waves. The monolithic integrated device comprises a substrate layer (101) being the base of the device; an inter-layer dielectric (102) disposed on top of the substrate layer (101); an electronic circuitry substantially formed in the inter-layer dielectric (102) and supported by the substrate layer (101), the electronic circuitry comprises a plurality of metal layers formed by one or more spaced apart metals (204); and a piezoelectric (301) being sandwiched between a top electrode and a bottom electrode within the inter-layer dielectric. The top electrode is a metal (204) of an upper metal layer belonging to the electronic circuitry and the bottom electrode is a metal (204) of a lower metal layer belonging to the electronic circuitry. In order to transduce bulk acoustic waves, the inter-layer dielectric is formed with a top cavity (105) above the top electrode and a bottom cavity (106) below the bottom electrode.
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