公开(公告)号：US20060054870A1

公开(公告)日：2006-03-16

申请号：US11265287

申请日：2005-11-03

Applicant: Robert Japp ,  Voya Markovich ,  Kostas Papathomas

Inventor： Robert Japp ,  Voya Markovich ,  Kostas Papathomas

IPC: H01B3/24

CPC classification number: H05K1/0373 ,  C08J5/24 ,  C08J2363/04 ,  H01B3/00 ,  H01B3/40 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/0239

Abstract: A dielectric composition which is adapted for combining with a supporting material (e.g., fiber-glass cloth) to form a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like. As such a layer, it includes a resin, a predetermined percentage by weight of a filler, and, significantly, only a minor amount of bromine. A circuitized substrate comprised of one or more of these dielectric layers and one or more conductive layers is also provided.

Abstract translation: 一种电介质组合物，其适于与支撑材料（例如玻璃纤维布）组合以形成可用于诸如PCB，芯片载体等的电路化基板中的电介质层。 作为这样的层，其包括树脂，预定重量百分比的填料，以及明显仅少量的溴。 还提供了由这些电介质层中的一个或多个以及一个或多个导电层构成的电路化衬底。

公开(公告)号：US20050244662A1

公开(公告)日：2005-11-03

申请号：US11083551

申请日：2005-03-18

Applicant: Allen Horn ,  Robert Daigle ,  Michael Kuszaj

Inventor： Allen Horn ,  Robert Daigle ,  Michael Kuszaj

IPC: C08K3/00 ,  C08K3/22 ,  C08K3/36 ,  C08K3/38 ,  C08L27/18 ,  H05K1/03 ,  H05K1/16 ,  B32B15/08

CPC classification number: H05K1/0373 ,  C08K3/013 ,  H05K1/034 ,  H05K1/162 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/068 ,  Y10T428/3154 ,  C08L27/12

Abstract: A dimensionally stable high K′ microwave laminate comprises independent control of the K′ and CTE (coefficient of thermal expansion) of the fluoropolymer microwave laminates. The laminate comprises a composite having at least two types of ceramic filler. At least one type of ceramic filler exhibits a K′ of greater than 30. The two or more fillers are necessary to be able to independently control the K′ and the CTE of the composite, thereby achieving a dimensional stability of absolute magnitude less than 0.1% change. The present invention allows the manufacture of microwave laminate with any specified K′ (within the achievable range) and the XY CTE of the material nearly matched to that of copper, resulting in good dimensioned stability during circuit fabrication.

Abstract translation: 尺寸稳定的高K'微波层压板包括独立控制含氟聚合物微波层压板的K'和CTE（热膨胀系数）。 层压体包括具有至少两种类型的陶瓷填料的复合材料。 至少一种类型的陶瓷填料表现出大于30的K'。两种或更多种填料必须能够独立地控制复合材料的K'和CTE，从而获得绝对值小于0.1的尺寸稳定性 ％变化。 本发明允许制造具有任何指定的K'（在可实现的范围内）和材料的XY CTE的微波层压板几乎与铜的相同，从而在电路制造期间具有良好的尺寸稳定性。

公开(公告)号：US20050224767A1

公开(公告)日：2005-10-13

申请号：US10812889

申请日：2004-03-31

Applicant: Robert Japp ,  Kostas Papathomas

Inventor： Robert Japp ,  Kostas Papathomas

IPC: C08K7/00 ,  H01B3/00 ,  H01L23/14 ,  H05K1/00 ,  H05K1/03 ,  H05K3/46 ,  H01B3/24

CPC classification number: H05K1/0373 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/24322 ,  Y10T428/24355 ,  Y10T428/24917

Abstract: A dielectric composition which forms a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like. As such a layer, it includes a cured resin material and a predetermined percentage by weight of particulate fillers, thus not including continuous fibers, semi-continuous fibers or the like as part thereof.

Abstract translation: 形成电介质层的电介质组合物，其可用于诸如PCB，芯片载体等的电路化基板中。 作为这样的层，其包括固化树脂材料和预定重量的颗粒填料，因此不包括连续纤维，半连续纤维等作为其一部分。

公开(公告)号：US06939431B2

公开(公告)日：2005-09-06

申请号：US10307282

申请日：2002-12-02

Applicant: Yasushi Mizuta ,  Tatsuji Murata ,  Makoto Nakahara ,  Takatoshi Kira ,  Daisuke Ikesugi

Inventor： Yasushi Mizuta ,  Tatsuji Murata ,  Makoto Nakahara ,  Takatoshi Kira ,  Daisuke Ikesugi

IPC: C09J163/00 ,  C08G59/42 ,  C08G59/62 ,  C08L63/00 ,  H01L21/60 ,  H01L23/498 ,  H05K3/32

CPC classification number: H01L24/83 ,  C08G59/42 ,  C08G59/621 ,  C08L63/00 ,  H01L23/49883 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/29369 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/323 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2203/122 ,  Y02P20/582 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Pastes for circuit connections and anisotropic conductive pastes that are excellent in storage stability and dispenser application properties, can be free of voids, bubbles and bleeding on thermocompression bonding and can give cured products having high bonding and connection reliability at high temperatures and high humidity, and the ability to be repaired. The paste for circuit connection contains an epoxy resin, an acid anhydride curing agent or a phenolic curing agent, and high-softening point fine particles. The anisotropic conductive paste additionally contains conductive particles. The method of using the paste for circuit connection or the anisotropic conductive paste involves connecting an electric circuit wiring formed on a substrate with an electric circuit wiring formed on another substrate with the paste for circuit connection or the anisotropic conductive paste.

Abstract translation: 用于电路连接和各向异性导电浆料的浆料具有优异的储存稳定性和分配器应用性能，可以在热压接上没有空隙，气泡和渗色，并且可以在高温和高湿度下产生具有高粘结和连接可靠性的固化产物，以及 修复能力。 电路连接用糊剂包含环氧树脂，酸酐固化剂或酚类固化剂，高软化点微粒。 各向异性导电膏还含有导电颗粒。 使用糊料进行电路连接或各向异性导电膏的方法包括将形成在基板上的电路布线与形成在另一基板上的电路布线用电路连接用糊剂或各向异性导电浆料进行连接。

公开(公告)号：US20050123739A1

公开(公告)日：2005-06-09

申请号：US10792245

申请日：2004-03-03

Applicant: Yui Chen-Yang ,  Chih Chen ,  Yao Wu

Inventor： Yui Chen-Yang ,  Chih Chen ,  Yao Wu

IPC: C08L27/12 ,  B32B3/26 ,  C01B33/36 ,  C08K3/36 ,  C08K9/00 ,  C09C1/30 ,  H05K1/02 ,  H05K1/03

CPC classification number: C09C1/3072 ,  C01P2002/72 ,  C01P2002/82 ,  C01P2004/03 ,  C01P2004/04 ,  C01P2006/12 ,  C01P2006/14 ,  C01P2006/16 ,  C08K3/36 ,  C09C1/30 ,  C09C1/3081 ,  C09C1/309 ,  H05K1/024 ,  H05K1/0373 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/249953 ,  Y10T428/249955 ,  Y10T428/249956 ,  C08L57/08

Abstract: A mesoporous silica/fluorinated polymer composite material. Made up of hydrophobic modified mesoporous silica with a pore size of 0.1 to 50 nm and a fluorinated polymer, to provide Dk

Abstract translation: 介孔二氧化硅/氟化聚合物复合材料。 由孔径为0.1〜50nm的疏水改性介孔二氧化硅和氟化聚合物组成，提供Dk <4，Df <0.04，CTE <60ppm，该材料适用于印刷电路板或基板 高频应用。

公开(公告)号：US20050096432A1

公开(公告)日：2005-05-05

申请号：US10505489

申请日：2003-02-14

Applicant: Takayuki Matsushima ,  Masao Saito

Inventor： Takayuki Matsushima ,  Masao Saito

IPC: C09J201/00 ,  C08G59/18 ,  C08G59/70 ,  C08J3/24 ,  C08L63/00 ,  C09J5/00 ,  C09J9/02 ,  C09J163/00 ,  H01B1/20 ,  H01L21/60 ,  H05K3/32 ,  C08F8/00

CPC classification number: H05K3/323 ,  C08G59/18 ,  C08J3/243 ,  C08L63/00 ,  C09J9/02 ,  C09J163/00 ,  H01L2224/16 ,  H01L2224/83101 ,  H05K2201/0239 ,  H05K2201/0379 ,  H05K2203/1163 ,  H05K2203/121 ,  Y10T428/31511 ,  Y10T428/31515

Abstract: Disclosed is a two-component adhesive used for electrically and mechanically interconnecting two objects for bonding. The two-component adhesive is made up by first and second adhesive materials separately containing first and second curing agents, respectively. It is only after reaction of the first and second curing agents that the first and second resin components are polymerized. As long as the two adhesive materials are isolated from each other, the adhesive is not cured. In case a metal chelate or a metal alcoholate is used as the first curing agent and a silane coupling agent is used as the second curing agent, cations as a curing component are isolated to cause cationinc polymerization of the first and second resin components to allow for curing at a lower temperature in a shorter time than in case a conventional adhesive is used.

Abstract translation: 公开了一种双组分粘合剂，用于将两个物体电连接和机械互连以进行粘结。 双组分粘合剂分别由分别含有第一和第二固化剂的第一和第二粘合剂材料制成。 仅在第一和第二固化剂反应之后，第一和第二树脂组分聚合。 只要两种粘合剂材料彼此分离，粘合剂就不会固化。 在使用金属螯合物或金属醇化物作为第一固化剂并且使用硅烷偶联剂作为第二固化剂的情况下，分离作为固化组分的阳离子以使第一和第二树脂组分的阳离子聚合以允许 在比使用常规粘合剂的情况下更短的时间内在较低温度下固化。

公开(公告)号：US20050065255A1

公开(公告)日：2005-03-24

申请号：US10504170

申请日：2003-02-17

Applicant: Takeharu Morita ,  Nobuhiro Goto ,  Hiroshi Yoshitani ,  Hiroshi Hiraike

Inventor： Takeharu Morita ,  Nobuhiro Goto ,  Hiroshi Yoshitani ,  Hiroshi Hiraike

IPC: C08G61/08 ,  C08L65/00 ,  H05K1/03 ,  C08L1/00

CPC classification number: H05K1/0373 ,  C08G61/08 ,  C08L65/00 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0239

Abstract: It is an object of the present invention to provide a polymerizable composition and a cured resin composition, linear expansion coefficients of which are significantly improved without impairment of the excellent properties such as heat resistance, mechanical strength and the like of norbornene-based resins. The present invention is a polymerizable composition, which comprises a polymerizable substance containing a norbornene-based monomer or oligomer as a main component, a metathesis polymerization catalyst and silica powder, the weight content of the silica powder being larger than the weight content of the polymerizable substance.

Abstract translation: 本发明的目的是提供一种可聚合组合物和固化树脂组合物，线性膨胀系数显着提高，而不损害降冰片烯系树脂的耐热性，机械强度等优异性能。 本发明是一种聚合性组合物，其含有以降冰片烯系单体或低聚物为主要成分的聚合性物质，易位聚合催化剂和二氧化硅粉末，二氧化硅粉末的重量含量大于可聚合的 物质。

公开(公告)号：US20040206943A1

公开(公告)日：2004-10-21

申请号：US10844307

申请日：2004-05-12

Applicant: Sony Chemicals Corporation

Inventor： Masao Saito ,  Osamu Takamatsu ,  Takayuki Matsushima

IPC: H01B001/00

CPC classification number: H05K3/323 ,  C08F290/062 ,  C08L71/12 ,  C08L2205/02 ,  C08L2312/00 ,  C08L2666/02 ,  C09J4/00 ,  C09J7/10 ,  C09J9/02 ,  C09J11/08 ,  C09J133/068 ,  C09J163/10 ,  C09J2201/602 ,  C09J2463/00 ,  H01L21/6835 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H05K2201/0239 ,  Y10T428/14 ,  Y10T428/1462 ,  Y10T428/31935 ,  C08F220/32 ,  H01L2924/00 ,  H01L2924/3512

Abstract: An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.

Abstract translation: 提供了一种满足低温固化性，高粘合性和高可靠性的绝缘粘合膜和各向异性导电粘合剂膜。 本发明的各向异性导电粘合剂膜是这样构成的，其中导电颗粒7分散在绝缘粘合树脂6中，其包括作为主要成分的具有不饱和双键的自由基聚合性树脂组分; 不具有不饱和双键的树脂组分; 含磷酸树脂组分; 和自由基聚合引发剂。

公开(公告)号：US20040180202A1

公开(公告)日：2004-09-16

申请号：US10383523

申请日：2003-03-10

Inventor： Ernest L. Lawton ,  Robert Rau

IPC: D02G003/00

CPC classification number: H05K1/0366 ,  C03C25/26 ,  C03C25/47 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/029 ,  H05K2203/127 ,  Y10T428/2927 ,  Y10T428/2933 ,  Y10T428/2938 ,  Y10T428/2962 ,  Y10T428/2964

Abstract: A fiber strand comprising at least one fiber at least partially coated with a composition formed from at least one rosin, at least one cationic lubricant, at least one film forming material, at least one organosilane coupling agent, and at least one dispersion of polymeric particles. A fiber strand comprising at least one fiber at least partially coated with a composition formed from components comprising at least one rosin, at least one polymeric lubricant, at least one film forming material, at least one organosilane coupling agent, and at least one dispersion of polymeric particles. A fiber strand comprising at least one fiber at least partially coated with a starch-free composition comprising at least one rosin, at least one cationic lubricant, at least one film forming material, and at least one organosilane coupling agent. A fiber strand comprising at least one fiber at least partially coated with a starch-free composition comprising at least one rosin, at least one polymeric lubricant, at least one film forming material, and at least one organosilane coupling agent. A fiber strand comprising at least one fiber at least partially coated with a composition comprising at least one rosin, at least one silyated polyamine, at least one film forming material, and at least one organosilane coupling agent. Also provided are fabrics and composite materials comprising at least one of these fiber strands.

Abstract translation: 一种纤维束，其包含至少部分涂覆有由至少一种松香，至少一种阳离子润滑剂，至少一种成膜材料，至少一种有机硅烷偶联剂和至少一种聚合物颗粒分散体形成的组合物的纤维 。 一种纤维束，其包含至少部分涂覆有组合物的纤维，所述组合物由包含至少一种松香，至少一种聚合物润滑剂，至少一种成膜材料，至少一种有机硅烷偶联剂和至少一种有机硅烷偶联剂的组分形成， 聚合物颗粒。 一种纤维束，其包含至少部分地涂覆有无淀粉组合物的至少一种纤维，所述组合物包含至少一种松香，至少一种阳离子润滑剂，至少一种成膜材料和至少一种有机硅烷偶联剂。 一种纤维束，其包含至少部分地涂覆有无淀粉组合物的至少一种纤维，所述组合物包含至少一种松香，至少一种聚合物润滑剂，至少一种成膜材料和至少一种有机硅烷偶联剂。 一种纤维束，其包含至少部分地涂覆有包含至少一种松香，至少一种巯基多胺，至少一种成膜材料和至少一种有机硅烷偶联剂的组合物的纤维。 还提供了包含这些纤维束中的至少一种的织物和复合材料。

公开(公告)号：US20040159264A1

公开(公告)日：2004-08-19

申请号：US10782177

申请日：2004-02-17

Inventor： Roger F. Bernards ,  Joseph Stanton Bowers JR. ,  Benjamin T. Carroll ,  Alvin A. Kucera

IPC: B05D003/10

CPC classification number: B32B38/00 ,  B32B2038/0052 ,  B32B2311/12 ,  B32B2457/08 ,  C23C22/52 ,  C23F1/18 ,  H05K3/282 ,  H05K3/383 ,  H05K3/385 ,  H05K3/389 ,  H05K2201/0239 ,  H05K2203/0796 ,  H05K2203/121 ,  H05K2203/124

Abstract: The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.