Abstract:
A network includes a combination of carrier-sense stations and Universal Multiple Access (UMA) stations using a time slot multiple access protocol. The network is configured to include assigned time slots for the respective UMA stations and unassigned time slots reserved for the carrier-sense stations to access the shared network media. Each of the UMA stations is provided with a corresponding assigned time slot and the total number of time slots. Since the UMA stations access the media only during the assigned time slot, the carrier-sense stations can contend for access to the media after waiting a minimum interpacket gap (IPG) after sensing deassertion of the receive carrier on the media. The UMA stations may also be modified to attempt access of the media using Ethernet-compliant, carrier-sense multiple-access with collision detection (CSMA/CD) protocol when a current time slot corresponds to a mixed-use time slot.
Abstract:
A communication system includes a SLIC device and a SLAC device. The SLIC device and the SLAC device cooperate to control the power level provided to a subscriber line. The SLAC device includes a digital control circuit which receives a parameter signal indicative of a first parameter of the electrical power. The digital control circuit provides a digital control signal to the SLIC device in response to a sample digital control signal and the digital parameter signal. Preferably, the digital parameter signal relates to a sensed current signal and the sample digital control signal relates to a desired voltage signal. The digital control circuit can be implemented hardware or software.
Abstract:
An isolation technique is provided for improving the overall planarity of a fill dielectric upper surface. The fill dielectric is one used in a shallow trench process, whereby the fill dielectric is deposited within shallow trenches used in isolating active devices formed in silicon mesas. The fill dielectric is planarized by selectively removing the fill dielectric prior to chemical-mechanical polish. The fill dielectric is removed in elevationally raised regions described as those which reside essentially above the silicon mesas. A mask material is used opposite that which forms the shallow trenches. The mask material protects the shallow trenches and exposes fill dielectric directly above the silicon mesas. The fill dielectric is removed using a dry isotropic etch process to remove as much of the elevationally raised fill dielectric as possible. Once the fill dielectric is selectively removed, CMP can be more optimally performed on the remaining upper surface to achieve a surface which is substantially planar across the entire semiconductor wafer.
Abstract:
A microcontroller is presented which includes a microcontroller core, an internal memory unit, an I/O pad interface unit, and several I/O pads, all formed on a single monolithic silicon substrate. The internal memory unit is configured to store data. A chip select unit within the microcontroller core generates a dedicated internal chip select (ICS#) signal which enables storage operations within the internal memory unit. Key operating parameters of the internal memory unit are stored in a single programmable internal memory chip select register (IMCSR) located within the chip select unit. The size of the internal memory unit is fixed, eliminating the need to store size information. The internal memory chip select register contains a base address field. The base address field includes a minimum number of the highest-ordered bits of a base address of the internal memory unit required to define which non-overlapping section of the physical address space the internal memory unit is mapped into. The method of accessing the internal memory unit allows backwards compatibility with existing microcontroller products. The microcontroller core also includes an execution unit and a bus interface unit. The execution unit executes microprocessor instructions, preferably instructions from an x86 instruction set. The bus interface unit handles all data transfer operations for the microcontroller core in accordance with established protocols. The I/O pad interface unit provides the microcontroller with off-chip data transfer capability, allowing the microprocessor to read data from or write data to external devices.
Abstract:
A microcontroller integrates a memory accessible by the cores included thereon. Additionally the microcontroller provides an indication upon an external bus that accesses to the integrated memory are occurring. The indication provides a ready identification of internal access cycles. In one embodiment, the indication is multiplexed with a control signal upon the external bus. The microcontroller further employs a show read bus transfer, which may be optionally enabled by the user. The show read bus transfer transmits upon the external bus the read data being provided from the internal memory to a core. The cycle is presented with identical functional timing to normal read cycles. Additionally, the A/C timings of the show read bus transfer are consistent with external read transfers. Therefore, external circuitry (such as an in-circuit emulator) may capture the data from the show read bus transfer using the same circuitry used to capture external read data. The show read bus transfer may be enabled by setting a configuration register bit within the microcontroller, or by asserting a signal upon a predefined pin at the conclusion of reset of the microcontroller. By providing the predefined pin for activating the show read mode of the microcontroller, the microcontroller may be placed into show read mode for debug purposes without changing the instruction code being executed thereon.
Abstract:
A selectively doped MOS transistor channel includes a deep impurity distribution and shallow impurity distribution. The deep impurity distribution is formed within high energy implant with an impurity of conductivity type opposite to the conductivity type of the source/drain regions of the transistor. In the n-channel regions, the deep impurity distribution preferably includes boron ions. The deep impurity distribution acts as a channel stop such that adjacent source/drain regions of the like type transistors are not inadvertently coupled during circuit operation. The shallow impurity distribution acts as a threshold implant by precisely controlling the doping of the transistor channel in the vicinity of the silicon oxide interface. The peak concentration of the shallow impurity distribution is located at a depth below the silicon surface which is greater than a depth typically associated with a thresold adjust implant. Because the impurity concentration of the shallow impurity distribution drops off rapidly from the peak concentration value, the concentration at the upper surface of the silicon substrate is not significantly greater than the doping of the silicon substrate itself. The light doping in the channel region of the transistor results in a substantially reduced threshold voltage for the transistor. Preferably, the threshold voltage of both the n-channel and p-channel devices has an absolute value of approximately 250 Mv. The lower threshold voltage translates into a higher IDsat when the transistor is operated under normal conditions (e.g., VGs = 3 volts, VDs = 3 volts, and VSb = 0 volts.)
Abstract:
The method for fabrication of a non-symmetrical IGFET of the present invention includes providing a semiconductor substrate having an insulating film and a gate material. A first portion of the gate material overlying a first region of the semiconductor substrate is removed forming a first sidewall of a gate electrode. A dopant is implanted into the first region after forming the first sidewall. After the first region is implanted, a second portion of the gate material overlying a second region of the semiconductor substrate is then removed forming a second sidewall of the gate electrode. A dopant is implanted into the second region after forming the second sidewall. Spacers are formed adjacent to each of the sidewalls of the gate electrode. Then, a dopant is implanted into portions of the first and second regions of the semiconductor substrate outside the gate electrode and the spacers. In one embodiment of the invention, the first region is a heavily doped source region and the second region is a lightly doped drain region. In another embodiment of the present invention the first region is a lightly doped drain region and the second region is a heavily doped source region. In both embodiments, a part of the lightly doped drain region is retained beneath a spacer.
Abstract:
A data memory unit having a load/store unit and a data cache is provided which allows store instructions that are part of a load-op-store instruction to be executed with one access to a data cache. The load/store unit is configured with a load/store buffer having a checked bit and a way field for each buffer storage location. For load-op-store instructions, the checked bit associated with the store portion of the instruction is set when the load portion of the instruction accesses and hits the data cache. Also, the way field associated with the store portion is set to the way of the data cache in which the load portion hits. The data cache is configured with a locking mechanism for each cache line stored in the data cache. When the load portion of a load-op-store instruction is executed, the associated line is locked such that the line will remain in the data cache until a store instruction executes. In this way, the store portion of the load-op-store instruction is guaranteed to hit the data cache. The store may then store its data into the data cache without first performing a read cycle to determine if the store address hits the data cache.
Abstract:
An update unit for an array in an integrated circuit is provided. The update unit delays the update of the array until a clock cycle in which the functional input to the array is idle. The input port normally used by the functional input is then used to perform the update. During clock cycles between receiving the update and storing the update into the array, the update unit compares the current functional input address to the update address. If the current functional input address matches the update address, then the update value is provided as the output of the array. Otherwise, the information stored in the indexed storage location is provided. In this manner, the update appears to have been performed in the clock cycle that the update value was received, as in a dual-ported array. A particular embodiment of the update unit is a branch prediction array update unit. This unit is described in detail.
Abstract:
A numeric processor system is provided with a floating point adder subsystem having a set of parallel dedicated numeric processors, each of the numeric processors comprising a plurality of calculation units operative in parallel on common operands to present candidate results, at least one of each of the dedicated numeric processors producing a correct result, the dedicated numeric processors reporting status information to a control unit, wherein the control unit determines which of the candidate results is the correct result for further processing. The numeric processor system according to the invention is capable of producing a final result on a floating point computation with very low latency, that is, with very few gate delays for a complete and independent computation. The numeric processor system according to the invention is particularly useful in a computation environment where successive floating point calculations are dependent. The invention is based on decomposing a normally serial algorithm into an extensive set of parallel candidate operations on different fragments of the operands, the operations being based on time-shortening assumptions, and then choosing the correct result after the operations rather than affecting the operands and modifying the calculation in series along a critical path as status information first becomes available.