Abstract:
A multi-axis magnetically actuated device, an array of multi-axis magnetically actuated devices, and a method of fabrication of a multi-axis magnetically actuated device are disclosed. In addition, disclosed is an optical switch comprised of an array of multi-axis magnetically actuated devices and an array of ports adapted to receive an optical waveguide such as, for example, an optical fiber. The multi-axis magnetically actuated device of the invention is capable of rotational movement in two orthogonal directions. In one embodiment, the multi-axis magnetically actuated device comprises two nested rotational members, an inner rotational member nested within an outer rotational member that in turn is nested within a base member. The inner rotational member is mounted by two inner torsional flexures to the outer rotational member that in turn is mounted by two outer torsional flexures to the base member. The inner torsional flexures define an inner axis of rotation while the outer torsional flexures define an outer axis of rotation. The rotational motions of each rotational member arise in response to an interaction between a magnetic influence and a magnetic moment generated by a current passing through coils arranged adjacent to a surface of the inner rotational member. Bulk micromachining techniques enable the members to be formed from a monolithic silicon wafer and can produce a member with a smooth surface. The smooth surface of a member may function as a reflector. In one embodiment, the inner rotational member functions as a reflector.
Abstract:
Micromechanical devices are provided that are capable of movement due to a flexible portion. The micromechanical device can have a flexible portion formed of a nitride of preferably an element from groups 3A to 6A of the periodic table (preferably from the first two rows of these groups) and a late transition metal (preferably from groups 8B or 1B of the periodic table). The micromechanical devices can be any device, particularly MEMS sensors or actuators preferably having a flexible portion such as an accelerometer, DC relay or RF switch, optical cross connect or optical switch, or a micromirror part of an array for direct view and projection displays. The flexible portion is preferably formed by sputtering a target having a group 8B or 1B element and a group 3A to 6A element. The target can have other major constituents or impurities (e.g. additional group 3A to 6A element(s)). The target is reactively sputtered in a nitrogen ambient so as to result in a sputtered hinge. It is possible to form both stiff and/or flexible portions of the micromechanical device in this way.
Abstract:
A microelectromechanical (MEM) apparatus is disclosed which has a platform that can be elevated above a substrate and tilted at an arbitrary angle using a plurality of flexible members which support the platform and control its movement. Each flexible member is further controlled by one or more MEM actuators which act to bend the flexible member. The MEM actuators can be electrostatic comb actuators or vertical zip actuators, or a combination thereof. The MEM apparatus can include a mirror coating to form a programmable mirror for redirecting or switching one or more light beams for use in a projection display. The MEM apparatus with the mirror coating also has applications for switching light beams between optical fibers for use in a local area fiber optic network, or for use in fiber optic telecommunications or data communications systems.
Abstract:
An optical switch device includes a rolling shutter or membrane attached at one of its edges to a substrate near an optical port in the substrate. The rolling shutter can assume one of two states. In a first closed state, the membrane is uncoiled onto the substrate over the port such that light directed at the port impinges on the shutter. In a second open state, the membrane is rolled up away from the port such that light directed at the port impinges on the port. In one embodiment, a mirror is formed on the membrane such that when the membrane is in the closed state over the substrate, light directed at the port is reflected by the mirror. In one configuration, the optical port includes a hole or aperture such light passed through the port without interference. The device can include a latch electrode the far end of the membrane such that when it is rolled out, it can be held in position by a latching voltage applied across the latch electrode and the substrate. Slits can be formed in the membrane to keep the mirror flat by relieving strain in the membrane and to allow gases in proximity to the device to pass through the membrane as it is activated. The shutter can include dimples to minimize the area of contact between the membrane and the substrate to reduce the probability of the two sticking together. The attachment edge of the membrane can be made shorter than its width to reduce distortions in the membrane to keep the mirror flat. A raised annular rim can be provided around the port such that when the shutter is held down over the port it is pulled taut and flat over the rim. This feature is also used to maintain flatness in the mirror. The switch device can be used as part of an array of optical switches.
Abstract:
The MEMS device has a suspended mass (31) supported via a pair of articulation arms (32) by a supporting region (33). An electrostatic driving system (36), coupled to the articulation arms (32), has mobile electrodes (38) and fixed electrodes (39) that are coupled to each other. The electrostatic driving system is formed by two pairs of actuation assemblies (36), arranged on opposite sides of a respective articulation arm (32) and connected to the articulation arm through connection elements (30). Each actuation assembly (36) extends laterally to the suspended mass (31) and has an auxiliary arm (37) carrying a respective plurality of mobile electrodes (38). Each auxiliary arm is parallel to the articulation arms (32). The connection elements (30) may be rigid or formed by linkages.
Abstract:
A cut (76) which penetrates a resin layer (50) is formed in the resin layer (50) such that the cut (76) surrounds a third upper surface (68). A film (52) is formed such that the film (52) covers the whole resin layer (50) except for a bottom surface of the resin layer (50) inside the cut (76) and at least a portion of the resin layer (50) is exposed outside the cut (76). The resin layer (50) which is wholly covered with the film (52) is left inside the cut (76), and the whole resin layer (50) continuously formed with a surface exposed from the film (52) is removed outside the cut (76) . A bump (48) is formed by the resin layer (50) and the film (52) inside the cut (76), and a shutter (14) and at least a portion of a drive part (40) are formed by the film (52) outside the cut (76) in a state where these parts are floated from a first substrate (10).
Abstract:
Mirror device comprising a mirror which is supported to be pivotable with respect to a mirror substrate, a driving electrode which is formed on an electrode substrate facing said mirror substrate, an interconnection which is formed on said electrode substrate to supply a driving voltage to said driving electrode, and a conductive member which is equipotential to said mirror and arranged at a position closer to said interconnection than said mirror.
Abstract:
A MEMS device and fabrication method are disclosed. A bottom substrate having an insulating layer sandwiched between an upper layer and a lower layer may be bonded to a device layer. One or more portions of the upper layer may be selectively removed to form one or more device cavities. Conductive vias may be formed through the lower layer at locations that underlie the one or more device cavities and electrically isolated from the lower layer. Devices may be formed from the device layer. Each device overlies a corresponding device cavity. Each device may be connected to the rest of the device layer by one or more corresponding hinges formed from the device layer. One or more electrical contacts may be formed on a back side of the lower layer. Each contact is electrically connected to a corresponding conductive via.