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公开(公告)号：JP2005166858A
公开(公告)日：2005-06-23
申请号：JP2003402435
申请日：2003-12-02
Applicant: Minowa Koa Inc , 箕輪興亜株式会社
Inventor： ASAUMI YASUHIRO , TERAOKA HIDEYUKI
Abstract: PROBLEM TO BE SOLVED: To suppress the solder erosion of a material for an electrode 2 and a bonding material, and to improve the efficiency of a module manufacturing process in a method for manufacturing a thermoelement module 10.
SOLUTION: In this method for manufacturing a thermoelement module 10, one of the surfaces of an individual thermoelement 3 and a Cu-containing electrode 2 on one of the surfaces of a first substrate 1a, and the other surface of the individual thermoelement 3 and an Cu-containing electrode 2 on one of the surfaces of a second substrate 1b, are bonded together by using a bonding material whose main component is indium 4. A lamellar, fragmentary, or columnar bonding material having a thickness of ≥50 μm and the surface of the individual thermoelement 3 are successively arranged at room temperature on the electrode 2 on the first substrate 1a, and then a pressure is applied onto the other surface of the first substrate 1a and the other surface of the individual thermoelement 3 at a temperature not lower than the melting point of the bonding material.
COPYRIGHT: (C)2005,JPO&NCIPIAbstract translation: 要解决的问题：为了抑制用于电极2和接合材料的材料的焊料侵蚀，并且提高制造热电元件模块10的方法中的模块制造工艺的效率。解决方案： 在这种制造热电元件模块10的方法中，在第一基板1a的一个表面上的单个热电元件3和含Cu电极2的表面之一和各个热电元件3的另一个表面和Cu- 通过使用主成分为铟4的接合材料将第二基板1b的一个表面上的含电极2接合在一起。厚度≥50μm的层状，片状或柱状接合材料， 单独的热电偶3在室温下依次排列在第一基板1a上的电极2上，然后将压力施加到第一基板1a的另一个表面上，并将ind 在不低于接合材料的熔点的温度下的单个热电偶3。 版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JP2005150580A
公开(公告)日：2005-06-09
申请号：JP2003388838
申请日：2003-11-19
Applicant: Minowa Koa Inc , 箕輪興亜株式会社
Inventor： AMAMIYA HITOSHI , FUJIMOTO KOJI
IPC: H01C17/22
Abstract: PROBLEM TO BE SOLVED: To enable trimming even to a miniaturized resistance element 5 while practically measuring four terminals. SOLUTION: In the trimming method of the resistance element 5, a resistor 2 and an electrode 1 are arranged alternately and the resistance value is adjusted while practically measuring the resistance value by using a probe unit 7 to a group of resistance elements continued in a series connection state. A probe pin 3 for energization of the probe unit 7 is brought into contact with the electrode 1 positioned in both ends of the resistance element group, a probe pin 4 for voltage measurement of the probe unit 7 is brought into contact with each of all the electrodes 1 of the resistance element group, a terminal-to-terminal voltage (V) of each resistance element 5 is measured while making a constant current (I) flow by the probe pin 3 between the electrodes 1 positioned in both ends of the resistance element group and a trimming means is implemented to each resistor 2 and/or the electrode 1 so that V is a prescribed value. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract translation: 要解决的问题：在实际测量四个端子的同时，能够均匀地修整到小型化的电阻元件5。 解决方案：在电阻元件5的修整方法中，交替地布置电阻器2和电极1，并且通过使用探针单元7实际测量电阻值至一组电阻元件，来调节电阻值 处于串联状态。 用于使探针单元7通电的探针3与位于电阻元件组两端的电极1接触，用于探针单元7的电压测量的探针4与所有的 电阻元件组的电极1，每个电阻元件5的端子间电压（V）被测量，同时通过探针3在位于电阻两端的电极1之间流动恒定电流 元件组和修整装置被实施到每个电阻器2和/或电极1，使得V是规定值。 版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JP3601705B2
公开(公告)日：2004-12-15
申请号：JP2001244669
申请日：2001-08-10
Applicant: 箕輪興亜株式会社
IPC: H01L23/50
CPC classification number: H01L2924/0002 , H01L2924/00
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公开(公告)号：JP3885965B2
公开(公告)日：2007-02-28
申请号：JP2003507856
申请日：2002-03-25
Applicant: 箕輪興亜株式会社
Inventor： 永司 小林
CPC classification number: H01G2/065 , H01C1/01 , H05K3/3442 , H05K2201/09181 , H05K2201/09781 , H05K2201/10045 , Y02P70/613
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Patent Agency Ranking26.发明专利
公开(公告)号：JP2006261144A
公开(公告)日：2006-09-28
申请号：JP2005072157
申请日：2005-03-15
Applicant: Minowa Koa Inc , 箕輪興亜株式会社
Inventor： NAKAMORI TAKEFUMI
IPC: H01C17/00
Abstract: PROBLEM TO BE SOLVED: To enable four-terminal measurement in the measurement of a resistor 6 having conductive protrusions 4 disposed in matrix in a method of manufacturing a resistor in which a plurality of resistive elements 2 are formed on a substrate 11 and the resistive elements 2 having external elements being the conductive protrusions 4. SOLUTION: A method of manufacturing a resistor has a process of measuring a resistive value. In the measuring process probe electrodes 1 abut on the conductive protrusions 4 to measure resistive values of the resistive elements 2 formed between paired conductive protrusions 4. The probe electrode 1 abutting on each of the conductive protrusions 4 is composed of a current electrode 1a for applying a current between the resistive elements 2 and a voltage electrode 1b for measuring a voltage between the resistive elements. Each of the conductive protrusions 4 is inserted between the electrodes 1a and 1b, and abuts on them. In this way, four-terminal measurement can be performed. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题：在制造其中在基板11上形成多个电阻元件2的电阻器的方法中，在测量具有导电突起4的矩阵形式的电阻器6的测量中，实现四端测量，以及 具有外部元件的电阻元件2是导电突起4.解决方案：制造电阻器的方法具有测量电阻值的过程。 在测量过程中，探针电极1邻接在导电突起4上，以测量形成在一对导电突起4之间的电阻元件2的电阻值。邻接在每个导电突起4上的探针电极1由用于施加的电流电极1a 电阻元件2之间的电流和用于测量电阻元件之间的电压的电压电极1b。 每个导电突起4插入在电极1a和1b之间并与它们抵接。 以这种方式，可以进行四端测量。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2006228853A
公开(公告)日：2006-08-31
申请号：JP2005038716
申请日：2005-02-16
Applicant: Minowa Koa Inc , 箕輪興亜株式会社
Inventor： NAKAMORI TAKEFUMI
Abstract: PROBLEM TO BE SOLVED: To allow four-terminal measurement when measuring a resistor 6 comprising conductive projections 4 ion arranged in matrix. SOLUTION: The manufacturing method of a resistor includes a measurement process for the resistance value. The measurement process is a process for measuring a resistance value of a resistance element formed between a pair of conductive projections 4 by making the conductive projection 4 abut with a conductive pad 1. The conductive pads 1 are distributed with which one conductive projection 4 abuts, in two or more, so as to comprise a pad for energizing a current between resistance elements and a pad for measuring a voltage between the resistance elements, ensuring four-terminal measurement. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题：当测量包括以矩阵排列的导电突起4离子的电阻器6时，允许四端测量。 解决方案：电阻器的制造方法包括电阻值的测量处理。 测量处理是通过使导电突起4与导电焊盘1邻接来测量形成在一对导电突起4之间的电阻元件的电阻值的过程。导电焊盘1与一个导电突起4邻接， 在两个或更多个中，以包括用于激励电阻元件之间的电流的焊盘和用于测量电阻元件之间的电压的焊盘，确保四端测量。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2006060126A
公开(公告)日：2006-03-02
申请号：JP2004242260
申请日：2004-08-23
Applicant: Minowa Koa Inc , 箕輪興亜株式会社
Inventor： YAMAURA SHUICHI , HAYASHI ATSUNORI
IPC: H01C17/28
Abstract: PROBLEM TO BE SOLVED: To reduce difficulty in a case of welding a copper plate 6 with a resistor 2 by using a seam welding method, in a manufacturing method for a resistor which has a process wherein seam welding of the respective facing both ends of the resistor 2 and an electrode 1 constituted of the copper plate 6 is performed.
SOLUTION: Before seam welding, the surface of the electrode 1 is previously covered with material 3 whose resistivity is higher than that of the electrode 1 material, and the covered part is made a welding part. It is desirable that material 3 whose resistivity is higher than that of the electrode 1 material is tin 3 or solder. The resistor applied in the manufacturing method suitably is e.g. a low resistor for current sensing.
COPYRIGHT: (C)2006,JPO&NCIPIAbstract translation: 要解决的问题为了减少在利用缝焊法用电阻器2焊接铜板6的情况下的困难，在具有这样的方法的电阻器的制造方法中，所述电阻器的制造方法中， 执行电阻器2的端部和由铜板6构成的电极1。 解决方案：在缝焊之前，电极1的表面预先用电阻率高于电极1材料的材料3覆盖，并且覆盖部分被制成焊接部分。 期望电阻率高于电极1材料的材料3是锡3或焊料。 在制造方法中适用的电阻器是例如。 用于电流检测的低电阻。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2005324407A
公开(公告)日：2005-11-24
申请号：JP2004143712
申请日：2004-05-13
Applicant: Minowa Koa Inc , 箕輪興亜株式会社
Inventor： ISUZUGAWA YUKO , TAKAYAMA TOSHIJI
Abstract: PROBLEM TO BE SOLVED: To provide a thermal head whereby the thermal head can be attached to a device having a thermal head used therein without utilizing a holder made of a resin.
SOLUTION: This thermal head is equipped with a single substrate 1 having a heating region 13 and a device-attachment region 14. The heating region 13 is disposed at one end of the substrate 1 and an energizing terminal 8 for the heating region 13 is disposed at the other end thereof. A heating device is used such that the end of the substrate 1 on the heating region 13 formed on the surface of the substrate 1 of the thermal head is brought in close proximity to or into contact with a heat receptive member 18.
COPYRIGHT: (C)2006,JPO&NCIPIAbstract translation: 要解决的问题：提供一种热敏头，其中热头可以附接到其中使用的热敏头的设备，而不使用由树脂制成的保持器。 解决方案：该热敏头装备有具有加热区域13和装置附着区域14的单个基板1.加热区域13设置在基板1的一端和用于加热区域的激励端子8 13设置在其另一端。 使用加热装置使得形成在热敏头的基板1的表面上的加热区域13上的基板1的端部与热接收构件18紧密接触或接触。
COPYRIGHT （C）2006，JPO＆NCIPI
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公开(公告)号：JP2005072624A
公开(公告)日：2005-03-17
申请号：JP2004355105
申请日：2004-12-08
Applicant: Minowa Koa Inc , 箕輪興亜株式会社
Inventor： TERAOKA HIDEYUKI , TAKAYAMA TOSHIJI , SUZUKI RYUSUKE
Abstract: PROBLEM TO BE SOLVED: To maintain sufficient strength with which a land 2 and a conductive ball 3 are fixed, and to ensure the fixation of the conductive ball 3 with the land 2 in an electric component that comprises: a circuit element on one surface of an insulation substrate 1 that constitutes an electric component; the land 2 for connecting a terminal that constitutes the circuit element; and the conductive ball 3 that is connected to the land 2.
SOLUTION: The land 2 for connecting terminals and the terminals comprising the conductive ball 3 are fixed by a conductive resin 4, wherein the conductive ball 3 is formed of Cu of which the surface is coated with solder. The solder preferably comprises Su alone.
COPYRIGHT: (C)2005,JPO&NCIPIAbstract translation: 要解决的问题：为了保持足够的强度，焊盘2和导电球3固定在该强度上，并且确保导电球3与焊盘2固定在电气部件中，该电气部件包括：电路元件 构成电气部件的绝缘基板1的一个面; 用于连接构成电路元件的端子的焊盘2; 以及连接到焊盘2的导电球3.解决方案：用于连接端子的焊盘2和包括导电球3的端子由导电树脂4固定，其中导电球3由Cu 其表面涂有焊料。 焊料优选仅包含Su。 版权所有（C）2005，JPO＆NCIPI
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