21.
    发明专利
    未知

    公开(公告)号:DE602004002318T8

    公开(公告)日:2007-07-26

    申请号:DE602004002318

    申请日:2004-05-18

    Applicant: JSP CORP

    Abstract: An in-mold foam molding equipment, includes at least a movable partition member (1) for dividing a molding space (13) formed by a pair of molds into divided spaces, wherein the partition member is composed of a plurality of divisional partition members (2), wherein each of the divisional partition members individually has a retreat positioning protrusion (5) and a insert positioning protrusion (4), and the divisional partition members are installed in a slider (3), wherein the slider is configured to move between the retreat positioning protrusions (5) and the insert positioning protrusions (4), and the divisional partition members (2) are configured to be movable in cooperation with the motion of the slider moving by contacting with the retreat positioning protrusions (5) or the insert positioning protrusions (4), so that the divisional partition members (2) divide the molding space into divided spaces, and therefore an integral molded article suppressed in occurrence of large protrusions and deep holes can be manufactured.

    24.
    发明专利
    未知

    公开(公告)号:DE60115485T2

    公开(公告)日:2006-07-27

    申请号:DE60115485

    申请日:2001-09-20

    Applicant: JSP CORP

    Abstract: Expanded, substantially non-crosslinked polypropylene resin beads capable of producing a high rididity foamed molding at a relatively low temperature. The beads are produced by a process including a step of dispersing substantially non-crosslinked polypropylene resin particles in a dispersing medium containing an organic peroxide to obtain a dispersion, a step of heating the dispersion to decompose the organic peroxide and to modify the surface of the surface-modified polypropylene resin particles, and a step of expanding the non-crosslinked, surface-modified polypropylene resin particles using a blowing agent.

    25.
    发明专利
    未知

    公开(公告)号:DE60023409T2

    公开(公告)日:2006-07-27

    申请号:DE60023409

    申请日:2000-08-03

    Applicant: JSP CORP

    Abstract: Disclosed herein is a multi-layer expansion-molded article (1) of a polypropylene resin, which is obtained by molding a multi-layer parison comprising a foamed resin layer (12) and a resin layer (13) provided on the outer side of the foamed resin layer (12) in a mold in such manner that at least part of the opposed inner surfaces of foamed resin layer in the parison are fusion-bonded to each other, and has a polypropylene resin layer (13) on the surface of a foamed polypropylene resin layer (12), wherein a melt tension, MT (gf) and a melt flow rate, MFR (g/10 min) obtained by measurement to a polypropylene resin forming the foamed resin layer (12) in the expansion-molded article satisfy the following relationship (1), and a melt tension, MT (gf) and a melt flow rate, MFR (g/10 min) obtained by measurement to a polypropylene resin forming the resin layer (13) on the surface of the foamed resin layer (12) satisfy the following relationship (2) when the melt flow rate, MFR is at least 0.3 (g/10 min), or the melt tension, MT is at least 10 (gf) when the melt flow rate, MFR is not lower than 0.2 (g/10 min), but lower than 0.3 (g/10 min): log MT > -0.74 log MFR + 0.66 log MT > -1.02 log MFR + 0.47

    26.
    发明专利
    未知

    公开(公告)号:DE69827294T2

    公开(公告)日:2006-03-09

    申请号:DE69827294

    申请日:1998-12-01

    Applicant: JSP CORP

    Abstract: The present invention relates to expanded polypropylene resin beads which comprise, as a base resin, a random copolymer obtained by copolymerizing propylene and one, or two or more in admixture of comonomers selected from ethylene and alpha -olefins having four or more carbon atoms by use of a metallocene polymerization catalyst, wherein said base resin is mainly composed of an isotactic polypropylene resin having a melting point exceeding 140 DEG C and a melt flow rate of 12 g/10 minutes or below. As the base resin, there is preferably used, for example, a random copolymer of propylene and ethylene. In the invention, the expanded beads are filled in a mold, and heating the expanded beads with steam to cause expansion of the beads until the beads are mutually fused together thereby producing a molded article having a shape of the mold.

    27.
    发明专利
    未知

    公开(公告)号:DE60115485D1

    公开(公告)日:2006-01-05

    申请号:DE60115485

    申请日:2001-09-20

    Applicant: JSP CORP

    Abstract: Expanded, substantially non-crosslinked polypropylene resin beads capable of producing a high rididity foamed molding at a relatively low temperature. The beads are produced by a process including a step of dispersing substantially non-crosslinked polypropylene resin particles in a dispersing medium containing an organic peroxide to obtain a dispersion, a step of heating the dispersion to decompose the organic peroxide and to modify the surface of the surface-modified polypropylene resin particles, and a step of expanding the non-crosslinked, surface-modified polypropylene resin particles using a blowing agent.

    28.
    发明专利
    未知

    公开(公告)号:DE60021476D1

    公开(公告)日:2005-09-01

    申请号:DE60021476

    申请日:2000-05-31

    Applicant: JSP CORP

    Abstract: A composition for film formation which is useful as an interlayer insulating film material in the production of semiconductor devices and the like, and gives a coating film having excellent uniformity, low dielectric constant, low leakage current and excellent storage stability; and a material for insulating film formation using the composition. The composition comprises (A) a product of hydrolysis and condensation obtained by hydrolyzing and condensing at least one compound selected from the group consisting of (A-1) compounds represented by the formula (1): R aSi(OR )4-a, and (A-2) compounds represented by the formula (2): R b(R O)3-bSi-(R )d-Si(OR )3-cR c; and (B) a compound represented by the formula (3): R O(CHCH3CH2O)eR .

    COMPOSITE FOAMED POLYPROPYLENE RESIN MOLDING AND METHOD OF PRODUCING SAME

    公开(公告)号:CA2479139A1

    公开(公告)日:2003-09-25

    申请号:CA2479139

    申请日:2003-03-19

    Applicant: JSP CORP

    Abstract: A composite foamed polypropylene resin molding including a pluralit y of sections which are fuse-bonded to each other, at least two of which diffe r from each other in color, apparent density, composition and/or mechanical strengths, each of which is formed from expanded polypropylene resin beads, and each of which shows a high temperature endothermic peak in a DSC curve thereof. At least one of the sections satisfies conditions (d) to (f) at the same time: (d) to be formed from specific expanded polypropylene resin beads of a base resin having a tensile modulus of at least 1,200 MPa, (e) to have an apparent density D2 of 10-500 g/L, and (f) to have such a high temperature endothermic peak with a calorific of E2 J/g, wherein D2 and E2 have the relationship 20 - 0.020 X D2

    30.
    发明专利
    未知

    公开(公告)号:DE60000106T2

    公开(公告)日:2002-11-21

    申请号:DE60000106

    申请日:2000-05-26

    Applicant: JSP CORP

    Abstract: Disclosed herein is a skin-bearing expansion-molded article of a thermoplastic resin, which is formed by holding a cylindrical multi-layer foamed parison comprising a foamed thermoplastic resin layer and thermoplastic polymer layers situated on both outer and inner sides of the foamed layer in a mold to compression-mold it, wherein the molded article has a skin formed of the outer-side polymer layer of the multi-layer foamed parison on the surface thereof, and on the inner side of the skin, a core formed by fusion-bonding at least a part of the inner-side polymer layer of the multi-layer foamed parison to each other and a foam formed of the foamed layer of the multi-layer foamed parison.

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