公开(公告)号：EP1860737A2

公开(公告)日：2007-11-28

申请号：EP07107466.0

申请日：2007-05-03

Applicant: M/A-COM, INC.

Inventor： Cushion, Paul Arthur

IPC: H01R9/05

CPC classification number: H01R9/0515 ,  H01R4/027 ,  H01R43/0256 ,  H01R43/16

Abstract: A clamp (10) for securing a cable (30) to a base plate (28) includes a base (12) with at least one upwardly extending arm (14), and a cable securing portion (16) at the end of the arm. The arm (14) of the clamp may be secured within a slot (26) defined within the base plate (28). The cable securing portions (16) may be crimped around a cable. The entire assembly may be soldered with a single soldering step.

Abstract translation: 用于将电缆（30）固定到基板（28）的夹具（10）包括具有至少一个向上延伸的臂（14）的基部（12）和在臂的端部处的电缆固定部分（16） 。 夹具的臂（14）可以固定在限定在基板（28）内的槽（26）内。 电缆固定部分（16）可以围绕电缆卷曲。 整个组件可以用单个焊接步骤焊接。

公开(公告)号：EP1777773A1

公开(公告)日：2007-04-25

申请号：EP06122608.0

申请日：2006-10-19

Applicant: M/A-COM, INC.

Inventor： Schwab, Paul John ,  Pance, Kristi Dhimiter ,  Craig, Neil James

IPC: H01P1/202 ,  H01P1/205 ,  H01P7/10

CPC classification number: H01P7/10 ,  H01P1/2053 ,  H01P1/2084

Abstract: In order to permit electronic tuning of the frequency of a circuit including dielectric resonators (309), such as a dielectric resonator filter, tuning elements (300) are employed adjacent the individual dielectric resonators. The tuning element (300) comprises two separate conductive portions (304, 306) and an electronically tunable circuit (310) electrically coupled therebetween. The electronically tunable circuit (310) can be any electronic component that will permit changing the capacitance between the two separate conductive portions of the tuning plates by altering the current or voltage supplied to the electronically tunable circuit (310), Such component may comprise any two or three terminal semiconductor device. However, preferably the device comprises a varactor diode or a PIN diode.

公开(公告)号：EP1746710A2

公开(公告)日：2007-01-24

申请号：EP06117560.0

申请日：2006-07-20

Applicant: M/A-COM, INC.

Inventor： Abbasi, Saeed ,  Fang, Yi

IPC: H02M3/07

CPC classification number: H02M3/07 ,  H03L7/0895 ,  H03L7/0896 ,  H03L7/107 ,  H03L7/1072

Abstract: Apparatus, system, and method including a single common node bias voltage (316); at least a first current path (310) to drive a bias current based on the single common node bias voltage (316); at least a first current mirror to mirror the bias current in a second current path (320); and an output current path (350) comprising current drivers to drive source and sink currents that are matched to the bias current. The first current mirror may include at least one partial cascode current mirror. The apparatus and system provide a single common node bias voltage (316) to generate a bias current; mirror the bias current in at least one current path; and output well-matched output source and sink currents based on the bias current.

Abstract translation: 包括单个公共节点偏置电压（316）的装置，系统和方法; 至少第一电流路径（310），用于基于所述单个公共节点偏置电压（316）驱动偏置电流; 至少第一电流镜以在第二电流路径（320）中镜像偏置电流; 以及包括用于驱动与偏置电流匹配的源极和吸收电流的电流驱动器的输出电流路径（350）。 第一电流镜可以包括至少一个部分共源共栅电流镜。 该装置和系统提供单个公共节点偏置电压（316）以产生偏置电流; 在至少一个电流路径中镜像偏置电流; 并基于偏置电流输出良好匹配的输出源和吸收电流。

公开(公告)号：EP1617602A3

公开(公告)日：2006-12-27

申请号：EP05106541.5

申请日：2005-07-15

Applicant: M/A-COM, INC.

Inventor： DiPiazza, Gerald Charles

IPC: H04L12/28 ,  G08G1/0967 ,  G08G1/01

CPC classification number: G08G1/01 ,  G08G1/0104 ,  G08G1/0962 ,  G08G1/096716 ,  G08G1/096758 ,  G08G1/096783 ,  G08G1/096791 ,  G08G1/164

Abstract: A wireless traffic control system (10) and method for wirelessly communicating information using traffic control signs (12, 14) are provided. The method includes wirelessly transmitting at least one of traffic control information and vehicle information from a traffic control sign (12) and wirelessly receiving the information transmitted from the traffic control sign (12) by at least one other traffic control sign (14).

Abstract translation: 提供了一种使用交通控制标志（12,14）无线通信信息的无线交通控制系统（10）和方法。 该方法包括从交通控制标志（12）无线地发送交通控制信息和交通工具信息中的至少一个，并且通过至少一个其他交通控制标志（14）无线地接收从交通控制标志（12）发送的信息。

公开(公告)号：EP1343221B1

公开(公告)日：2006-09-13

申请号：EP03251285.7

申请日：2003-03-04

Applicant: M/A-COM, INC.

Inventor： Jordan, David Frederick

IPC: H01Q1/12 ,  H01Q1/32

CPC classification number: H01Q1/32 ,  H01Q1/1271

公开(公告)号：EP1678819A1

公开(公告)日：2006-07-12

申请号：EP04794556.3

申请日：2004-10-08

Applicant: M/A-COM, INC.

Inventor： GRESHAM, Robert, Ian ,  WOHLERT, Ratana ,  JENKINS, Alan

IPC: H03F1/26 ,  H03F3/189 ,  H03F3/19

CPC classification number: H03F1/26 ,  H03F3/189 ,  H03F3/19 ,  H03F2200/294 ,  H03F2200/372

Abstract: A multi-stage amplifier including a first amplifier stage including a first transistor, the first transistor selected to provide an optimum noise characteristic, and a second amplifier stage including a second transistor, the second transistor selected to provide an optimum gain characteristic.

公开(公告)号：EP1675178A2

公开(公告)日：2006-06-28

申请号：EP05111431.2

申请日：2005-11-29

Applicant: M/A-COM, INC.

Inventor： Channabasappa, Eswarappa ,  Anderson, Richard Alan

IPC: H01L23/66 ,  H01L23/495

CPC classification number: H01L23/49503 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/0206 ,  H05K1/0219 ,  H05K1/0243 ,  H05K2201/10727 ,  H05K2201/10969 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A connection arrangement for a micro lead frame plastic (MLP) package (20) is provided that includes a paddle (28) configured to be connected to a circuit board (24) and a first ground pad (26) and a second ground pad (26) each connected to the paddle (28). The first and second ground pads (26, 26) together with the paddle (28) are configured to provide continuity of ground between the circuit board (24) and a chip (40) mounted to the paddle (28).

Abstract translation: 提供了一种用于微引线框塑料（MLP）封装（20）的连接装置，其包括构造成连接到电路板（24）和第一接地焊盘（26）和第二接地焊盘（24）的焊盘（28） 26），每个连接到桨叶（28）。 第一和第二接地焊盘（26,26）与桨叶（28）一起构造成在电路板（24）和安装到桨叶（28）的芯片（40）之间提供接地连续性。

公开(公告)号：EP1672781A1

公开(公告)日：2006-06-21

申请号：EP05112265.3

申请日：2005-12-15

Applicant: M/A-COM, INC.

Inventor： Douglas, Dale Scott

IPC: H03F1/02 ,  H03F3/60 ,  H03F3/72

CPC classification number: H03F3/72 ,  H03F1/0277 ,  H03F3/602

Abstract: An amplifier circuit includes a calibration circuit (300) with a controllable circuit element such as a digital resistor (310). One or more properties of the controllable circuit element (e.g., the resistance in a digital resistor (310)) is varied by a digital calibration word such that the voltage drop across the resistor (310) matches a reference voltage. The calibration word is also used to control the resistance of a transistor (420) that forms a part of a power amplifier to compensate for temperature and process variations. The amplifier may be a switching power amplifier, and the transistor may be a segmented transistor (420a-d) with the width (and hence the channel resistance) controlled by the digital calibration word.

Abstract translation: 一种放大器电路，包括：具有可控电路元件的校准电路（300）：诸如数字电阻器（310）。 可控电路元件（例如，在数字电阻器（310）的电阻）由数字校准字搜索变化的一个或多个属性做跨电阻器（310）上的电压降的参考电压相匹配。 因此，该校准字用于控制晶体管的（420）的电阻没有形式的功率放大器的一部分，以补偿温度和工艺变化。 所述放大器可以是开关功率放大器，并且晶体管可以是分段的晶体管（420A-D）与由数字校准控制字的宽度（和因此的沟道电阻）。

公开(公告)号：EP1605508A2

公开(公告)日：2005-12-14

申请号：EP05104934.4

申请日：2005-06-07

Applicant: M/A-COM, INC.

Inventor： Brogle, James Joseph ,  Boles, Timothy Edward ,  Goodrich, Joel Lee

IPC: H01L27/02 ,  H01L27/08

CPC classification number: H01L27/0248 ,  H01L27/0814 ,  H01L2224/16 ,  H01L2924/12032 ,  H01L2924/1301 ,  H01L2924/00

Abstract: A chip-scale package (100) and method of manufacturing a chip-scale package are provided. The chip-scale package includes a mounting portion defined by a plurality of metal layers formed on each of a plurality of semiconductor regions (108) for mounting a device thereto. The mounting portions (104 and 106) are formed on a first side of the plurality of semiconductor regions. The chip-scale package (100) further includes a backside metal surface (110) formed on each of a second side of the plurality of semiconductor regions (108), with the plurality of semiconductor regions (108) providing electrical connection between the mounting portions (104 and 106) and the backside metal surfaces (110).

Abstract translation: 提供了芯片级封装（100）和芯片级封装的制造方法。 芯片级封装包括由多个金属层限定的安装部分，多个金属层形成在多个半导体区域（108）中的每一个上，用于将器件安装到其上。 安装部分（104和106）形成在多个半导体区域的第一侧上。 芯片级封装（100）还包括形成在多个半导体区域（108）的第二侧中的每一个上的背面金属表面（110），多个半导体区域（108）提供安装部分 （104和106）和背面金属表面（110）。

公开(公告)号：EP1573916A2

公开(公告)日：2005-09-14

申请号：EP03814173.5

申请日：2003-12-17

Applicant: M/A-COM, INC.

Inventor： KELCOURSE, Mark, Francis ,  BRINDLE, Christopher, Nelles

IPC: H03K17/00 ,  H03K17/693

CPC classification number: H04B1/0057 ,  H01P1/15 ,  H03K17/693 ,  H04B1/006 ,  H04B1/406

Abstract: The invention is directed to a multi-band switch having a transmitter switching section with a plurality of transmission ports (Tx1, Tx2), and a receiver switching section with a plurality of receiver ports (Rx1-Rx4), each having associated switching topologies to switch one of the ports to an antenna port. The switching topologies may use a plurality of series-connected FETs, such as insulated gate n-channel FETs, where the transmitter port switching elements may have larger switching transistors than the receiver port switching elements. The main signal path transistors of the transmitter and receiver switching elements be interdigitated FETs, in which source region fingers and drain region fingers alternate within the transistor area. These interdigitated source and drain regions may be spaced apart from each other by a sinuous channel region, over which is a gate metallization.