公开(公告)号：WO2005059930A2

公开(公告)日：2005-06-30

申请号：PCT/US2004/041758

申请日：2004-12-14

Applicant: MOTOROLA, INC. ,  CROSWELL, Robert T. ,  DUNN, Gregory J. ,  LEMPKOWSKI, Robert B. ,  TUNGARE, Aroon V. ,  SAVIC, Jovica

Inventor： CROSWELL, Robert T. ,  DUNN, Gregory J. ,  LEMPKOWSKI, Robert B. ,  TUNGARE, Aroon V. ,  SAVIC, Jovica

IPC: H01G

CPC classification number: H05K1/162 ,  H05K3/0029 ,  H05K3/025 ,  H05K3/384 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09718

Abstract: One of a plurality of capacitors embedded in a printed circuit structure includes a first electrode (415) overlaying a first substrate layer (505) of the printed circuit structure, a crystallized dielectric oxide core (405) overlaying the first electrode, a second electrode (615) overlying the crystallized dielectric oxide core, and a high temperature anti-oxidant layer (220) disposed between and contacting the crystallized dielectric oxide core and at least one of the first and second electrodes. The crystallized dielectric oxide core has a thickness that is less than 1 micron and has a capacitance density greater than 1000 pF/mm 2 . The material and thickness are the same for each of the plurality of capacitors. The crystallized dielectric oxide core may be isolated from crystallized dielectric oxide cores of all other capacitors of the plurality of capacitors.

Abstract translation: 嵌入印刷电路结构中的多个电容器之一包括覆盖印刷电路结构的第一衬底层（505）的第一电极（415），覆盖第一电极的结晶化电介质氧化物芯（405），第二电极 615），以及设置在结晶的电介质氧化物芯和第一和第二电极中的至少一个之间并与其接触的高温抗氧化剂层（220）。 结晶的电介质氧化物芯的厚度小于1微米，电容密度大于1000pF / mm 2。 多个电容器的材料和厚度相同。 结晶的电介质氧化物芯可以与多个电容器的所有其它电容器的结晶的电介质氧化物芯隔离。